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Jianyun Hu

dblp:01/2093 · DBLP profile ↗
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4ranked-venue papers
0as first author
0since 2021 · last 2012
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 4Software engineering, systems software and programming languages · 3Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
3 papers
Interconnection networks and networks-on-chip · 88% Processor architecture and microarchitecture · 9% Integrated circuit design · 4%

Topics — the 7 heaviest of 7, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Interconnection networks and networks-on-chip
on-chip interconnect
0.322012
Enhancing effective throughput for transmission line-based bus · ISCA 2012
A case for globally shared-medium on-chip interconnect · ISCA 2011
Interconnection networks and networks-on-chip › packet switching
packet-switched network
0.322012
Enhancing effective throughput for transmission line-based bus · ISCA 2012
A case for globally shared-medium on-chip interconnect · ISCA 2011
Interconnection networks and networks-on-chip › bus-based interconnection
bus architecture
0.112012
Enhancing effective throughput for transmission line-based bus · ISCA 2012
Interconnection networks and networks-on-chip
optical interconnection networks
0.112010
An intra-chip free-space optical interconnect · ISCA 2010
Processor architecture and microarchitecture
chip multiprocessor
0.122012
Enhancing effective throughput for transmission line-based bus · ISCA 2012
A case for globally shared-medium on-chip interconnect · ISCA 2011
Interconnection networks and networks-on-chip
communication bottleneck
0.012010
An intra-chip free-space optical interconnect · ISCA 2010
Integrated circuit design
system-on-chip
0.012010
An intra-chip free-space optical interconnect · ISCA 2010

Methods — techniques the papers use, named apart from their topics

trace simulation · 0.1
YearPublicationVenuePosition
2012 Enhancing effective throughput for transmission line-based bus
abstract
Main-stream general-purpose microprocessors require a collection of high-performance interconnects to supply the necessary data movement. The trend of continued increase in core count has prompted designs of packet-switched network as a scalable solution for future-generation chips. However, the cost of scalability can be significant and especially hard to justify for smaller-scale chips. In contrast, a circuit-switched bus using transmission lines and corresponding circuits offers lower latencies and much lower energy costs for smaller-scale chips, making it a better choice than a full-blown network-on-chip (NoC) architecture. However, shared-medium designs are perceived as only a niche solution for small- to medium-scale chips. In this paper, we show that there are many low-cost mechanisms to enhance the effective throughput of a bus architecture. When a handful of highly cost-effective techniques are applied, the performance advantage of even the most idealistically configured NoCs becomes vanishingly small. We find transmission line-based buses to be a more compelling interconnect even for large-scale chip-multiprocessors, and thus bring into doubt the centrality of packet switching in future on-chip interconnect.
Aaron Carpenter, Jianyun Hu, Övünç Kocabas, Michael C. Huang 0001, Hui Wu 0007
ISCA2
2011 A case for globally shared-medium on-chip interconnect
abstract
As microprocessor chips integrate a growing number of cores, the issue of interconnection becomes more important for overall system performance and efficiency. Compared to traditional distributed shared-memory architecture, chip-multiprocessors offer a different set of design constraints and opportunities. As a result, a conventional packet-relay multiprocessor interconnect architecture is a valid, but not necessarily optimal, design point. For example, the advantage of off-the-shelf interconnect and the in-field scalability of the interconnect are less important in a chip-multiprocessor. On the other hand, even with worsening wire delays,packet switching represents a non-trivial component of overall latency.
Aaron Carpenter, Jianyun Hu, Michael C. Huang 0001, Hui Wu 0007
ISCA2
2011 A design space exploration of transmission-line links for on-chip interconnect
Aaron Carpenter, Jianyun Hu, Michael C. Huang 0001, Hui Wu 0007, Peng Liu 0016
ISLPED2
2010 An intra-chip free-space optical interconnect
abstract
Continued device scaling enables microprocessors and other systems-on-chip (SoCs) to increase their performance, functionality, and hence, complexity. Simultaneously, relentless scaling, if uncompensated, degrades the performance and signal integrity of on-chip metal interconnects. These systems have therefore become increasingly communications-limited. The communications-centric nature of future high performance computing devices demands a fundamental change in intra- and inter-chip interconnect technologies.
Alok Garg, Berkehan Ciftcioglu, Jianyun Hu, Ioannis Savidis, Rebecca Berman, Peng Liu 0016, Michael C. Huang 0001, Hui Wu 0007, Eby G. Friedman, Gary Wicks, Duncan Moore
ISCA4