Resistive cross-point memory arrays can be used to construct high-density storage-class memory. However, coupled IR drop and sneak currents cause multidimensional non-uniformity of cell effective voltage in cross-point arrays. The voltage non-uniformity significantly degrades write performance on cross-point memory if only adopting the worst-case write latency at partial dimensions. Furthermore, the non-uniformity of cell effective voltage in cross-point arrays depends on multidimensional dynamic write operation parameters: row, column as well as layer address, the number of selected cells, and the number of half-selected low-resistance state cells. In this article, we aim to improve the write performance by leveraging multidimensional non-uniformity of cell effective voltage. First, we analyze the impact of multidimensional write parameters on effective voltage and write latency. Then, we design the memory array write scheme that measures the write parameters and sets the write latency accordingly. We further analyze the features and effects of interlayer sneak currents and extend the scheme to 3D cross-point memory. The evaluation shows that the proposed memory array write scheme can reduce the memory access latency by 75.6 and 64.1 percent, and improve the system performance by 4.5 times and 3.4 times on average, compared with the baseline and the state-of-the-art approach, respectively.

Resistive memory is promising to be constructed as a high-density storage-class memory. Multilevel cell, access-transistor-free cross-point array structure, and 3-D array integration are three approaches to scale up the density of resistive memory. However, composing the three approaches together strengthens the interactions between array-level and cell-level nonidealities (interconnect resistance-induced IR drop, sneak current, and device variability) of resistive memory arrays during write operations and significantly degrades write performance and reliability. In this article, we analyze the dynamic voltage-dividing effect along a selected write current path in 3-D cross-point memory arrays. We propose a nonideality-tolerant high-density resistive memory (HD-RRAM) architecture, that can weaken the interactions between nonidealities and mitigate their degradation effects on the performance and reliability of array multilevel write operations. HD-RRAM is equipped with a double-transistor array architecture with two-transistor- n-resistor (2TnR) cell organization along pillars to reduce the current driving requirement and the large undesired voltage drop across each vertical pillar access transistor. Moreover, multiside asymmetric bias improves the resistive switching velocity by leveraging current-dividing effects. Variability-aware multilevel state partition reduces the worst-case write error rate by leveraging target state dependency of variability. Proportional-control multilevel state tuning reduces the average number of required write-and-verify iterations by leveraging pulse amplitude dependency of variability. Multilevel cell parallel writing improves the cell-level parallelism by leveraging the pass-through feature of intermediate resistance states. The evaluations show that HD-RRAM reduces both memory access latency and energy consumption over an aggressive baseline.

Memristive crossbar array suffers from severe sneak currents that incur reliability issues and extra energy waste. Complementary resistive switches (CRSs) provide a new concept to address the sneak-current problem. But the destructive read of CRS results in an additional recovery write operation, which strongly restricts its further promotion. Exploiting the dual CRS/memristor mode of CRS devices, we propose Aliens, a novel reconfigurable architecture that introduces one alien cell (memristor mode) for each bitline in the crossbar. Aliens draws advantages from both modes: restrained sneak currents of the CRS mode and nondestructive read of the memristor mode. The simple and regular cell mode organization one bitline one memristor (OBOM) of Aliens enables an energy-saving read method. Further, by exploiting memory access locality, an effective mode switching strategy called Lazy-Switch is proposed to delay and merge the recovery write operations of the CRS mode. Moreover, an 1TnR crossbar structure is adopted to enable larger crossbar arrays as well as a higher ratio of memristor mode cells without going against the OBOM rule. The effects of the memristor mode cell ratio on the energy consumption, endurance, and access performance are studied. Also, we show the bank architecture of Aliens and analyze how to extend our designs to 3-D arrays. Due to fewer recovery write operations and negligible sneak currents, Aliens achieves improvements in energy, overall endurance, and access performance. The experimental results show that our design offers average energy savings of 19.1× compared with memristor-only memory, a memory lifetime 10.7× longer than CRS-only memory, and a competitive performance compared with memristor-only memory.

Resistive Memory (ReRAM) is promising to be used as high density storage-class memory by employing Triple-Level Cell (TLC) and crossbar structures. However, TLC crossbar ReRAM suffers from high write latency and energy due to the IR drop issue and the iterative program-and-verify procedure. In this paper, we propose Tiered-ReRAM architecture to overcome the challenges of TLC crossbar ReRAM. The proposed Tiered-ReRAM consists of three components, namely Tiered-crossbar design, Compression-based Incomplete Data Mapping (CIDM), and Compression-based Flip Scheme (CFS). Specifically, based on the observation that the magnitude of IR drops is primarily determined by the long length of bitlines in Double-Sided Ground Biasing (DSGB) crossbar arrays, Tiered-crossbar design splits each long bitline into the near and far segments by an isolation transistor, allowing the near segment to be accessed with decreased latency and energy. Moreover, in the near segments, CIDM dynamically selects the most appropriate IDM for each cache line according to the saved space by compression, which further reduces the write latency and energy with insignificant space overhead. In addition, in the far segments, CFS dynamically selects the most appropriate flip scheme for each cache line, which ensures more high resistance cells written into crossbar arrays and effectively reduces the leakage energy. For each compressed cache line, the selected IDM or flip scheme is applied on the condition that the total encoded data size will never exceed the original cache line size. The experimental results show that, on average, Tiered-ReRAM can improve the system performance by 30.5%, reduce the write latency by 35.2%, decrease the read latency by 26.1%, and reduce the energy consumption by 35.6%, compared to an aggressive baseline.

Emerging computational resistive memory is promising to overcome the challenges of scalability and energy efficiency that DRAM faces and also break through the memory wall bottleneck. However, cell-level and array-level nonideal properties of resistive memory significantly degrade the reliability, performance, accuracy, and energy efficiency during memory access and analog computation. Cell-level nonidealities include nonlinearity, asymmetry, and variability. Array-level nonidealities include interconnect resistance, parasitic capacitance, and sneak current. This review summarizes practical solutions that can mitigate the impact of nonideal device and circuit properties of resistive memory. First, we introduce several typical resistive memory devices with focus on their switching modes and characteristics. Second, we review resistive memory cells and memory array structures, including 1T1R, 1R, 1S1R, 1TnR, and CMOL. We also overview three-dimensional (3D) cross-point arrays and their structural properties. Third, we analyze the impact of nonideal device and circuit properties during memory access and analog arithmetic operations with focus on dot-product and matrix-vector multiplication. Fourth, we discuss the methods that can mitigate these nonideal properties by static parameter and dynamic runtime co-optimization from the viewpoint of device and circuit interaction. Here, dynamic runtime operation schemes include line connection, voltage bias, logical-to-physical mapping, read reference setting, and switching mode reconfiguration. Then, we highlight challenges on multilevel cell cross-point arrays and 3D cross-point arrays during these operations. Finally, we investigate design considerations of memory array peripheral circuits. We also portray an unified reconfigurable computational memory architecture.

Passive crossbar arrays of resistive random-access memory (RRAM) have shown great potential to meet the demands of future memory. By eliminating transistor per cell, the crossbar array possesses a higher memory density but introduces sneak currents which incur extra energy waste and reliability issues. The complementary resistive switch (CRS), consisting of two anti-serially stacked memristors, is considered as a promising solution to the sneak current problem. However, the destructive read of the CRS results in an additional recovery write operation which strongly restricts its further promotion. Exploiting the dual CRS/memristor mode of CRS devices, we propose Aliens, a novel hybrid architecture for resistive random-access memory which introduces one alien cell (memristor mode) for each wordline in the crossbar to provide a practical hybrid memory without operating system's intervention. Aliens draws advantages from both modes: restrained sneak current of CRS mode and non-destructive read of memristor mode. The simple and regular cell mode organization of Aliens enables an energy-saving read method and an effective mode switching strategy called Lazy-Switch. By exploiting memory access locality, Lazy-Switch delays and merges the recovery write operations of the CRS mode. Due to fewer recovery write operations and negligible sneak currents, Aliens achieves improvement in energy, overall endurance, and access performance. The experiment results show that our design offers average energy savings of 13.9× compared with memristor-only memory, a memory lifetime 5.3× longer than CRS-only memory, and a competitive performance compared with memristor-only memory.

Emerging Resistive Random Access Memory (ReRAM) is a promising candidate as the replacement for DRAM due to its low standby power, high density, high scalability, and nonvolatility. By employing the unique crossbar structure, ReRAM can be constructed with extremely high density. However, the crossbar ReRAM faces some serious challenges in terms of performance, reliability, and energy consumption. First, ReRAM’s crossbar structure causes an IR drop problem due to wire resistance and sneak currents, which results in nonuniform access latency in ReRAM banks and reduces its reliability. Second, without access transistors in the crossbar structure, write disturbance results in serious data reliability problem. Third, the access latency, reliability, and energy use of ReRAM arrays are significantly influenced by the data patterns involved in a write operation. To overcome the challenges of the crossbar ReRAM, we propose a novel circuit architecture co-optimization framework for improving the performance, reliability, and energy use of ReRAM-based main memory system, called CACF. The proposed CACF consists of three levels, including the circuit level, circuit architecture level, and architecture level. At the circuit level, to reduce the IR drops along bitlines, we propose a double-sided write driver design by applying write drivers along both sides of bitlines and selectively activating the write drivers. At the circuit architecture level, to address the write disturbance with low overheads, we propose a RESET disturbance detection scheme by adding disturbance reference cells and conditionally performing refresh operations. At the architecture level, a region partition with address remapping method is proposed to leverage the nonuniform access latency in ReRAM banks, and two flip schemes are proposed in different regions to optimize the data patterns involved in a write operation. The experimental results show that CACF improves system performance by 26.1%, decreases memory access latency by 22.4%, shortens running time by 20.1%, and reduces energy consumption by 21.6% on average over an aggressive baseline. Meanwhile, CACF significantly improves the reliability of ReRAM-based memory systems.

Emerging Resistive Memory (ReRAM) is a promising candidate as the replacement for DRAM because of its low power consumption, high density and high endurance. Due to the unique crossbar structure, ReRAM can be constructed with a very high density. However, ReRAM's crossbar structure causes an IR drop problem which results in non-uniform access latency in ReRAM banks and reduces its reliability. Besides, the access latency and reliability of ReRAM arrays are greatly influenced by the data patterns involved in a write operation. In this paper, we propose a performance and reliability efficient ReRAM-based main memory structure. At the circuit level, we propose a double-sided write driver design to reduce the IR drops along bitlines. At the architecture level, a region partition with address remapping method and two flip schemes are proposed to reduce the access latency and improve the reliability of ReRAM arrays. The experimental results show that the proposed design can improve the system performance by 30.3% on average and reduce the memory access latency by 25.9% on average over an aggressive baseline, meanwhile the design improves the reliability of ReRAM-based memory system.

Resistive random access memory (RRAM) is promising to be used as high density storage-class memory by employing crossbar structure. However, the wire resistance in crossbar array causes the IR drop problem, which makes nonuniformity of write latency throughout the array. In large crossbar array, the write latency differs greatly even in the same row. Since the write latency of a region is determined by its slowest write-unit, the conventional group-by-row region partition and addressing scheme is suboptimal for improving the overall performance of RRAM. In this work, we present DAWS, a novel RRAM architecture that exploits intrinsic features of crossbar structure. We first build a circuit model to analyze the voltage distribution and write latency distribution in a crossbar array. Then we propose a voltage bias scheme to optimize write latency via minimizing the IR drop path. We further present block diagonal partition to narrow the variance of write latency within each region, thus the write latency of each region is reduced. Moreover, we provide block diagonal addressing to make the write latency monotonically increase with the physical address, which is in favor of address mapping and memory allocation. We also design diagonal writing and diagonal swapping to overlap SET and RESET operations by applying a particular voltage bias pattern that can exploit row level parallelism, thus the number of write operations is halved. The experimental results show that DAWS can reduce memory access latency by 24.0% and improve system performance by 29.7% over an aggressive baseline.