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Hiroyuki Kusuki

dblp:09/889 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 1991
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%

Topics — the 2 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design › analog and mixed-signal circuits
device modeling
0.011991
Simplified simulations of GaAs MESFET's with semi-insulating substrate compensated by deep levels · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1991
Integrated circuit design › semiconductor devices
compound semiconductor devices
0.011991
Simplified simulations of GaAs MESFET's with semi-insulating substrate compensated by deep levels · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1991

Methods — techniques the papers use, named apart from their topics

two-carrier model · 0.0one-carrier model · 0.0
YearPublicationVenuePosition
1991 Simplified simulations of GaAs MESFET's with semi-insulating substrate compensated by deep levels
abstract
Current-voltage characteristics of GaAs MESFETs (with p-butter layers) on semi-insulating substrates compensated by deep levels are simulated by two-carrier and one-carrier models. For a thicker p-buffer layer or for higher acceptor density in the substrate, the drain current becomes lower because the substrate current is reduced. The one-carrier model also gives reasonable results for a case with a hole-trap substrate. Small-signal parameters of GaAs MESFETs on various types of substrates are also simulated. For a thicker p-buffer layer or for higher acceptor densities in the semi-insulating substrates, the substrate current is reduced, and both transconductance and cutoff frequency become higher. It is concluded that, to utilize the high-speed and high-frequency performance of GaAs MESFETs, acceptor densities in the substrate should be made high.>
Kazushige Horio, Yasuji Fuseya, Hiroyuki Kusuki, Hisayoshi Yanai
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3