This study introduces an innovative K-/Ka-band planar active shared-aperture phased array (ASAPA), advancing low earth orbit (LEO) terminal design through synergistic innovations in shared-aperture topology and three-dimensional (3D) integration. Breaking from conventional shared-aperture topologies plagued by cross-band interference and radiation pattern distortion, we propose a partial-element-reuse-based (PER) topology that strategically repurposes 50% of dual-band dual-polarized elements for simultaneous transmit and receive (STAR) operation. This configuration eliminates active element pattern distortion while achieving a reduction in element count, enabling wide-angle beam scanning essential for dynamic satellite tracking. Furthermore, a sandwich-structured printed circuit board (PCB) lamination method is further employed to streamline integration by partitioning functional modules into antenna, coupler, and active circuit layers interconnected via ball grid array (BGA) technology. This 3D integration strategy simplifies vertical interconnects, minimizes PCB layer requirements, and enhances thermal dissipation through embedded air gaps. Experimental results validate robust beamforming performance across ±60° scanning ranges for both transmitting and receiving arrays, achieving high transceiver isolation and signal integrity, which are imperative for high-capacity satellite links. By addressing key bottlenecks in LEO terminal design, the proposed innovations can accelerate the deployment of energy-efficient, cost-effective satellite networks, thus advancing the 6G vision of ubiquitous global connectivity.

This article presents a fully packaged 94-GHz 16-channel local oscillator (LO) phase-shifting transmitter (TX) and a single-channel receiver (RX). The implementation is accomplished using a hybrid integration scheme, combining high-output-power 100 nm GaAs pHEMT front-end chips and highly-integrated 130 nm SiGe BiCMOS beamformer chips. High-accuracy LO phase shifting is achieved with the utilization of a commercial SiGe-based four-channel beamformer chips, offering 7-bit phase control at 24–28 GHz. A 26-to-78 GHz tripler chain using power-enhancing and harmonic-suppression techniques, a 16-to-94 GHz bi-directional mixer, and a 94-GHz power amplifier are designed in the transmitter front-end chip based on the GaAs process. The GaAs transmitter front-ends are wire-bonded to microstrip lines and then converted to low-loss substrate integrated waveguides (SIWs), which directly feed a high-gain TEM horn antenna array. The inter-element spacing of the transmitter array is optimized to 1.6 mm ($0.5 \lambda _{0}$@94 GHz) for a wide scanning range. The 16-channel transmitter achieves a wide scanning range of ±50° and a peak effective isotropic radiated power (EIRP) of 43.6 dBm at 94 GHz. The GaAs receiver chip is packaged with the WR10 waveguide RF interface and connected to a horn antenna. The packaged GaAs receiver module achieves a conversion gain (CG) of 25 dB and a noise figure (NF) of 5.8 dB. Additionally, the 16T1R over-the-air (OTA) measurement supports 5G New Radio 400-MHz 64-QAM signal between 88 and 94 GHz over a 5-meter ±48° scanning range.

This paper presents a monolithically integrated E-band amplifier multiplier chain (AMC) developed in 130 nm SiGe BiCMOS process. This E-band AMC is composed of a 25 GHz 1:1 power divider, two 25 GHz driver amplifiers (DA1,2), a 75 GHz passive frequency tripler, and a 75 GHz power amplifier (PA). By applying a bypass tuning capacitor based power enhancing technique in the single-ended DA and PA, the output power and power-added-efficiency (PAE) of the AMC have been effectively improved. Benefiting from the proposed passive tripler core with second harmonic suppression function, and the impedance matching network with frequency selection characteristics, the AMC presents better harmonic suppression performance compared with the conventional topology. The bias circuits with temperature compensation are applied to the DA and PA to ensure the performance of the AMC when the temperature changes. The AMC has a measured output power exceeding 0 dBm in the entire E-band frequency range with a peak output power of 10.9 dBm at 77 GHz, and exhibits a record PAE of 8.25 %. Within the 3 dB operating frequency range from 69 to 87 GHz, the rejection of fundamental and second harmonics are better than 33.5 dB. The AMC can work properly between −40°C and 125 °C with the proposed temperature compensation bias circuits.

Abstract The fifth generation (5G) wireless communication networks are being deployed worldwide from 2020 and more capabilities are in the process of being standardized, such as mass connectivity, ultra-reliability, and guaranteed low latency. However, 5G will not meet all requirements of the future in 2030 and beyond, and sixth generation (6G) wireless communication networks are expected to provide global coverage, enhanced spectral/energy/cost efficiency, better intelligence level and security, etc. To meet these requirements, 6G networks will rely on new enabling technologies, i.e., air interface and transmission technologies and novel network architecture, such as waveform design, multiple access, channel coding schemes, multi-antenna technologies, network slicing, cell-free architecture, and cloud/fog/edge computing. Our vision on 6G is that it will have four new paradigm shifts. First, to satisfy the requirement of global coverage, 6G will not be limited to terrestrial communication networks, which will need to be complemented with non-terrestrial networks such as satellite and unmanned aerial vehicle (UAV) communication networks, thus achieving a space-air-ground-sea integrated communication network. Second, all spectra will be fully explored to further increase data rates and connection density, including the sub-6 GHz, millimeter wave (mmWave), terahertz (THz), and optical frequency bands. Third, facing the big datasets generated by the use of extremely heterogeneous networks, diverse communication scenarios, large numbers of antennas, wide bandwidths, and new service requirements, 6G networks will enable a new range of smart applications with the aid of artificial intelligence (AI) and big data technologies. Fourth, network security will have to be strengthened when developing 6G networks. This article provides a comprehensive survey of recent advances and future trends in these four aspects. Clearly, 6G with additional technical requirements beyond those of 5G will enable faster and further communications to the extent that the boundary between physical and cyber worlds disappears.

Millimeter-wave (mmWave) technology has been well studied for both outdoor long-distance transmission and indoor short-range communication. In the recently emerging fiber-to-the-room (FTTR) architecture in the home network of the fifth generation fixed networks (F5G), mmWave technology can be cascaded well to a new optical network terminal in the room to enable extremely high data rate communication (i.e., >10 Gb/s). In the FTTR+mmWave scenario, the rapid degradation of the mmWave signal in long-distance transmission and the significant loss against wall penetration are no longer the bottlenecks for real application. Moreover, the surrounding walls of every room provide excellent isolation to avoid interference and guarantee security. This paper provides insights and analysis for the new FTTR+mmWave architecture to improve the customer experience in future broadband services such as immersive audiovisual videos.