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Harish Krishnamurthy

dblp:123/8918 · also Harish K. Krishnamurthy, Harish Kumar Krishnamurthy · DBLP profile ↗
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3ranked-venue papers
0as first author
2since 2021 · last 2022
0000-0001-5927-8339ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 3 · 2 since 2021Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Network and information security
1 paper
Hardware security and side channels · 100%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%

Topics — the 3 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Hardware security and side channels › side-channel attack › electromagnetic side channel
electromagnetic side-channel analysis
0.612022
EM SCA White-Box Analysis-Based Reduced Leakage Cell Design and Presilicon Evaluation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Hardware security and side channels
side-channel attack
0.612022
EM SCA White-Box Analysis-Based Reduced Leakage Cell Design and Presilicon Evaluation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Hardware security and side channels
side-channel countermeasures
0.612022
EM SCA White-Box Analysis-Based Reduced Leakage Cell Design and Presilicon Evaluation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022

Methods — techniques the papers use, named apart from their topics

white-box modeling · 1.1finite-element simulation · 0.6finite element simulation · 0.6
YearPublicationVenuePosition
2022 EM SCA White-Box Analysis-Based Reduced Leakage Cell Design and Presilicon Evaluation
abstract
This work presents a white-box modeling of the electromagnetic (EM) leakage from an integrated circuit (IC) to develop EM side-channel analysis (SCA)-aware design techniques. A new digital library cell layout design technique is proposed to minimize the EM leakage and is evaluated using a high-frequency structure simulator (HFSS)-based framework. Backed by our physics-based understanding of EM radiation, the proposed double-row power grid-based digital cell layout design shows$>5\times $reduction in the EM SCA leakage compared to the traditional digital logic gate layout design. Furthermore, exploiting the magneto-quasistatic (MQS) regime of operation of the EM leakage from the CMOS circuits, the HFSS-based framework is utilized to develop a pre-silicon (Si) EM SCA evaluation technique to assess the vulnerability of cryptographic implementations against such attacks during the design phase itself.
Debayan Das, Mayukh Nath, Baibhab Chatterjee, Raghavan Kumar, Xiaosen Liu, Harish Krishnamurthy, Manoj R. Sastry, Sanu Mathew, Santosh Ghosh, Shreyas Sen
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.6
2021 Wide-Range Many-Core SoC Design in Scaled CMOS: Challenges and Opportunities
abstract
The system-on-chip (SoC) designs for future Internet of Things (IoT) systems, spanning client platforms to cloud datacenters, need to deliver uncompromising and scalable performance with extreme energy efficiency for diverse workloads and applications, while satisfying a wide range of energy budgets, as well as platform cooling and power delivery constraints. Low-latency, burst-mode responsiveness, and scalable high-throughput performance must be delivered on demand for a range of thread-parallel, task-parallel, and data-parallel workloads covering traditional and emerging applications. This article discusses the challenges and opportunities for many-core SoC design in scaled CMOS process operating over a wide voltage-frequency range including near-threshold-voltage (NTV) that can meet the compute demands of the future at scale, flexibly, and efficiently. This article covers: 1) circuit design techniques for NTV cores; 2) mitigation techniques for within-die parameter variations via multivoltage frequency schemes; 3) digital integrated voltage regulators (VRs) for fine-grain and wide-range voltage modulation; and 4) radiation-induced soft error rate (SER) characterization and mitigation techniques to enable reliable operation at NTV. Silicon prototype examples will be used to illustrate the different techniques and highlight future research directions.
Sriram R. Vangal, Somnath Paul, Steven Hsu, Amit Agarwal 0001, Saurabh Kumar 0003, Ram Krishnamurthy 0001, Harish Krishnamurthy, James W. Tschanz, Vivek De, Chris H. Kim
IEEE Trans. Very Large Scale Integr. Syst.7
2014 Impact of process variation in inductive integrated voltage regulator on delay and power of digital circuits
abstract
This paper analyzes the effect of variations in the parameters of an Integrated Voltage Regulator (IVR) and its impact on the power/performance of a system of IVR driven digital logic circuit. The coupled analysis of IVR and digital logic considering variations in the integrated passives, power train FETs and controller transistors shows, compared to an off-chip VR, variations in IVR induce much larger shifts in the operating frequency of the logic and total system power. Variations in the output filter passives cause most prominent variations in the system power and performance, particularly pronounced at low voltage operation of the core. We also show that the mean performance of the system can be traded-off to reduce the variability by modifying IVR parameters, such as controller zeroes or output capacitors.
Monodeep Kar, Sergio Carlo, Harish Krishnamurthy, Saibal Mukhopadhyay
ISLPED3