This paper addresses a delay-driven layer assignment problem with consideration of via delay and coupling effect in the global routing stage. A negotiation-based framework is proposed to balance delay, congestion, and via count. Coupling capacitance is considered using a probabilistic look-up table. Finally, the proposed algorithm uses both parallel wires and wide wires to reduce wire delay. The effectiveness of our layer assignment algorithm is supported by extensive experimental results.

In this paper, we study a cell-based row-structure layout decomposition problem for triple patterning lithography (TPL) which asks to minimize a weighted sum of coloring conflicts and stitches. We show how to extend a prior graph-based approach to solve the problem optimally under certain assumptions. Furthermore, several methods to substantially reduce the graph size and hence to accelerate the extended approach are presented. Experimental results show that our decomposer can significantly outperform a state-of-the-art work in terms of both solution quality and run time.

In this paper, we study row-based detailed placement refinement for triple patterning lithography (TPL), which asks to find a refined detailed placement solution as well as a valid TPL layout decomposition under the objective of minimizing the number of stitches and the half-perimeter wirelength. Our problem does not have precoloring solutions of cells as the input, and it allows using techniques, including white space insertion, cell flipping, adjacent-cell swapping, and vertical cell movement, to optimize the solution quality. We first present (resource-constrained) shortest-path-based algorithms for several TPL-aware single-row placement problems that allow or disallow perturbing a given cell ordering. Based on these algorithms, we then propose an approach to our TPL-aware detailed placement refinement problem, which first minimizes the number of stitches and then minimizes the wirelength. Finally, we report extensive experimental results to demonstrate the effectiveness and efficiency of our approach.