Demo Data from VLDB 2026 / reviewers in the wild / expert
Hsiu-Yu Lai
dblp:161/5084
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2015
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 100% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › physical design › placement
detailed placement |
0.2 | 1 | 2015 | On Refining Row-Based Detailed Placement for Triple Patterning Lithography · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Electronic design automation › physical design
lithography |
0.2 | 1 | 2015 | On Refining Row-Based Detailed Placement for Triple Patterning Lithography · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Electronic design automation
physical design |
0.2 | 1 | 2015 | On Refining Row-Based Detailed Placement for Triple Patterning Lithography · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Electronic design automation › physical design › lithography
triple patterning lithography |
0.2 | 1 | 2015 | On Refining Row-Based Detailed Placement for Triple Patterning Lithography · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Methods — techniques the papers use, named apart from their topics
white space insertion · 0.2shortest path algorithm · 0.2cell flipping · 0.2
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2015 | On Refining Row-Based Detailed Placement for Triple Patterning LithographyabstractIn this paper, we study row-based detailed placement refinement for triple patterning lithography (TPL), which asks to find a refined detailed placement solution as well as a valid TPL layout decomposition under the objective of minimizing the number of stitches and the half-perimeter wirelength. Our problem does not have precoloring solutions of cells as the input, and it allows using techniques, including white space insertion, cell flipping, adjacent-cell swapping, and vertical cell movement, to optimize the solution quality. We first present (resource-constrained) shortest-path-based algorithms for several TPL-aware single-row placement problems that allow or disallow perturbing a given cell ordering. Based on these algorithms, we then propose an approach to our TPL-aware detailed placement refinement problem, which first minimizes the number of stitches and then minimizes the wirelength. Finally, we report extensive experimental results to demonstrate the effectiveness and efficiency of our approach. Hsi-An Chien, Ye-Hong Chen, Szu-Yuan Han, Hsiu-Yu Lai, Ting-Chi Wang |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 4 |