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Tao Jiang 0028

dblp:181/2813-28 · DBLP profile ↗
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2ranked-venue papers
2as first author
0since 2021 · last 2006
0000-0002-2429-3229ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 2 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 67% Integrated circuit design · 33%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › hardware verification and test
fault analysis
0.112006
Inductive fault analysis of surface-micromachined MEMS · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2006
Electronic design automation › hardware test › integrated circuit testing
inductive fault analysis
0.112006
Inductive fault analysis of surface-micromachined MEMS · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2006
Integrated circuit design
microelectromechanical systems
0.112006
Inductive fault analysis of surface-micromachined MEMS · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2006

Methods — techniques the papers use, named apart from their topics

mechanical simulation · 0.1fabrication process simulation · 0.1electrical simulation · 0.1
YearPublicationVenuePosition
2006 Inductive fault analysis of surface-micromachined MEMS
abstract
The defects and the corresponding behavior caused by particle contaminants introduced into the fabrication of a combdrive surface-micromachined microresonator are investigated. The microresonator is chosen as a research vehicle since it possesses all the primitive elements used in many types of capacitive-based microelectromechanical systems (MEMS). Fabrication process simulation is used to predict all the possible defective structures caused by contaminants. The resulting defects are then classified based on their geometrical properties. Mechanical and electrical simulations are also used to determine the impact of defect classes on key mechanical and electrical characteristics of the microresonator. This analysis reveals that particles can cause various mechanical defects that include anchors, broken beams, and bridged comb fingers, all of which can have a significant impact on mechanical behavior. On the other hand, there are mechanical defects (e.g., a broken comb finger) that virtually have no effect on mechanical properties but can lead to catastrophic changes in electrical capability
Tao Jiang 0028, R. D. (Shawn) Blanton
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
1999 Particulate failures for surface-micromachined MEMS
abstract
We investigate the failure modes of a comb-drive surface-micromachined microresonator that are caused by particulate contaminations. The microresonator structure is chosen as our research vehicle because it possesses all the primitive components found in many capacitive-based MEMS sensors and actuators. Process simulation is used to create the full-spectrum of defective structures caused by foreign particles. The generated defective structures are then classified based on their geometrical properties. Finite element analysis is used to understand the impact of these defects on the mechanical frequency response of the microresonator while HSPICE simulations are performed to determine the corresponding electrical misbehaviors within an acceleration measuring application. Simulation results show that particles can cause unwanted anchors, broken beams and welded comb fingers. However, the most interesting defects are broken comb fingers and lateral finger protrusions that only affect sensing capacitance. These defects lead to a very small increase or decrease in the shuttle mass. The mass change is so small that the mechanical frequency response of the resonator is virtually unchanged. However, the HSPICE simulations show that the change in output sensing voltage can be catastrophic.
Tao Jiang 0028, R. D. (Shawn) Blanton
ITC1