Hybrid test schemes comprising on-chip test compression and logic built-in self-test are expected to play a pivotal role in the design of new integrated circuits and delivering high quality tests. As architectural differences between these two paradigms are gradually blurring, and both schemes efficiently share test logic, they become more vulnerable to unknown (X) states whose sources vary from uninitialized memory elements to unwrapped-for-test analog modules. Typically, X values degrade test results, and thus test response compaction schemes must be duly protected. This article presents maXpress-an X-tolerant tunable compactor deploying a new scan chain selection mechanism capable of completely masking X states, as required by many in-system or one-directional streaming test applications, within redefinable groups of scan chains and designated scan shift cycles. The proposed scheme is also supporting separate observation scan chains that, in contrast to conventional scan, capture faulty effects every shift cycle, while their content is gradually shifted into a compactor shared with the remaining chains. In addition to a new layout-friendly architecture, the article proposes algorithms to automate maXpress control settings based on scan chain selection rules deployed to suppress X states. Experimental results obtained for industrial designs show feasibility and efficiency of the proposed scheme altogether with actual impact of X-masking on a resultant test coverage and test pattern counts.

As cars become increasingly computerized and their safety functions evolve rapidly, the number of complex safety-critical components deployed in advanced driver assistance systems or autonomous vehicles is rising dramatically with high-end models containing hundreds of embedded microcontrollers. These integrated circuits must adhere to stringent requirements for high quality and long-term reliability driven by functional safety standards. This requires test solutions that address challenges posed by automotive systems. This article presents a scan-based test scheme optimizing test time and area overhead during manufacturing and in-system test of automotive electronics. The proposed scheme deploys observation test points that capture the faulty effects in every shift cycle into separate observation scan chains. To reduce area overhead, the scheme enables the sharing of flip-flops among control points. It is also shown how test points enhance test coverage (TC) in the presence of cascaded clock gaters. Finally, processing challenges when fault simulating every scan shift cycle to determine TC are addressed. Experimental results obtained for contemporary automotive designs and reported herein show significant improvements in test quality over traditional solutions.

There is a growing number of integrated circuits that deploy hybrid test schemes combining on-chip test compression with logic BIST, with both techniques working synergistically to deliver high quality tests. As their architectural differences are gradually blurring, and both schemes efficiently share test logic, they become more vulnerable to unknown (X) states whose sources vary from uninitialized memory elements to unwrapped-for-test analog modules. Typically, X values degrade test results, and thus test response compaction schemes must be duly protected. This paper presents maXpress – an X-tolerant programmable compactor deploying a new scan chain selection mechanism capable of completely (as required by many in-system test applications) masking X states within redefinable groups of scan chains and designated scan shift cycles. In addition to the new architecture, the paper proposes an algorithm to automate maXpress control settings based on scan chain selection rules deployed to suppress X states. Experimental results obtained for a variety of industrial designs show feasibility and efficiency of the proposed scheme altogether with actual impact of X-masking on a resultant test coverage and test pattern counts.

As the automotive industry enters a period of rapid evolution changing the way cars are designed and produced, the number of complex safety-critical components deployed in advanced driver assistance systems or autonomous vehicles is progressively rising with high-end models containing around 120 MCUs. These integrated circuits must adhere to stringent requirements for high quality and long-term reliability driven by functional safety standards. This requires test solutions that address challenges posed by automotive electronics. This paper presents Stellar BIST-a next generation compression scheme for in-system automotive test. The proposed solution can work with any sequential test compression. It builds on a finding that certain clusters of test vectors are capable of detecting many random-resistant faults, where a cluster consists of a parent (base) pattern and its transformed derivatives. Stellar BIST involves generating vectors based on simultaneous and multiple complements of scan slices of encodable parent patterns. The multiple complements are also skewed between successive patterns to diversify the resultant tests. The new scheme elevates compression to values unachievable through conventional reseeding-based solutions and provides significant tradeoffs between storage requirements and test application time, critical for in-system automotive applications. The experimental results obtained for industrial designs and different fault models illustrate feasibility of the proposed test scheme and are reported herein.

As cars become increasingly computerized and their safety functions are evolving rapidly, the number of complex safety-critical components deployed in advanced driver assistance systems or autonomous vehicles is progressively rising with high-end models containing more than a hundred embedded microcontrollers. These integrated circuits must adhere to stringent requirements for high quality and long-term reliability driven by functional safety standards. This requires test solutions that address challenges posed by automotive electronics. The paper presents a scan-based LBIST scheme optimizing test time and area overhead during in-system test applications for automotive ICs. It ensures highly reliable operations of ICs for the duration of their lifespan. The proposed scheme works with observation test points that capture faulty effects every shift cycle into separate observation scan chains. To reduce area overhead, the scheme takes advantage of a procedure allowing one to share flip-flops among control points. It is also shown how test points can enhance test coverage in the presence of cascaded clock gaters. Finally, processing challenges when fault simulating every scan shift cycle to determine observed faults are addressed. Experimental results obtained for contemporary automotive designs and reported herein show significant improvements in quality of test over traditional BIST schemes.

With the growing number of very complex safety-critical components used in advanced driver assistance systems and autonomous vehicles, integrated circuits in this area must adhere to stringent requirements for high quality and long-term reliability driven by functional safety standards. This, in turn, requires advanced test solutions that have to respond to challenges posed by automotive parts. This paper presents Stellar BIST - a deterministic two-level compression scheme for in-system automotive test. The proposed solution seamlessly integrates with any sequential test compression scheme and takes advantage of the fact that certain clusters of test vectors detect many random-resistant faults where a cluster consists of a parent pattern and its transformed derivatives. Stellar BIST involves generating vectors based on simultaneous and multiple complements of scan slices of encodable parent patterns. The multiple complements are also skewed between successive patterns to diversify the resultant tests. The new scheme elevates compression to values unachievable through conventional reseeding-based solutions and provides significant trade-offs between area and time, critical for in-system automotive applications. Experimental results obtained for large industrial designs with stuck-at and transition faults illustrate feasibility of the proposed test scheme and are reported herein.

This paper presents a new staggered test pattern generation scheme. It produces deterministic stimuli in the course of a test-per-clock-based process by using dedicated capture-per-cycle observation test points. These observation points, once inserted into a design, form dedicated scan chains with the capability of capturing test responses during shift cycles when other regular scan cells are loading test patterns. This new scan infrastructure enables one to generate more compact test patterns, reduce test pattern counts, systematically detect many additional faults, and keep the resultant silicon real-estate at the acceptable level. It appears that original scan cells of a design can provide good observability for staggered test patterns. Thus, capture-per-cycle observation test points are directly inserted at selected scan cells' inputs with a minimal impact on the design. Experimental results obtained for large industrial designs illustrate feasibility of the proposed ATPG and are reported herein.

There is mounting evidence that automatic test pattern generation tools capable of producing tests with high coverage of defects occurring in the large semiconductor nanometer designs unprecedentedly inflate test sets and test application times. A design-for-test technique presented in this paper aims at reducing deterministic pattern counts and test data volume through the insertion of conflict-aware test points. This methodology identifies and resolves conflicts across internal signals allowing test generation to increase the number of faults targeted by a single pattern. This is complemented by a method to minimize silicon area needed to implement conflict-aware test points. The proposed approach takes advantage of the conflict analysis and reuses functional flip-flops as drivers of control points. Experimental results on industrial designs with on-chip test compression demonstrate that the proposed test points are effective in achieving, on average, an additional factor of 2×-4× compression for stuck-at and transition patterns over the best up-to-date results provided by the embedded deterministic test (EDT)-based regular compression.

Conflict-aware test points, introduced recently, facilitate significant reductions in deterministic test pattern counts. However, dedicated flip-flops driving control points increase test logic area. This paper presents a method to minimize silicon area needed to implement conflict-aware test points by reusing functional flip-flops as drivers of control points. Conflict analysis is applied during the test point selection process, and ATPG verification is run for every potential candidate. Experimental results show that functional flip-flops can be reused as drivers for more than 90% of the control points with the average of 5% penalty in pattern count increase as compared to methods using only dedicated flip-flops. After replacing dedicated flip-flops with functional flip-flops, conflict-aware test points can still achieve remarkable pattern count reductions.