Spin-transfer torque magnetic random access memory (STT-MRAM) is a promising alternative to existing memory technologies. However, STT-MRAM faces reliability challenges, primarily due to stochastic switching, process variation, and manufacturing defects. These reliability challenges become even worse due to interconnect parasitic resistive-capacitive effects, potentially compromising the reliability of memory cells located far from the write driver. This can severely impair the manu-facturing yield and large-scale industrial adoption. Toaddressthis, we propose an interconnect-aware error correction coding (InterA-ECC), which provides non-uniform error correction to a different zone of the memory subarray. The proposed InterA-ECC strategy selectively applies robust error-correction code (ECC) to specific rows within the subarray rather than uniformly across all rows, reducing ECC parity bits while enhancing bit error rate resiliency in the most vulnerable memory zone.

Spin-transfer torque magnetic random access memory (STT-MRAM) has emerged as a promising alternative to conventional CMOS memory technologies for on-chip cache replacement. Due to its superior access speeds, high endurance, and scalability, it is being extensively considered a promising candidate for last-level cache replacement. This technology has reached considerable industrial maturity, with several foundries now offering this emerging technology. Despite its advantages, STT-MRAM faces reliability challenges, primarily due to its asymmetric error characteristics during write and read operations, where the likelihood of a bit transitioning from$1\rightarrow 0$differs from that of$0\rightarrow 1$. Conventional Error Correcting Codes (ECCs) do not account for such asymmetry between these bit-flip types and fall short of providing balanced error correction. This article introduces an efficient asymmetric and adaptive error correction in STT-MRAM based on the Hamming weight of data bits that operates with negligible overhead alongside a standard ECC framework. Our simulation findings indicate that the proposed technique offers substantial enhancement in reliability, measured by a cache word/block error rate, tested across the last level cache data for various SPEC CPU2017 benchmarks. This enhancement in reliability is achieved without inserting excessive memory and hardware overhead, and without impacting system performance, presenting a compelling case for enhancing the operational reliability of STT-MRAM.

It is envisaged that spintronic logic devices will ultimately be utilized in hybrid CMOS-spintronic systems where signal interconversion between magnetic and electrical domains via transducers takes place. This underscores the vital role of transducers in influencing the overall performance of such hybrid systems. This paper addresses the question: Can spintronic circuits based on Magnetic Tunnel Junction (MTJ) transducers outperform their state-of-the-art CMOS counterparts? To this end, we use the EPFL (École Polytechnique Fédérale de Lausanne) combinational benchmark sets, synthesize them in 7 nm CMOS and in MTJ transducer based spintronic technologies, and compare the two implementation methods in terms of Energy-Delay-Product (EDP). To fully utilize the technologies’ potential, CMOS and spintronic implementations are built upon standard Boolean and Majority Gates, respectively. For the spintronic circuits, we assumed that domain conversion (electric/magnetic to magnetic/electric) is performed by means of MTJs and the computation is accomplished by domain wall (DW)-based majority gates, and considered two EDP estimation scenarios: (i) Uniform Benchmarking, which ignores the circuit’s internal structure and only includes domain transducers’ power and delay contributions into the calculations, and (ii) Majority-Inverter-Graph Benchmarking, which also embeds the circuit structure, the associated critical path delay and energy consumption by DW propagation. Our results indicate that, for the uniform case, the spintronic route is better suited for the implementation of complex circuits with few inputs and outputs. On the other hand, when the circuit structure is also considered via majority and inverter synthesis, our analysis clearly indicates that in order to match and eventually outperform CMOS performance, MTJ transducers’ efficiency has to be improved by 3-4 orders of magnitude. While it is clear that for the time being the MTJ-based-spintronic way cannot compete with CMOS, further technological transducer developments may tip the balance, which, when combined with information non-volatility, may make spintronic implementation for certain applications that require a large number of calculations and have a rather limited amount of interaction with the environment.

Spin-transfer torque magnetic random access memory (STT-MRAM) is a promising alternative to existing CMOS memory technologies due to its non-volatility, fast read access, and scalability potential. This has reached the level of industrial maturity as several foundries now offer this technology. However, it is sensitive to various failure mechanisms, such as manufacturing defects in both CMOS and magnetic layers, temperature variation, repetitive writes, and oxide breakdown, which can cause early cell failure leading to hard errors. This can severely impair the manufacturing yield and its large-scale industrial adoption. To ensure high manufacturing yield and infield reliability, we propose a new block error correction pointer (BECP) as a hard error correction technique for STT-MRAM. The proposed method divides large word lengths into smaller sub-blocks and assigns a specific base value per sub-block to determine the offset location of the hard error. This allows storing only the offset value instead of the absolute address of the hard error for each sub-block. The results depict that the proposed method is storage efficient and has low decoding complexity compared to the existing state-of-the-art methods. We incorporate experimental measurement data obtained from manufactured STT-MRAM chips at different die locations to get the hard error distribution. The proposed method aligns well with our specific STT-MRAM error distribution measurements.

The development of Spin-transfer torque magnetic RAM (STT-MRAM) mass production requires high-quality dedicated test solutions, for which understanding and modeling of manufacturing defects of the magnetic tunnel junction (MTJ) is crucial. This paper introduces and characterizes a new defect called Back-Hopping (BH); it also provides its fault models and test solutions. The BH defect causes MTJ state to oscillate during write operations, leading to write failures. The characterization of the defect is carried out based on manufactured MTJ devices. Due to the observed non-linear characteristics, the BH defect cannot be modelled with a linear resistance. Hence, device-aware defect modeling is applied by considering the intrinsic physical mechanisms; the model is then calibrated based on measurement data. Thereafter, the fault modeling and analysis is performed based on circuit-level simulations; new fault primitives/models are derived. These accurately describe the way the STT-MRAM behaves in the presence of BH defect. Finally, dedicated march test and a Design-for-Test solutions are proposed.

1-diode 1-Voltage controlled magnetic anisotropy (1D-1VCMA) can be an option for Storage Class Memory (SCM) to bridge the latency gap between DRAM and flash memory. It has low sneak current, high non-linearity and low IR drop. This paper presents the Design Technology Co-optimization (DTCO) study of 1D-1VCMA stack to improve the performance and energy. Thanks to precessional switching of VCMA, the write operation is very fast, but the read determines overall latency as read before write is needed to ensure reliable write operations. The read performance of 1D-1VCMA is penalized due to high VCMA MTJ resistance, hence impacting the overall performance. To improve the read performance, this paper explores two solutions: 1) reducing the VCMA RA product, and 2) improving the read circuit. These solutions improve the read performance by 36% and 260%, respectively.

The development of Spin-Transfer Torque Magnetic RAMs (STT-MRAMs) mass production requires high-quality test solutions. Accurate and appropriate fault modeling is crucial for the realization of such solutions. This paper targets fault modeling and test generation for all interconnect and contact defects in STT-MRAMs and shows that using the defect injection and circuit simulation for fault modeling without incorporating the impact of magnetic coupling will result in an incomplete set of fault models; hence, not obtaining accurate fault models. Magnetic coupling introduced by the stray field is an inherent property of STT-MRAMs and may foster the occurrence of additional memory faults. Not considering the magnetic coupling clearly will give rise to test escapes. The paper introduces a compact model for STT–MRAM that incorporates the intra- and inter-cell stray field, uses this model to derive the full set of fault models for interconnect and contact defects, and finally proposes an efficient test solution.

Main memory system design and corresponding technology requirements have become increasingly challenging for data-dominated high-performance applications. To address the leakage and scalability issues of the conventional DRAM-based memory, new memory technologies with ultra-low leakage and potential for high scalability have been explored extensively over the last decade. However, none of them are mature enough to serve as a drop-in replacement for DRAM. In this paper, we propose a hybrid main memory system solution for utilizing new memory technologies with specific features, based on the target application characteristics and system configurations. To this end, we examine two new memories, 1S-1VCMA and IGZO-based DRAM, along with conventional DRAM in the context of hybrid main memory solutions for high-capacity and low-power Pareto-optimizations, respectively. To better evaluate the power and performance, we consider the page-fault modeling in our evaluations. The results of the simulation show that different combinations of memory technologies in the hybrid memory system, different memory capacities, and different storage systems could provide a promising solution in the system regarding the characteristics of running applications and the requirements of the system.

Understanding defects in magnetic tunnel junctions (MTJs) and their faulty behaviors are paramount for developing high-quality test solutions for STT-MRAM. This article applies the advanced device-aware test to intermediate (IM) state defects in MTJ devices based on silicon measurements and circuit simulations. An IM state manifests itself as an abnormal third resistive state, which differs from the two bi-stable states of MTJ. We performed silicon measurements on MTJ devices with diameter ranging from 60 nm to 120 nm; the results show that the occurrence probability of IM state strongly depends on the switching direction, device size, and bias voltage. We demonstrate that the conventional resistor-based fault modeling and test approach fails to appropriately model and test such a defect. Therefore, device-aware test is applied. We first physically model the defect and incorporate it into a Verilog-A MTJ compact model and calibrate it with silicon data. Thereafter, this model is used for a systematic fault analysis based on circuit simulations to obtain accurate and realistic faults in a pre-defined fault space. Our simulation results show that an IM state defect leads to intermittent write transition faults. Finally, we propose and implement a device-aware test solution to detect the IM state defect.

Electromigration (EM) has been known as a reliability threatening factor for back-end-of-the-line interconnects. Spin-transfer torque magnetic RAM (STT-MRAM) is an emerging nonvolatile memory that has gained a lot of attention in recent years. However, relatively large operational current magnitude is a challenge for this technology, and hence, EM can be a potential reliability concern, even for the signal lines of this memory. A workload-aware EM modeling needs to capture time-dependent current density in the memory signal lines and to be able to predict the effect of the EM phenomenon on the interconnect for its entire lifetime. In this work, we present methods to effectively model the workload-dependent EM-induced meantime to failure (MTTF) in typical STT-MRAM arrays under a variety of realistic workloads. This allows performing the design-space exploration to co-optimize reliability and other design metrics.

The popularity of perpendicular magnetic tunnel junction (pMTJ)-based spin-transfer torque magnetic random access memories (STT-MRAMs) is growing very fast. The performance of such memories is very sensitive to magnetic fields, including both internal and external ones. This article presents a magnetic-field-aware compact model of pMTJ, named the MFA-magnetic tunnel junction (MTJ) model, for magnetic/electrical co-simulation of MTJ/CMOS circuits. Magnetic measurement data of MTJ devices, with diameters ranging from 35 to 175 nm, are used to calibrate an in-house magnetic coupling model. This model is subsequently integrated into our developed compact pMTJ model, which is implemented in Verilog-A. The superiority of the proposed MFA-MTJ model for device/circuit co-design of STT-MRAM is demonstrated by simulating a single pMTJ as well as STT-MRAM full circuits. The design space is explored under PVT variations and various configurations of magnetic fields.

Understanding the defects in magnetic tunnel junctions (MTJs) and their faulty behaviors are paramount for developing high-quality tests for STT-MRAM. This paper characterizes and models intermediate (IM) state defects in MTJs; IM state manifests itself as an abnormal third resistive state, apart from the two bi-stable states of MTJ. We performed silicon measurements on MTJ devices with diameter ranging from 60 nm to 120 nm; the results reveal that the occurrence probability of IM state strongly depends on the switching direction, device size, and applied bias voltage. To test such defect, appropriate fault models are needed. Therefore, we use the advanced device-aware modeling approach, where we first physically model the defect and incorporate it into a Verilog-A MTJ compact model and calibrate it with silicon data. Thereafter, we use a systematic fault analysis to accurately validate a theoretically predefined fault space and derive realistic fault models. Our simulation results show that the IM state defect causes intermittent write transition faults. This paper also demonstrates that the conventional resistor-based fault modeling and test approach fails in appropriately modeling IM defects, and hence incapable of detecting such defects.

STT-MRAM is one of the most promising emerging non-volatile memory technologies. As its mass production and deployment in industry is around the corner, high-quality yet cost-efficient manufacturing test solutions are crucial to ensure the required quality of products being shipped to end customers. This paper focuses on STT-MRAM testing, covering three abstraction levels: manufacturing defects, fault models, and test solutions. We first survey STT-MRAM manufacturing defect space and apply the conventional resistor-based test approach to develop test solutions. We then demonstrate with silicon measurements that this approach fails to appropriately model and test defects in STT-MRAM devices: magnetic tunnel junctions (MTJs), although it is qualified for interconnect/contact defects. Therefore, we propose a new test approach: device-aware test (DAT) to specifically target device-internal defects. We apply DAT to three key types of MTJ defects: pinhole, synthetic anti-ferromagnet flip, and intermediate state defects. After developing accurate defect models and calibrating them with silicon data, we perform comprehensive fault analyses based on SPICE circuit simulations to derive accurate and realistic fault models. Some STT-MRAM unique faults are identified, including both permanent faults and intermittent faults. Based on the obtained fault models, high-quality test solutions are proposed. Additionally, this paper also proposes a magnetic coupling model and a magnetic-field-aware compact MTJ model for fast and robust STT-MRAM designs.

As a unique mechanism for MRAMs, magnetic coupling needs to be accounted for when designing memory arrays. This paper models both intra- and inter-cell magnetic coupling analytically for STT-MRAMs and investigates their impact on the write performance and retention of MTJ devices, which are the data-storing elements of STT-MRAMs. We present magnetic measurement data of MTJ devices with diameters ranging from 35 nm to 175 nm, which we use to calibrate our intra-cell magnetic coupling model. Subsequently, we extrapolate this model to study inter-cell magnetic coupling in memory arrays. We propose the inter-cell magnetic coupling factor Ψ to indicate coupling strength. Our simulation results show that Ψ≈2% maximizes the array density under the constraint that the magnetic coupling has negligible impact on the device's performance. Higher array densities show significant variations in average switching time, especially at low switching voltages, caused by inter-cell magnetic coupling, and dependent on the data pattern in the cell's neighborhood. We also observe a marginal degradation of the data retention time under the influence of inter-cell magnetic coupling.

Understanding the manufacturing defects in magnetic tunnel junctions (MTJs), which are the data-storing elements in STT-MRAMs, and their resultant faulty behaviors are crucial for developing high-quality test solutions. This paper introduces a new type of MTJ defect: synthetic anti-ferromagnet flip (SAFF) defect, wherein the magnetization in both the hard layer and reference layer of MTJ devices undergoes an unintended flip to the opposite direction. Both magnetic and electrical measurement data of SAFF defect in fabricated MTJ devices is presented; it shows that such a defect reverses the polarity of stray field at the free layer of MTJ, while it has no electrical impact on the single isolated device. The paper also demonstrates that using the conventional fault modeling and test approach fails to appropriately model and test such a defect. Therefore device-aware fault modeling and test approach is used. It first physically models the defect and incorporate it into a Verilog-A MTJ compact model, which is afterwards calibrated with silicon data. The model is thereafter used for fault analysis and modeling within an STT-MRAM array; simulation results show that a SAFF defect may lead to an intermittent Passive Neighborhood Pattern Sensitive Fault (PNPSF1i) when all neighboring cells are in logic `1' state. Finally, test solutions for such fault are discussed.

We present for the first time a co-integrated FinFET with vertical nanosheet transistor (VFET) process on a 300 mm silicon wafer for STT-MRAM applications and its related avenues with a holistic design-technology-co-optimization (DTCO) and power-performance-area-cost (PPAC) approach. The STT-MRAM bitcell and a 2 Mbit macro have been optimized and designed to address the viability of the co-integration process and advantages of vertical channel transistors for STT-MRAM selectors. An architectural system simulator GEM5 has been also employed with Polybench workloads to assess energy saving at system-level. In order to enable this co-integration, four extra masks are required, which costs below 10% in embedded chips. A 36% area reduction can be achieved for the STT-MRAM bitcell implemented with VFET selectors. With a UVLT flavor, the STT-MRAM bitcell comprising of 3-nanosheet could deliver the same performance of the 4-fin LVT FinFET selector. A 2 Mbit STT-MRAM macro designed with VFET selector can offer a 17% and a 21% reduction for read access latency and energy per operation respectively, and a 10% for write energy per operation. A 7% energy saving for the STT-MRAM L2 cache using VFET selector has been observed at the system level with Polybench workloads.

The STT-MRAM manufacturing process involves not only traditional CMOS process steps, but also the integration of magnetic tunnel junction (MTJ) devices, the data-storing elements. This paper demonstrates a paradigm shift in fault modeling for STT-MRAMs by performing defect modeling and fault analysis for MTJ pinhole defects which are seen as a key type of STT-MRAM manufacturing defects. A Verilog-A compact model for defect-free MTJ devices is built and calibrated with electrical measurements on actual MTJ wafers. MTJs with a pinhole defect are extensively characterized, both during manufacturing test (t=0) and in the field (t>0), and the data is used to extend our defect-free MTJ compact model to include parameterized pinhole defects. The model is then used to perform single-cell static fault analysis and this shows not only what kind of faults can occur in an STT-MRAM, but also that the conventional fault modeling approach based on linear resistors cannot catch such behavior.

Spin Transfer Torque Magnetic RAM (STT-MRAM) is being extensively considered as a promising replacement for Last Level Caches (LLC), due to its high density, low leakage and non-volatility. However, writes to STT-MRAM are energy intensive and have a high latency. While the high dynamic energy consumption during writes can be compensated by the low static energy consumption, the high latency results in performance degradation. This work shows that in contrast to SRAM-based LLCs, the performance degradation for STT-MRAM is primarily due to bank contention, when trying to satisfy a read request while the bank is being written. We holistically explore the effects of cache banking and cache contention on energy and performance in the LLC of mobile multicore systems, with in-order cores or with out-of-order cores. The detail of the analysis is enabled by highly accurate cache models, based on a 28nm SRAM industry compiler, and an in-house developed STT-MRAM compiler, which generates full STT-MRAM macro designs with silicon-validated MTJ stack and complete parasitic extraction at the 28nm node. Our results show that there is a clear difference in the energy-performance optimal banking configuration between STT-MRAM caches and SRAM caches. These low contention STT-MRAM cache designs with the optimal number of banks save at least 60% cache energy while losing at most single digit percentages in system performance compared to SRAM cache designs. This show an increased potential of using STT-MRAM as a replacement for SRAM in an LLC.

Current main memory organizations in embedded and mobile application systems are DRAM dominated. The ever-increasing gap between today's processor and memory speeds makes the DRAM subsystem design a major aspect of computer system design. However, the limitations to DRAM scaling and other challenges like refresh provide undesired trade-offs between performance, energy and area to be made by architecture designers. Several emerging NVM options are being explored to at least partly remedy this but today it is very hard to assess the viability of these proposals because the simulations are not fully based on realistic assumptions on the NVM memory technologies and on the system architecture level. In this paper, we propose to use realistic, calibrated STT-MRAM models and a well calibrated cross-layer simulation and exploration framework, named SEAT, to better consider technologies aspects and architecture constraints. We will focus on general purpose/mobile SoC multi-core architectures. We will highlight results for a number of relevant benchmarks, representatives of numerous applications based on actual system architecture. The most energy efficient STT-MRAM based main memory proposal provides an average energy consumption reduction of 27% at the cost of 2x the area and the least energy efficient STT-MRAM based main memory proposal provides an average energy consumption reduction of 8% at the around the same area or lesser when compared to DRAM.

STT-MRAM (Spin Transfer Torque Magnetic Random Access Memory) has attracted considerable attention of late since it is the most promising logic compatible nonvolatile memory that is suitable for advanced logic nodes (N28 and beyond) in terms of endurance, speed and power. Embedded STT-MRAM has thus been proposed as a candidate for emerging low standby-power connectivity systems such IoT (Internet-of-Things) and wearables. We utilize the high performance CoFeB based perpendicular MTJ (pMTJ) device to realize a low power and highly dense STT-MRAM array for such systems. This study is carried out on the TSMC 28nm technology node and includes a complete cross-layer design and analysis framework ranging from device modeling to circuit design, layout and system implementation. The process variations and temperature (PT) impact on the MTJ for the STT-MRAM design (and correspondingly the total energy consumption and performance of the system) is also analyzed. We report a ∼85% reduction in the energy consumption compared to the baseline SRAM based system for near negligible performance penalty (<5%).

Spin-transfer torque magnetoresistance random access memory is a major contender for static random access memory replacement in embedded caches at advanced fin field effect transistor nodes. It suffers, however, from the low resistance difference between the bistable states of the magnetic tunnel junction (MTJ). Variability on MTJ resistance and access transistors makes reliable read-out even more challenging. This triggered the use of complementary cells for low level caches needing high performance. This paper, focusing on the lower level caches, shows an improved 3T 2MTJ cell with a ground grid and a novel three transistor read and write operation to improve area density, sense margin, write performance, and write energy consumption. Despite the cell's three transistors, the improved array configuration reduces the cell area by 22% as compared with the 2T 2MTJ cell, making it only 55% larger than a 1T 1MTJ cell. The novel mismatch tolerant read operation uses all three transistors and increases the sense margin by up to 88%. The novel variation resilient write operation also uses all three transistors and takes advantage of the inherent MTJ characteristics and complementary operation of the cell. This increases the write performance by 2× and reduces the write energy by 3× compared with the 2T 2MTJ cell and by 1.5× compared with the 1T 1MTJ cell.