Rung-Chuan Lin

dblp:20/2312 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 2006
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 1Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 100%
Artificial intelligence
1 paper
Learning paradigms · 50% Deep learning architectures and training · 50%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
semiconductor manufacturing
0.112006
A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing · ICRA 2006
Machine learning › Learning paradigms › supervised learning
neural network regression
0.012006
A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing · ICRA 2006
Machine learning › Deep learning architectures and training › feedforward neural network
radial basis function network
0.012006
A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing · ICRA 2006

Methods — techniques the papers use, named apart from their topics

sensor data analysis · 0.1radial basis function neural network · 0.1
YearPublicationVenuePosition
2006 A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing
abstract
For maintaining high stability and production yield of production equipment in a semiconductor fab, on-line quality monitoring of wafers is required. In current practice, physical metrology is performed only on monitoring wafers that are periodically added in production equipment for processing with production wafers. Hence, equipment performance drift happening in-between the scheduled monitoring cannot be detected promptly. This may cause defects of production wafers and the production cost. In this paper, a novel virtual metrology scheme (VMS) that is based on a radial basis function neural network (RBFN) is proposed for overcoming this problem. The VMS is capable of predicting quality of production wafers using real-time sensor data from production equipment. Consequently, equipment performance abnormality or drift can be detected timely. Finally, the effectiveness of the proposed VMS is validated by tests on chemical vapor deposition (CVD) processes in practical semiconductor manufacturing. It is therefore proved that RBFN can be effectively used to construct prediction models for CVD processes
Tung-Ho Lin, Min-Hsiung Hung, Rung-Chuan Lin, Fan-Tien Cheng
ICRA3