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Mohamed A. Osman

dblp:20/4583 · DBLP profile ↗
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2ranked-venue papers
0as first author
0since 2021 · last 1996
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 51% Electronic design automation · 49%
Interdisciplinary, comprehensive, and emerging computing
1 paper
Computational science and engineering · 100%

Topics — the 6 heaviest of 6, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
analog and mixed-signal circuits
0.011996
MOSFET global modeling for deep submicron devices with a modified BSIM1 SPICE model · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996
Electronic design automation
circuit simulation
0.011996
MOSFET global modeling for deep submicron devices with a modified BSIM1 SPICE model · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996
Integrated circuit design › analog and mixed-signal circuits › device modeling
MOSFET modeling
0.011996
MOSFET global modeling for deep submicron devices with a modified BSIM1 SPICE model · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996
Electronic design automation › circuit modeling
SPICE modeling
0.011996
MOSFET global modeling for deep submicron devices with a modified BSIM1 SPICE model · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996
Computational science and engineering
numerical analysis
0.011985
Advantages of Collocation Methods Over Finite Differences in One-Dimensional Monte Carlo Simulations of Submicron Devices · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1985
Integrated circuit design
semiconductor device modeling
0.011985
Advantages of Collocation Methods Over Finite Differences in One-Dimensional Monte Carlo Simulations of Submicron Devices · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1985

Methods — techniques the papers use, named apart from their topics

parameter extraction · 0.0BSIM1 · 0.0monte carlo simulation · 0.0finite difference · 0.0collocation methods · 0.0collocation method · 0.0
YearPublicationVenuePosition
1996 MOSFET global modeling for deep submicron devices with a modified BSIM1 SPICE model
abstract
A modified Berkeley short-channel IGFET model (BSIM1) has been developed to accurately model the I-V characteristics and circuit performance of deep submicron MOSFET devices. The improved model provides a simple and more efficient parameter acquisition procedure for MOSFET global modeling in comparison to the original BSIM1 model. The procedure for extracting the global geometry scalable model parameters is described. The extraction procedure provides a decoupling between DC and AC modeling resulting in more accurate time-domain circuit simulations. The proposed modeling procedure eliminates the negative conductance problem experienced in the original BSIM1. The validity of the model is supported by comparisons between measured and simulated results. The focus of this paper is on the digital applications of the BSIM1 SPICE model.
Mohamed A. Imam, Mohamed A. Osman, Ashraf A. Osman
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2
1985 Advantages of Collocation Methods Over Finite Differences in One-Dimensional Monte Carlo Simulations of Submicron Devices
abstract
Collocation methods are very useful when one-dimensional Monte Carlo simulations of semiconductor submicron devices require a very accurate solution of Poisson's equation. Potential and electric field may be solved simultaneously with better accuracy than using finite differences. The extension to two dimensions is also outlined. We present the results obtained for Monte Carlo simulation of submicron W/Si and AuGaAs Schottky barrier diodes under forward bias conditions. The accurate solution for the electric field at the ohmic contact boundary allows us to model the injected current and to account for depletion of carriers. Tunnelling effects across the barrier are also included in the simulation.
Umberto Ravaioli, Paolo Lugli, Mohamed A. Osman, David K. Ferry
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3