Reducing power consumption has become one of the primary challenges in chip design, and therefore significant efforts are being devoted to find holistic solutions on power reduction from the device level up to the system level. Among a plethora of low power devices that are being explored, single-electron transistors (SETs) at room temperature are particularly attractive. Although prior work has proposed a binary decision diagram-based reconfigurable logic architecture using SETs, it lacks an automatic synthesis algorithm for the architecture. Consequently, in this work, we develop a product-term-based approach that synthesizes a logic circuit by mapping all its product terms into the SET architecture. The experimental results show the effectiveness and efficiency of the proposed approach on a set of MCNC benchmarks.

Reducing power consumption has become one of the primary challenges in chip design, and therefore significant efforts are being devoted to find holistic solutions on power reduction from the device level up to the system level. Among a plethora of low power devices that are being explored, single-electron transistors (SETs) at room temperature are particularly attractive. Although prior work has proposed a binary decision diagram-based reconfigurable logic architecture using SETs, it lacks an automated synthesis tool for the device. Consequently, in this work, we develop a product-term-based approach that synthesizes a logic circuit by mapping all its product terms into the SET architecture. The experimental results show the effectiveness and efficiency of the proposed approach on a set of MCNC benchmarks.

We propose novel techniques to minimize the power and performance penalties in protecting the NoC against soft errors, while giving desired reliability guarantees. Some applications have inherent error tolerance which can be exploited to save power, by turning off the error correction mechanisms for a fraction of the total time without trading off reliability. To further increase the power savings, we bound the vulnerability of a router by throttling the traffic into the router. In order to minimize the throughput loss due to throttling, we propose dividing the die into domains and using multiple vulnerability bounds across these domains. We explore both static and dynamic selection of vulnerability bounds. We find that for applications with an error tolerance of 10% of the raw error rate, the dynamic multiple vulnerability bound scheme can save up to 44% of power expended for error correction at a marginal network throughput loss of 3%.

Performance and power consumption of an on-chip interconnect that forms the backbone of chip multiprocessors (CMPs), are directly influenced by the underlying network topology. Both these parameters can also be optimized by application induced communication locality since applications mapped on a large CMP system will benefit from clustered communication, where data is placed in cache banks closer to the cores accessing it. Thus, in this paper, we design a hierarchical network topology that takes advantage of such communication locality. The two-tier hierarchical topology consists of local networks that are connected via a global network. The local network is a simple, high-bandwidth, low-power shared bus fabric, and the global network is a low-radix mesh. The key insight that enables the hybrid topology is that most communication in CMP applications can be limited to the local network, and thus, using a fast, low-power bus to handle local communication will improve both packet latency and power-efficiency. The proposed hierarchical topology provides up to 63% reduction in energy-delay-product over mesh, 47% over flattened butterfly, and 33% with respect to concentrated mesh across network sizes with uniform and non-uniform synthetic traffic. For real parallel workloads, the hybrid topology provides up to 14% improvement in system performance (IPC) and in terms of energy-delay-product, improvements of 70%, 22%, 30% over the mesh, flattened butterfly, and concentrated mesh, respectively, for a 32-way CMP. Although the hybrid topology scales in a power- and bandwidth-efficient manner with network size, while keeping the average packet latency low in comparison to high radix topologies, it has lower throughput due to high concentration. To improve the throughput of the hybrid topology, we propose a novel router micro-architecture, called XShare, which exploits data value locality and bimodal traffic characteristics of CMP applications to transfer multiple small flits over a single channel. This helps in enhancing the network throughput by 35%, providing a latency reduction of 14% with synthetic traffic, and improving IPC on an average 4% with application workloads.

Performance and power are the first order design metrics for Network-on-Chips (NoCs) that have become the de-facto standard in providing scalable communication backbones for multicores/CMPs. However, NoCs can be plagued by higher power consumption and degraded throughput if the network and router are not designed properly. Towards this end, this paper proposes a novel router architecture, where we tune the frequency of a router in response to network load to manage both performance and power. We propose three dynamic frequency tuning techniques, FreqBoost, FreqThrtl and FreqTune, targeted at congestion and power management in NoCs. As enablers for these techniques, we exploit Dynamic Voltage and Frequency Scaling (DVFS) and the imbalance in a generic router pipeline through time stealing. Experiments using synthetic workloads on a 8x8 wormhole-switched mesh interconnect show that FreqBoost is a better choice for reducing average latency (maximum 40%) while, FreqThrtl provides the maximum benefits in terms of power saving and energy delay product (EDP). The FreqTune scheme is a better candidate for optimizing both performance and power, achieving on an average 36% reduction in latency, 13% savings in power (up to 24% at high load), and 40% savings (up to 70% at high load) in EDP. With application benchmarks, we observe IPC improvement up to 23% using our design. The performance and power benefits also scale for larger NoCs.

Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core/SoC systems in deep sub-micron technology. However, almost all prior studies have focused on 2D NoC designs. Since three dimensional (3D) integration has emerged to mitigate the interconnect delay problem, exploring the NoC design space in 3D can provide ample opportunities to design high performance and energy-efficient NoC architectures. In this paper, we propose a 3D stacked NoC router architecture, called MIRA, which unlike the 3D routers in previous works, is stacked into multiple layers and optimized to reduce the overall area requirements and power consumption. We discuss the design details of a four-layer 3D NoC and its enhanced version with additional express channels, and compare them against a (6times6) 2D design and a baseline 3D design. All the designs are evaluated using a cycle-accurate 3D NoC simulator, and integrated with the Orion power model for performance and power analysis. The simulation results with synthetic and application traces demonstrate that the proposed multi-layered NoC routers can outperform the 2D and naive 3D designs in terms of performance and power. It can achieve up to 42% reduction in power consumption and up to 51% improvement in average latency with synthetic workloads. With real workloads, these benefits are around 67% and 38%, respectively.

Field programmable gate arrays (FPGAs) are important hardware platforms in various applications due to increasing design complexity and mask costs. However, as CMOS process technology continues to scale, standard copper interconnect becomes a major bottleneck for FPGA performance. This paper proposed utilizing bundles of single-walled carbon nanotubes (SWCNT) as wires in the FPGA interconnect fabric and compare their performance to standard copper interconnect in future process technologies. To leverage the performance advantages of nanotube-based interconnect, several important aspects of the FPGA routing architecture were explored including the segmentation distribution and the internal population of the wires. The results demonstrate that FPGAs utilizing SWCNT bundle interconnect can achieve a 19% improvement in average area delay product over the best performing architecture for standard copper interconnect in 22 nm process technology