The system-on-chip (SoC) designs for future Internet of Things (IoT) systems, spanning client platforms to cloud datacenters, need to deliver uncompromising and scalable performance with extreme energy efficiency for diverse workloads and applications, while satisfying a wide range of energy budgets, as well as platform cooling and power delivery constraints. Low-latency, burst-mode responsiveness, and scalable high-throughput performance must be delivered on demand for a range of thread-parallel, task-parallel, and data-parallel workloads covering traditional and emerging applications. This article discusses the challenges and opportunities for many-core SoC design in scaled CMOS process operating over a wide voltage-frequency range including near-threshold-voltage (NTV) that can meet the compute demands of the future at scale, flexibly, and efficiently. This article covers: 1) circuit design techniques for NTV cores; 2) mitigation techniques for within-die parameter variations via multivoltage frequency schemes; 3) digital integrated voltage regulators (VRs) for fine-grain and wide-range voltage modulation; and 4) radiation-induced soft error rate (SER) characterization and mitigation techniques to enable reliable operation at NTV. Silicon prototype examples will be used to illustrate the different techniques and highlight future research directions.

Moore's Law will continue providing abundance of transistors for integration, only to be limited by the energy consumption. Near threshold voltage (NTV) operation has potential to improve energy efficiency by an order of magnitude. We discuss design techniques necessary for reliable operation over a wide range of supply voltage---from nominal down to subthreshold region. The system designed for NTV can dynamically select modes of operation, from high performance, to high energy efficiency, to the lowest power.

We used an iterative process to design firewall warnings in which the functionality of a personal firewall is visualized based on a physical security metaphor. We performed a study to determine the degree to which our proposed warnings are understandable for users, and the degree to which they convey the risks and encourage safe behavior as compared to text warnings based on those from a popular personal firewall. The evaluation results show that our warnings facilitate the comprehension of warning information, better communicate the risk, and increase the likelihood of safe behavior. Moreover, they provide participants with a better understanding of both the functionality of a personal firewall and the consequences of their actions.

This paper describes a process compensating dynamic (PCD) circuit technique for maintaining the performance benefit of dynamic circuits and reducing the variation in delay and robustness. A variable strength keeper that is optimally programmed based on the die leakage, enables 10% faster performance, 35% reduction in delay variation, and 5times reduction in the number of robustness failing dies, compared to conventional designs. A new leakage current sensor design is also presented that can detect leakage variation and generate the keeper control signals for the PCD technique. Results based on measured leakage data show 1.9-10.2times higher signal-to-noise ratio (SNR) and reduced sensitivity to supply and p-n skew variations compared to prior leakage sensor designs

This paper describes an improved version of the Tenca-Koc unified scalable radix-2 Montgomery multiplier with half the latency for small and moderate precision operands and half the queue memory requirement. Like the Tenca-Koc multiplier, this design is reconfigurable to accept any input precision in either GF(p) or GF(2/sup n/) up to the size of the on-chip memory. An FPGA implementation can perform 1024-bit modular exponentiation in 16 ms using 5598 4-input lookup tables, making it the fastest unified scalable design yet reported.

Increasing leakage current and aggravating process variations are showing impact on dynamic circuit performance and robustness as technology scales into the nanometer regime. This paper describes a self-calibrating process compensating dynamic (PCD) circuit technique for maintaining the performance benefit of dynamic circuits and reducing the variation in delay and robustness. A variable strength keeper that is optimally programmed based on the die leakage enables 10% faster performance, 35% reduction in delay variation, and 5/spl times/ reduction in the number of robustness failing dies compared to conventional designs. A new leakage current sensor design is also presented that can detect leakage variation and generate the keeper control signals for the PCD technique. The proposed 6-channel leakage current sensor enables high-resolution on-chip leakage measurements from multiple locations of a die, saving testing cost and realizing both die-to-die and within-die process compensation. Results based on measured leakage data show 1.9-10.2/spl times/ higher signal-to-noise ratio and reduced sensitivity to supply and P/N skew variations compared to prior leakage sensor designs. The PCD technique with the on-die leakage current sensor is applied to a 2-read, 2-write ported 128 /spl times/ 32b register file and a test chip is fabricated in 1.2V, 90nm dual-V, CMOS process.

In high performance microprocessors, integer execution cores are one of the hottest thermal spots and peak current/power delivery limiters. This paper describes a dual-supply and dual-threshold optimized 32-bit integer execution ALU and register file loop for 8.3GHz operation in 1.2V, 90nm CMOS technology. Aggressive supply/threshold scaling on the ALU and nominal supply/threshold on the register file enables up to 25% peak energy reduction without sacrificing performance or array bit-cells stability. A hybrid split-output style CVSL sequential level converter at the ALU-register file interface is also described for robust, DC power free dual-Vcc operation. The proposed sequential occupies 10% smaller area, and saves 11% active leakage power and 14% worst case switching power as compared to conventional CVSL style sequential at the same performance

This paper compares the effectiveness of different leakage control techniques in deep submicron (DSM) bulk CMOS technologies. Simulations show that the 3-5x increase in IOFF/mm per generation is offsetting the savings in switching energy obtained from technology scaling. We compare both the transistor IOFF reduction and ION degradation due to each technique for the 130nm-70nm technologies. Our results indicate that the effectiveness of leakage control techniques and the associated energy vs. delay tradeoffs depend on the ratio of switching to leakage energies for a given technology. We use our findings to design a 70nm low power word line driver scheme for a 256 entry, 64-bit register file (RF). As a result, the leakage (total) energy of the word line drivers is reduced by 3x(2.5x) and for the RF by up to 35%(25%) respectively.

As pipeline width and depth grow to improve performance, memory arrays in microprocessors are growing in entries and ports. Arrays will increase in physical size, which prolongs the access time due to wiring delay. In order to boost clock frequency, these memory arrays must take multiple cycles to complete an access. This delays the scheduling of dependent instructions and affects overall performance. This paper proposes a different circuit organization to enable fast and slow accesses solely dependent on physical locality. Since the access time depends on a fixed physical location, it is pre-determined to scheduling dependent instructions. Furthermore, this paper presents a mechanism to re-configure the address decoding of the physical register file to increase the occurrence of fast accesses. Detailed circuit simulation using this proposed method determines the access cycle time. Reduction in average access cycle time for the register file and the first level data cache recovers 73% of the IPC degradation.