This paper presents a picture partitioning design of Neural Network-based Intra Coding (NNIC) for Video Coding for Machines (VCM). The proposed design introduces adaptive auto-encoder and probability model processing, and a new unit for the partitions of a NNIC picture. In conscious with the causality of the transmission order of the partitions, the adaptive auto-encoder processing exploits more the correlations of pixel values around the partition boundaries than a conventional design. Therefore it can bring coding gains while keeping low-delay video transmission capability. The adaptive probability model processing allows both encoder and decoder to start their entropy coding and decoding with the same delay as the conventional design. The new unit makes the picture partition signaling of NNIC compatible with that of Versatile Video Coding (VVC) forming the inner video coding of VCM. Simulation results show that, compared to the conventional, the proposal can attain the bit rate reduction of 11% on average with respect to machine tasks.

The communication latency is a primary concern for designing Network-on-Chips (NoCs) since it significantly affects the parallel application performance on a many-core computer system. To reduce the communication latency, we propose an on-chip router that (de)compresses the contents of an incoming packet before completing switch arbitration. The compression router thus has no latency penalty for the compression operation, whereas it shortens a packet length that decreases the network injection-and-ejection latency. Evaluation results show that the compression router improves 7.7% of the parallel application performance (IS, CG, FT, and TSP) and 49% of the effective network throughput by 1.8 compression ratio on NoC. The drawback is that the router area and its energy consumption per bit increase by 0.12mm2and 1.4 times compared to the conventional virtual-channel router.

Wireless interconnects based on inductive coupling technology are compelling propositions for designing 3-D integrated chips. This work addresses the heat dissipation problem on such systems. Although effective cooling technologies have been proposed for systems designed based on Through Silicon Via (TSV), their application to systems that use inductive coupling is problematic because of increased wireless-communication distance. For this reason, we propose two methods for designing sparse 3-D chips layouts and Networks on Chip (NoCs) based on inductive coupling. The first method computes an optimized 3-D chip layout and then generates a randomized network topology for this layout. The second method uses a standard stack chip layout with a standard network topology as a starting point, and then deterministically transforms it into either a "staircase" or a "checkerboard" layout. We quantitatively compare the designs produced by these two methods in terms of network and application performance. Our main finding is that the first method produces designs that ultimately lead to higher parallel application performance, as demonstrated for nine OpenMP applications in the NAS Parallel Benchmarks.

A key concern for a high-power processor is heat dissipation, which limits the power, and thus the operating frequencies, of chips so as not to exceed some temperature threshold. In particular, 3-D chip integration will further increase power density, thus requiring more efficient cooling technology. While air, fluorinert and mineral oil have been traditionally used as coolants, in this study, we propose to directly use tap or natural water due to its superior thermal conductivity. We have developed the "in-water computer" prototypes that rely on a parylene film insulation coating. Our prototypes can support direct water-immersion cooling by taking and draining natural water, while existing cooling requires the secondary coolant (e.g. outside air in cold climates) for cooling the primary coolants that contact chips. Our prototypes successfully reduce by 20 degrees the chip temperature of commodity processor chips. Our analysis results show that the in-water cooling increases the acceptable amount of power density of chips, thus achieving higher operating frequencies of chips. Through a full-system simulation, our results show that the water-immersion chip multiprocessors outperform the counterpart water-pipe cooled and oil-immersion chips by up to 14% and 4.5%, respectively, in terms of execution times of NAS Parallel Benchmarks.