Demo Data from VLDB 2026 / reviewers in the wild / expert
Wangyong Chen
dblp:242/9919
· DBLP profile ↗
4ranked-venue papers
1as first author
3since 2021 · last 2026
—ORCID · conflict
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 2 · 1 since 2021Artificial intelligence and machine learning · 1 · 1 since 2021Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Storage systems · 52% Hardware reliability and fault tolerance · 30% Integrated circuit design · 18% |
Topics — the 6 heaviest of 6, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Hardware reliability and fault tolerance › aging
electromigration reliability |
0.5 | 1 | 2021 | A physics-based electromigration reliability model for interconnects lifetime prediction · Sci. China Inf. Sci. 2021 |
Storage systems › flash and SSD › flash memory › NAND flash
3D NAND flash |
0.4 | 1 | 2019 | Modeling of program Vth distribution for 3-D TLC NAND flash memory · Sci. China Inf. Sci. 2019 |
Storage systems › flash and SSD
flash memory |
0.4 | 1 | 2019 | Modeling of program Vth distribution for 3-D TLC NAND flash memory · Sci. China Inf. Sci. 2019 |
Integrated circuit design
memory circuit design |
0.4 | 1 | 2019 | Modeling of program Vth distribution for 3-D TLC NAND flash memory · Sci. China Inf. Sci. 2019 |
Storage systems › flash and SSD › flash memory
NAND flash |
0.4 | 1 | 2019 | Modeling of program Vth distribution for 3-D TLC NAND flash memory · Sci. China Inf. Sci. 2019 |
Hardware reliability and fault tolerance › reliability analysis
interconnect reliability |
0.1 | 1 | 2021 | A physics-based electromigration reliability model for interconnects lifetime prediction · Sci. China Inf. Sci. 2021 |
Methods — techniques the papers use, named apart from their topics
physics-based modeling · 0.5
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | Zero-temperature-coefficient-powered design technology co-optimization for temperature-immune digital circuits
Wangyong Chen, Ling Xiong, Songxuan He, Linlin Cai |
Integr. | 1 |
| 2026 | Structural change point detection in temporal networks via MDL-guided tensor decomposition
Xianbin Huang, Wangyong Chen, Yuechi Huang |
Pattern Recognit. | 4 |
| 2021 | A physics-based electromigration reliability model for interconnects lifetime prediction
Linlin Cai, Wangyong Chen, Jinfeng Kang, Gang Du |
Sci. China Inf. Sci. | 2 |
| 2019 | Modeling of program Vth distribution for 3-D TLC NAND flash memory
Kunliang Wang, Gang Du, Zhiyuan Lun, Wangyong Chen |
Sci. China Inf. Sci. | 4 |