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Chunhua Yao

dblp:25/4919 · DBLP profile ↗
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6ranked-venue papers
5as first author
0since 2021 · last 2019
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 6 · 5 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 93% Energy-efficient computing · 7%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
hardware verification and test
0.112011
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2011
Electronic design automation › hardware verification and test › test scheduling
power-aware test scheduling
0.112011
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2011
Electronic design automation › hardware verification and test
test scheduling
0.112011
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2011
Electronic design automation › hardware verification and test › test scheduling
thermal-aware test scheduling
0.112011
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2011
Energy-efficient computing
thermal management
0.012011
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2011

Methods — techniques the papers use, named apart from their topics

thermal simulation · 0.1superposition principle · 0.1
YearPublicationVenuePosition
2019 Application of improved distributed naive Bayesian algorithms in text classification
Hongyi Gao, Chunhua Yao
J. Supercomput.3
2011 Temperature Dependent Test Scheduling for Multi-core System-on-Chip
abstract
Recent research has shown that some defects are detect resilient under normal or high temperature, therefore tests for those defects must be applied under lower temperature. On the other hand, some tests need to be applied under high temperature to improve the detection sensitivity. Thus temperature dependent testing which applies tests at different temperature ranges is needed. This paper discusses and gives a formulation of the temperature dependent test scheduling problem. In the proposed test scheduling scheme, each test is associated with a lower temperature bound and an upper temperature bound to define the temperature range within which the test must be applied. A list schedule based test scheduling algorithm is proposed to find the earliest starting time of each test. Cooling period is inserted when the core temperature is too high and heating sequence is applied when the core temperature is below the required specified temperature for the core. Simulation studies are performed for ITC'02 SoC benchmarks and test scheduling results are shown.
Chunhua Yao, Kewal K. Saluja, Parameswaran Ramanathan
Asian Test Symposium1
2011 Calibrating On-chip Thermal Sensors in Integrated Circuits: A Design-for-Calibration Approach
Chunhua Yao, Kewal K. Saluja, Parameswaran Ramanathan
J. Electron. Test.1
2011 Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies
abstract
Conventional power constrained test scheduling methods do not guarantee a thermal-safe solution. In this paper, we propose a test scheduling algorithm that satisfies the resource, power, and thermal constraints. First, in contrast to existing schemes, the proposed algorithm exploits superposition principle to perform fast and accurate thermal simulation, which, in turn, allows the algorithm to search for solutions which introduce cooling periods between tests to reduce the overall test length. Second, we propose a test partition-based method to further improve the performance of the test scheduling. We apply our test scheduling algorithm to ITC'02 SoC benchmarks and the results show considerable improvement in the total test length over existing methods.
Chunhua Yao, Kewal K. Saluja, Parameswaran Ramanathan
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
2009 Partition Based SoC Test Scheduling with Thermal and Power Constraints under Deep Submicron Technologies
abstract
For core-based system-on-chip (SoC) testing, conventional power-constrained test scheduling methods do not guarantee a thermal-safe solution. Also, most of the test scheduling schemes make poor assumptions about power consumption. In deep submicron era, leakage power and wake-up power consumption can not be neglected. In this paper, we propose a partition based thermal-aware test scheduling algorithm with more realistic assumptions of recent SoCs. In our test scheduling algorithm, each test is partitioned and the earliest starting time of each partition is searched. To reduce the execution time of thermal simulation, we also exploit superposition principle to compute the power and thermal profile rapidly and accurately. We apply our test scheduling algorithm to ITC'02 SoC benchmarks and the results show improvements in the total test time over scheduling schemes without partitioning.
Chunhua Yao, Kewal K. Saluja, Parameswaran Ramanathan
Asian Test Symposium1
2009 Power and thermal constrained test scheduling
abstract
We propose a test scheduling algorithm that ensures the resource compatibility and satisfies both power and thermal constraints. The proposed algorithm can start a test at an arbitrary time and it has the capability of delaying a test to let a core cool down to find a valid schedule even when traditional scheduling schemes cannot find a solution. To reduce the execution time of thermal simulation, we exploit superposition principle to compute the thermal profile rapidly and accurately. We apply our scheduling algorithm to ITC'02 SoC benchmarks and the results show a remarkable improvement in the total test length over other methods, while meeting the thermal and power constraints.
Chunhua Yao, Kewal K. Saluja, Parameswaran Ramanathan
ITC1