In order to increase the circuit yield, 2.5D technology have been introduced to partition a single large circuit in multiple circuits, which are tested before bonding and then assembled in 3D onto a passive silicon interposer. Active interposer is nowadays envisioned in order to provide added values within the interposer and the 3D complete system. The testability of 2.5D interposers have already been well studied but no 3D DFT have already been proposed for active interposers. In this paper, a 3D Design-for-Test architecture is proposed for testing multi-chips stacked onto an active interposer. The 3D-DFT is based on a chiplet footprint architecture, allowing the modular test of any chiplets, and is implemented using IJTAG IEEE1687 standard, offering easy test pattern retargeting from chiplet pre-bond test to the 3D circuit final test. The proposed 3D-DFT architecture and the associated 3D test flow have been fully applied onto a 3D active interposer circuit prototype and used extensively to test interposer active links, interposer passive links and all embedded memory BIST engines.

High quality is an absolute necessity for automotive designs. This paper describes an approach to improve the overall defect coverage for CMOS-based high quality automotive designs. We present results from a cell-aware (CA) characterization flow for 216 cells, the pattern generation flow for a 130nm smart power design, and high-volume production test results achieved after testing multimillion parts. The idea behind CA tests is to detect cell-internal (CI) bridges, opens, leaking and high resistive transistor defects which are undetected with state-of-the-art tests. The production test results have shown that the CA tests detect various failing parts during a first wafer sort test which still resulted into unique failing parts after a second wafer sort test done at a different temperature and with additional tests. The obtained results encouraged us to continue this work beyond this paper to run further experiments with the final goal to eliminate the stuck-at (SA) and transition delay (TR) test by simultaneously improving the quality with CA tests which are a superset of SA and TR tests.

This paper describes the new cell-aware test (CAT) approach, which enables a transistor-level and defect-based ATPG on full CMOS-based designs to significantly reduce the defect rate of manufactured ICs, including FinFET technologies. We present results from a defect-oriented CAT fault model generation for 1,940 standard library cells, as well as the application of CAT to several industrial designs. We present high volume production test results from a 32 nm notebook processor and from a 350 nm automotive design, including the achieved defect rate reduction in defective-parts-per-million. We also present CAT diagnosis and physical failure analysis results from one failing part and give an outlook for using the functionality for quickly ramping up the yield in advanced technology nodes.

This tutorial will give an introduction to a new defect-oriented test method called cell-aware. This new cell-aware method takes the layout of standard library cells into account when creating the cell-aware ATPG library view. The tutorial will cover the whole cell-aware library characterization flow consisting of a layout extraction step, an analog fault simulation step of all cell-internal bridges and opens and the cell-aware synthesis step to create the new cell-aware ATPG library views, which finally can be used in a normal chip design flow to generate production test patterns. These cell-aware production test patterns have a significantly higher quality than state-of-the-art patterns. Finally, production test results from several hundred thousand tested IC's are presented showing significant reduction of DPPM rates.

This paper describes a new approach for significantly improving overall defect coverage for CMOS-based designs. We present results from a defect-oriented cell-aware (CA) library characterization and pattern-generation flow and its application to 1,900 cells of a 32-nm technology. The CA flow enabled us to detect cell-internal bridges and opens that caused static, gross-delay, and small-delay defects. We present highvolume production test results from a 32-nm notebook processor to which CA test patterns were applied, including the defect rate reduction in PPM that was achieved after testing 800,000 parts. We also present cell-internal diagnosis and physical failure analysis results from one failing part.

This paper focuses on a new approach to significantly improve the overall defect coverage for CMOS-based designs with the final goal to eliminate any system-level test. This methodology describes the pattern generation flow for detecting cell-internal small-delay defects caused by cell-internal resistive bridges. Results have been evaluated on 1,900 library cells of a 32-nm technology. First production test results are presented from evaluating additional defect detections achieved with different fault models on a 45-nm design.

It was shown in the past that ATPG based on the Boolean Satisfiability problem is a beneficial complement to traditional ATPG techniques. Its advantages can be observed especially on large industrial circuits. These circuits usually contain a lot of functional redundancy which, on the one hand, is often needed during operational mode, but on the other hand, causes dispensable overhead during ATPG. Using the traditional circuit-to-CNF transformation, this redundancy is also contained in the SAT instances. The contribution of this paper is a new technique to improve the SAT instance generation for SAT-based ATPG. The objective of the proposed method is to use Binary Decision Diagrams (BDDs) to optimize the resulting CNF representations. In order to apply the proposed technique to industrial circuits, we developed dedicated BDD operations using a multiple-valued logic. The experimental results, obtained on large industrial designs, show that the accomplished optimizations result in a considerable acceleration of the overall ATPG runtime as well as in a significant reduction of the unclassified faults.

Industry is facing very high quality requirements for today's and tomorrow's ICs. Especially in the automotive market these quality requirements need to be fulfilled. To achieve this we need to improve currently used test methods and fault models to improve the overall defect coverage. This paper presents two new methodologies to significantly improve this situation. One method will focus on cell-internal Bridges over a wide range of Bridge resistor values and the second method concentrates on library cell-internal high-resistive Open defects. The fault models used during the ATPG are enhanced to directly target the layout-based intra-cell Open and Bridge defects. Both methods have been evaluated on 1500 library cells of a 65nm technology. In addition the wide range of intracell Bridges has been evaluated on 10 real industrial designs with up to 60 million faults. Various results are presented from all 1500 library cells and from the 10 industrial designs as well.

Industry is facing increasingly tougher quality requirements for more complex ICs. To meet these quality requirements we need to improve the defect coverage. This paper presents a new methodology to significantly increase the defect coverage of the test patterns generated by ATPG tools. The fault model used during the ATPG is enhanced to directly target layout-based intra-cell faults. In contrast to previous techniques, such as gate-exhaustive, N-detect, or embedded-multi-detect, which either are too complex for real-world designs or merely improve the probability of detecting intra-cell defects, the new approach targets the actual root causes of intra-cell defects. The newly proposed cell-aware-methodology has been evaluated for 90 nm and 65 nm technologies on 1671 library cells and on 10 real industrial designs with up to 50 million faults. The experimental results show an average increase of 1.2% in defect coverage and a reduction of 420 ppm in escape rate for a 50 mm2design.

Programmable mixed-mode BIST schemes combine pseudo-random pattern testing and deterministic test. This paper presents a synthesis technique for a mixed-mode BIST scheme which is able to exploit the regularities of a deterministic test pattern set for minimizing the hardware overhead and memory requirements. The scheme saves more than 50% hardware costs compared with the best schemes known so far while complete programmability is still preserved.

A high-performance resistive bridging fault simulator SUPERB (Simulator Utilizing Parallel Evaluation of Resistive Bridges) is proposed. It is based on fault sectioning in combination with parallel-pattern or parallel-fault multiple-stuck-at simulation. It outperforms a conventional interval-based resistive bridging fault simulator by three orders of magnitude while delivering identical results. Further competing tools are outperformed by several orders of magnitude. Industrial-size circuits, including a multi-million-gates design, could be simulated with runtimes within an order of magnitude of the runtimes for pattern-parallel stuck-at fault simulation.

We report the successful application of a resistive bridging fault (RBF) simulator to industrial benchmark circuits. Despite the slowdown due to the consideration of the sophisticated RBF model, the run times of the simulator were within an order of magnitude of the run times for pattern-parallel complete-circuit stuck-at fault simulation. Industrial-size circuits, including a multi-million-gates design, could be simulated in reasonable time despite a significantly higher number of faults to be simulated compared with stuck-at fault simulation.

Due to the rapidly growing size of integrated circuits, there is a need for new algorithms for automatic test pattern generation (ATPG). While classical algorithms reach their limit, there have been recent advances in algorithms to solve Boolean Satisfiability (SAT). Because Boolean SAT solvers are working on conjunctive normal forms (CNFs), the problem has to be transformed. During transformation, relevant information about the problem might get lost and, therefore, is not available in the solving process. In this paper, we present a technique that applies structural knowledge about the circuit during the transformation. As a result, the size of the problem instances decreases, as well as the run time of the ATPG process. The technique was implemented, and experimental results are presented. The approach was combined with the ATPG framework of NXP Semiconductors. It is shown that the overall performance of an industrial framework can significantly be improved. Further experiments show the benefits with regard to the efficiency and robustness of the combined approach.

Despite the recent advances in ATPG technology computing test patterns for state-of-the-art industrial designs can demand an enormous amount of computation time. Numerous structural techniques were presented to reduce the search space and hence the runtime of state-of-the-art ATPG tools. Absolute dominators introduced by Kirkland and Mercer proved to be useful for finding mandatory observation nodes in a combinational circuit. A mandatory observation node denotes a gate which must be visited in order to propagate a fault to at least one primary output. Unfortunately their algorithm to compute absolute dominators does not scale well on large industrial designs. In this paper we propose a new algorithm to find absolute dominators in circuit graphs. The experimental results show a significant performance improvement with respect to runtime and memory consumption. The achieved speedup of three orders of magnitude on several designs enables the computation of absolute dominators in large industrial circuits in less than a second.

A special logic synthesis problem is considered for Booleanfunctions which have large don't care sets and are irregular. Here, a function is considered as irregular if the input assignmentsmapped to specified values ('1' or '0') are randomly spread overthe definition space. Such functions can be encountered in the field of design for test. The proposed method uses ordered BDDs forlogic manipulations and generates free BDD-like covers. For the considered benchmark functions, implementations were found witha significant reduction of the node/gate count as compared to SISor to methods offered by a state-of-the-art BDD package.

In this paper, we propose a new programmable deterministic built-in self-Test (BIST) method that requires significantly lower storage for deterministic patterns than existing programmable methods and provides high flexibility for test engineering in both internal and external test. Theoretical analysis suggests that significantly more care bits can be encoded in the seed of a linear feedback shift register (LFSR), if a limited number of conflicting equations is ignored in the employed linear equation system. The ignored care bits are separately embedded into the LFSR pattern. In contrast to known deterministic BIST schemes based on test set embedding, the embedding logic function is not hardwired. Instead, this information is stored in memory using a special compression and decompression method. Experiments for benchmark circuits and industrial designs demonstrate that the approach has considerably higher overall coding efficiency than the existing methods.

Due to the rapidly growing speed and the decreasing size of gates in modern chips, the probability of faults caused by the production process grows. Already small variations lead to functional failures. Therefore, dynamic fault models like the path delay fault model (PDFM) have become more important in the last years. At the same time, classical algorithms for test pattern generation reach their limits due to the steadily increasing complexity of modern circuits. In this work, a SAT-based approach to calculate robust and non-robust test patterns for path delay faults (PDF) is presented. In contrast to previous approaches, the sequential behavior of a circuit is modeled adequately. Moreover, tri-state elements and environment constraints that occur in industrial practice can be handled. The encoding to apply a Boolean SAT solver for this problem is motivated and explained in detail. Experimental results for large industrial circuits show the efficiency of this approach.

This paper shows that accurate fault detection and diagnosis are possible when applying a parity tree for space compaction of test responses and continuously observing the parity-tree output. We exploit that each set of faults results in a unique parity-tree output sequence that can be used as a unique fault signature for truly accurate fault detection and diagnosis. Our theoretical analysis shows that probabilities for fault cancellation and fault aliasing are extremely low and decrease with circuit size. Experimental results show that for a typical scan chain architecture in large industrial circuits, fault coverage is not affected by parity-tree space compaction for up to 256 scan chains, while diagnostic resolution is reduced by only 1% to 2%.

BIST is an attractive approach to detect delay faults due to its inherent support for at-speed test. Deterministic logic BIST (DLBIST) is a technique which was successfully applied to stuck-at fault testing. As delay faults have lower random pattern testability than stuck-at faults, the need for DLBIST schemes is increased. Nevertheless, an extension to delay fault testing is not trivial, since this necessitates the application of pattern pairs. Consequently, delay fault testing is expected to require a larger mapping effort and logic overhead than stuck-at fault testing. In this paper, we consider the so-called transition fault model, which is widely used for complexity reasons. We present an extension of a DLBIST scheme for transition fault testing. Functional justification is used to generate the required pattern pairs. The efficiency of the extended scheme is investigated by using industrial benchmark circuits

We present a technique for making a circuit ready for logic built-in self test by masking unknown values at its outputs. In order to keep the silicon area cost low, some known bits in output responses are also allowed to be masked. These bits are selected based on a stuck-at n-detection based metric, such that the impact of masking on the defect coverage is minimal. An analysis based on a probabilistic model for resistive short defects indicates that the coverage loss for unmodeled defects is negligible for relatively low values of n.

In this paper a new, flexible and a very accurate crosstalk fault model is developed which considers the capacitive coupling noise between the aggressor and the victim interconnect in deep sub-micron chips. The proposed crosstalk model is based on the distributed ABCD model of a long on-chip interconnect and takes into account the CMOS driver and receiver parameters of both aggressor and victim interconnects, besides the consideration of usual distributed per-unit-length RLGC parasitic elements and coupling capacitance, and interconnect’s length. Simulations are all carried out using the Philips CMOS12 (130nm) technology parameters and the model accuracy is found very much close to PSPICE simulation result. The same model can further be utilized to analyze/estimate the influence of interconnect parasitics on various signal integrity losses such as delay, glitch, overshoot, or crosstalk hazards (if any).

A method for test resource partitioning is introduced which keeps the design-for-test logic test set independent and moves the test pattern dependent information to an external, programmable chip. The scheme includes a new decompression scheme for a fast and efficient communication between the external test chip and the circuit under test. The hardware costs on chip are significantly lower compared with a deterministic BIST scheme while the test application time is still in the same range. The proposed scheme is fully programmable, flexible and can be reused at board level for testing in the field.