Wai Sze Yip

dblp:252/1948 · DBLP profile ↗
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5ranked-venue papers
0as first author
5since 2021 · last 2026
0000-0003-2847-6230ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Databases, data management, data science and information retrieval · 4 · 4 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021
YearPublicationVenuePosition
2026 Comprehensive investigation of lubrication for sustainable grinding by principal component analysis (PCA) and an improved unsupervised algorithm
abstract
In the background of Industry 4.0, sustainable advanced manufacturing has become a pivotal challenge, necessitating the development of technologies that minimize resource consumption and environmental impact while maintaining high-quality production. Grinding technology plays a crucial role in this domain, providing solutions for processing hard and brittle materials with microscale accuracy, particularly when the grinding process is classified as precision machining. This study addresses the gaps in sustainable grinding by presenting a comprehensive review of lubrication strategies using an improved latent Dirichlet allocation (LDA) model integrated with Principal component analysis (PCA). The proposed model systematically identifies keyword distributions and topic clusters related to lubricant selection, providing insights into the evolving trends and practices in sustainable grinding. The findings enhance understanding of the main themes and future perspectives of sustainable grinding, bridging the gap between theoretical research and practical implementation in sustainable manufacturing.
Hengzhou Edward Yan, Hongting Zhou, Wai Sze Yip, Suet To
Adv. Eng. Informatics4
2025 Deep-learning-driven intelligent tool wear identification of high-precision machining with multi-scale CNN-BiLSTM-GCN
Baolong Zhang, Louis Luo Fan, Hengzhou Edward Yan, Dongfang Li 0001, Zejia Zhao, Wai Sze Yip, Suet To
Adv. Eng. Informatics7
2024 Technological life-cycle analysis of ultra-precision machining technology: Forecasting perspective directions and tracking the critical transitions with evolution
Hengzhou Edward Yan, Hongting Zhou, Suet To, Wai Sze Yip
Adv. Eng. Informatics6
2024 Intelligent Contour Error Compensation of Ultraprecision Machining Using Hybrid Mechanism-Data-Driven Model Assisted With IoT Framework
abstract
To address the complicated modeling process and inadequate explainability of current methods for improving the contour accuracy of ultraprecision machining (UPM), this study presented an Internet of Things (IoT)–based contour error compensation (CEC) framework. To achieve a convincing and real-time compensation solution, a hybrid mechanism-data-driven CEC model was created that integrated the 1DCNN-BiLSTM-attention model for predicting the axis actual positions, contour error estimation, and bidirectional compensation algorithms. Bayesian hyperparameter optimization and sensitivity analysis were used in the proposed models to improve the prediction accuracy of the actual position of each axis, with high-quality training datasets from well-designed experiments. Finally, validating the system on a three-axis ultraprecision milling machine demonstrated its superior performance. This study first demonstrated the feasibility of a deep learning approach for improving UPM accuracy, which will assist in accelerating digitalization and intellectualization for UPM.
Louis Luo Fan, Wai Sze Yip, Suet To, Zhanwen Sun, Dongfang Li 0001
IEEE Trans. Ind. Informatics3
2022 Topic discovery innovations for sustainable ultra-precision machining by social network analysis and machine learning approach
Hongting Zhou, Wai Sze Yip, Jingzheng Ren, Suet To
Adv. Eng. Informatics2