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Charles M. Lieber

dblp:26/3097 · DBLP profile ↗
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2ranked-venue papers
0as first author
0since 2021 · last 2006
0000-0002-6660-2456ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 50% Electronic design automation · 50%
Computer networks
1 paper
Optical networks · 100%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
flexible electronics
0.112005
High-Performance Nanowire Electronics and Photonics and Nanoscale Patterning on Flexible Plastic Substrates · Proc. IEEE 2005
Electronic design automation
nanofabrication
0.112005
High-Performance Nanowire Electronics and Photonics and Nanoscale Patterning on Flexible Plastic Substrates · Proc. IEEE 2005
Electronic design automation › nanofabrication
nanoimprint lithography
0.112005
High-Performance Nanowire Electronics and Photonics and Nanoscale Patterning on Flexible Plastic Substrates · Proc. IEEE 2005
Integrated circuit design › emerging device technologies
nanowire FET
0.112005
High-Performance Nanowire Electronics and Photonics and Nanoscale Patterning on Flexible Plastic Substrates · Proc. IEEE 2005
Optical networks
photonic devices
0.012005
High-Performance Nanowire Electronics and Photonics and Nanoscale Patterning on Flexible Plastic Substrates · Proc. IEEE 2005
YearPublicationVenuePosition
2006 Radial addressing of nanowires
abstract
We introduce radial encoding of nanowires (NWs), a new method of differentiating and controlling NWs by a small set of mesoscale wires for use in crossbar memories. We describe methods of controlling these NWs and give efficient manufacturing algorithms. These new encoding and decoding methods do not suffer from the misalignment characteristic of flow-aligned NWs. They achieve comparable effective pitch and resulting memory density with axially encoded NWs, while avoiding potential cases of address ambiguity and simplifying NW preparation. We also explore hybrid axial/radial encodings and show that they offer no net benefit over pure codes.
John E. Savage, Eric Rachlin, André DeHon, Charles M. Lieber
ACM J. Emerg. Technol. Comput. Syst.4
2005 High-Performance Nanowire Electronics and Photonics and Nanoscale Patterning on Flexible Plastic Substrates
abstract
The introduction of an ambient-temperature route for integrating high-mobility semiconductors on flexible substrates could enable the development of novel electronic and photonic devices with the potential to impact a broad spectrum of applications. Here we review our recent studies demonstrating that high-quality single-crystal nanowires (NWs) can be assembled onto flexible plastic substrates under ambient conditions to create FETs and light-emitting diodes. We also show that polymer substrates can be patterned through the use of a room temperature nanoimprint lithography technique for the general fabrication of hundred-nanometer scale features, which can be hierarchically patterned to the millimeter scale and integrated with semiconductor NWs to make high-performance FETs. The key to our approach is the separation of the high-temperature synthesis of single-crystal NWs from room temperature solution-based assembly, thus enabling fabrication of single-crystal devices on virtually any substrate. Silicon NW FETs on plastic substrates display mobilities of 200 cm/sup 2/-V/sup -1/-s/sup -1/, rivaling those of single-crystal silicon and exceeding those of state-of-the-art amorphous silicon and organic transistors currently used for flexible electronics. Furthermore, the generality of this bottom-up assembly approach suggests the integration of diverse nanoscale building blocks on a variety of substrates, potentially enabling far-reaching advances in lightweight display, mobile computing, and information storage applications.
Michael C. McAlpine, Robin S. Friedman, Charles M. Lieber
Proc. IEEE3