Demo Data from VLDB 2026 / reviewers in the wild / expert
Wenwen Chai
dblp:26/7450
· DBLP profile ↗
3ranked-venue papers
3as first author
0since 2021 · last 2013
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 2 · 2 first-authorApplied, interdisciplinary, general and emerging computing · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
3 papers |
Electronic design automation · 78% High-performance computing · 22% |
Topics — the 5 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › interconnect modeling
impedance extraction |
0.4 | 3 | 2013 | Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures · Proc. IEEE 2013 Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects · DAC 2011 A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction · DAC 2009 |
Electronic design automation
interconnect modeling |
0.4 | 3 | 2013 | Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures · Proc. IEEE 2013 Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects · DAC 2011 A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction · DAC 2009 |
High-performance computing › scientific computing › computational electromagnetics
surface integral equation solver |
0.3 | 2 | 2013 | Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures · Proc. IEEE 2013 Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects · DAC 2011 |
Electronic design automation
circuit simulation |
0.2 | 1 | 2013 | Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures · Proc. IEEE 2013 |
Electronic design automation › physical design › parasitic extraction
capacitance extraction |
0.1 | 1 | 2009 | A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction · DAC 2009 |
Methods — techniques the papers use, named apart from their topics
linear-complexity solver · 0.3direct matrix solution · 0.3surface integral equation · 0.2integral equation solver · 0.1direct matrix inversion · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2013 | Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D StructuresabstractWe develop a linear-complexity direct matrix solution for the surface integral equation (IE)-based impedance extraction of arbitrarily shaped 3-D nonideal conductors embedded in a dielectric material. A direct inverse of a highly irregular system matrix composed of both dense and sparse matrix blocks is obtained inO(N) complexity withNbeing the matrix size. It outperforms state-of-the-art impedance solvers, be they direct solvers or iterative solvers, with fast central processing unit (CPU) time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns. The inverse of a 2.68-million-unknown matrix arising from the extraction of a large-scale 3-D interconnect having 128 buses, which is a matrix solution for 2.68 million right-hand sides, was obtained in less than 1.5 GB memory and 1.3 h on a single CPU running at 3 GHz. Wenwen Chai, Dan Jiao |
Proc. IEEE | 1 |
| 2011 | Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnectsabstractA linear-complexity direct matrix solution is developed for the surface-integral based impedance extraction of arbitrarily-shaped 3-D non-ideal conductors embedded in dielectric materials. It outperforms state-of-the-art impedance solvers with fast CPU-time, modest memory-consumption, and without sacrificing accuracy. The inverse of a 2.6-million-unknown matrix arising from the extraction of large-scale 3-D interconnects was obtained in 1.5 GB memory and 1.3 hours on a 3 GHz CPU. Wenwen Chai, Dan Jiao |
DAC | 1 |
| 2009 | A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extractionabstractState-of-the-art integral-equation-based solvers rely on techniques that can perform a matrix-vector multiplication in O(N) complexity. In this work, a fast inverse of linear complexity was developed to solve a dense system of linear equations directly for the capacitance extraction of any arbitrary shaped 3D structure. The proposed direct solver has demonstrated clear advantages over state-of-the-art solvers such as FastCap and HiCap; with fast CPU time and modest memory consumption, and without sacrificing accuracy. It successfully inverts a dense matrix that involves more than one million unknowns associated with a large-scale on-chip 3D interconnect embedded in inhomogeneous materials. Moreover, we have successfully applied the proposed solver to full-wave extraction. Wenwen Chai, Dan Jiao, Cheng-Kok Koh |
DAC | 1 |