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Bitao Shen

dblp:269/2208 · DBLP profile ↗
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2ranked-venue papers
1as first author
1since 2021 · last 2025
0000-0002-3786-6815ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 2 · 1 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer networks
2 papers
Optical networks · 100%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Optical networks
microwave photonics
0.912025
Silicon integrated microwave photonics · Sci. China Inf. Sci. 2025
Optical networks › space-division multiplexing
mode-division multiplexing
0.412020
A design method for high fabrication tolerance integrated optical mode multiplexer · Sci. China Inf. Sci. 2020
Optical networks
optical communication components
0.412020
A design method for high fabrication tolerance integrated optical mode multiplexer · Sci. China Inf. Sci. 2020
Integrated circuit design
photonic integrated circuits
0.312025
Silicon integrated microwave photonics · Sci. China Inf. Sci. 2025

Methods — techniques the papers use, named apart from their topics

fabrication tolerance design · 0.4
YearPublicationVenuePosition
2025 Silicon integrated microwave photonics
abstract
Abstract The generation, processing, and measurement of microwave signals using optoelectronic technology on compact chips represent a significant trend in the evolution of microwave photonics (MWP). Among various platforms, silicon photonics has emerged as a leading choice, primarily due to its compatibility with established complementary metal-oxide-semiconductor (CMOS) processes. This compatibility enables the complete integration of high-performance radio frequency (RF) links while addressing key challenges such as size, power consumption, cost, and reliability. In this article, we review recent advancements in silicon-integrated microwave photonics, focusing on the developments of device-level integration and system-level applications. At the device level, we highlight critical innovations in silicon-based passive and active components towards MWP concerns, including ultralow-loss waveguides, high-fitness micro rings, large-bandwidth/high-linearity electro-optic modulators, hybrid/heterogeneous integrated lasers and amplifiers on silicon, frequency combs, and more. These breakthroughs form the basic foundation for advancing MWP system-level implementation. At the system-level applications, we concentrate on integrated MWP systems with diverse functionalities on silicon chips, including microwave signal generation, processing, programmable circuits, and measurement systems. Finally, we discuss current challenges and provide insights into the future of silicon-integrated MWP.
Yuansheng Tao, Zihan Tao, Bitao Shen, Luwen Xing, Wencan Li, Huajin Chang, Jingmei Zhang, Haowen Shu, Ninghua Zhu
Sci. China Inf. Sci.5
2020 A design method for high fabrication tolerance integrated optical mode multiplexer
Bitao Shen, Haowen Shu, Linjie Zhou
Sci. China Inf. Sci.1