Demo Data from VLDB 2026 / reviewers in the wild / expert
D. E. Vogt
dblp:271/7481
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 1980
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Computer networks · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer networks
1 paper |
Physical-layer communications · 100% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Physical-layer communications › modulation › continuous phase modulation
minimum shift keying |
0.0 | 1 | 1980 | 760 Mbit/s Serial MSK Microwave Modem · IEEE Trans. Commun. 1980 |
Physical-layer communications › digital transmission systems
modem design |
0.0 | 1 | 1980 | 760 Mbit/s Serial MSK Microwave Modem · IEEE Trans. Commun. 1980 |
Physical-layer communications
modulation |
0.0 | 1 | 1980 | 760 Mbit/s Serial MSK Microwave Modem · IEEE Trans. Commun. 1980 |
Methods — techniques the papers use, named apart from their topics
experimental measurement · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1980 | 760 Mbit/s Serial MSK Microwave ModemabstractSerial modulation and demodulation provide a significant simplification in the hardware realization of high data rate MSK systems. The serial MSK (SMSK) technique results in theoretical performance charateristics identical to conventional MSK. A 750 kbit/s low data rate system and a 760 Mbit/s high data rate system were constructed to evaluate the feasibility of the design concepts. The low data rate system had an overall BER performance degradation of 1.3 dB at a 10-6BER. The 760 Mbit/s system had a corresponding degradation of 2.0 dB and used direct modulation and demodulation at the 14.7 GHz carrier. C. R. Ryan, A. R. Hambley, D. E. Vogt |
IEEE Trans. Commun. | 3 |