Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. In the dummy filling flow, dummy synthesis works as the key step to adjust the post- CMP profile height. However, existing dummy synthesis optimization approaches usually fail to balance the filling quality and efficiency. This article proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver. Inside this framework, a full-chip CMP simulator is first migrated to the neural network, achieving$8134\times $speedup on gradient calculation by backward propagation. Entrenched in the CMP neural network models, we further implement an improved version of NeurFill (pNeurFill) to alleviate the post- CMP height variation caused by dummy perimeter. After each iteration of dummy density optimization, an additional perimeter adjustment based on a given candidate dummy pattern set is applied to search for the optimal perimeter fill amount. The experimental results show that the proposed NeurFill outperforms existing rule- and model-based methods. The extra perimeter adjustment strategy in pNeurFill can achieve an average 66.97Å decreasing in height variation and 8.92% quality improvement compared to NeurFill. This will provide guidance for DFM so as to increase IC chip yield.

Adversarial patches can mislead object detectors to produce erroneous predictions. To defend against adversarial patches, one can take two types of protections on the model side, including modifying the detector itself (e.g., adversarial training) or attaching a new model in front of the detector. However, the former often deteriorates clean performance of detectors, and the latter may have high deployment costs caused by too many training parameters. Inspired by the phenomenon of "bone hyperplasia" in human bodies, we present a novel model-side adversarial patch defense, called HARP (Hyperplasia based Adversarial Patch defense). Just as bone hyperplasia can enhance bone strength and skeletal stability, the hyperostosia of detectors can also help to resist adversarial patches. Following this idea, HARP chooses to improve adversarial robustness by "growing" lightweight CNN modules (i.e., hyperplasia modules) on the pre-trained object detectors. We conduct extensive experiments on the PASCAL VOC and COCO datasets to compare HARP with the data-side defense JPEG and the model-side defenses adversarial training, SAC and FNC. Experimental results show that HARP provides excellent defense against adversarial patches while maintaining clean performance, outperforming the compared defense methods. Under PGD-based adaptive attacks, HARP surpasses the recently proposed defense method SAC by 12.5% in mean average precision (mAP) on PASCAL VOC, and 13.2% on COCO dataset. In addition, experiments confirm that the increase in model inference time caused by HARP is almost negligible.

Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver. Inside this framework, a full-chip CMP simulator is first migrated to the neural network, achieving $8134 \times$ speedup on gradient calculation by backward propagation. Multi-modal starting points search is further applied in the framework to obtain satisfying filling quality optimums. The experimental results show that the proposed NeurFill outperforms existing rule- and model-based methods.

Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing process in VLSI manufactures. The main challenge of dummy filling is balancing multiple objectives, such as fill amounts, planarity, parasitic capacitance, etc. An obvious drawback of traditional rule-based dummy filling methods is pattern densities, instead of post-chemical mechanical polishing (CMP) topographies, being included in optimization objectives. Although the quality of post-CMP topography strongly depends on pattern features of layouts, especially the density uniformity, however, experimental results show that chip surface variations are not exactly the same as density variations. In this article, a unified dummy fill insertion optimization framework is proposed, integrated with the multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver, where all objectives are considered without approximation. Inside this framework, a full-chip CMP simulator is first integrated to evaluate the planarity of the chip surface. By selecting the initial points smartly with heuristic prior knowledge, the proposed method can be effectively accelerated. The effectiveness of the proposed algorithm is verified with the average 25.8% improvement of quality compared with rule-based methods.

This paper describes several interpolation methods for predicting the number of cases of the COVID-19 pandemic. The interpolation methods include some well-known temporal interpolation algorithms including Lagrange interpolation, cubic spline interpolation, and exponential decay interpolation. These temporal interpolation algorithms enable the interpolation of the COVID-19 cases at locations where measures on prior days are available. However, pandemics are not purely temporal but spatio-temporal phenomena. Therefore, the neighboring locations need to be considered too in order to derive accurate interpolation values for future days. This paper introduces a novel spatio-temporal interpolation algorithm that is shown to be better than any purely temporal interpolation algorithm in predicting the COVID-19 cases in the continental United States. In particular, the novel spatio-temporal interpolation method achieves a mean absolute error of 8.44 cases over a million people when predicting two days ahead the number of cases of the COVID-19 pandemic.