Modern DNN workloads are increasingly diverse in operation types, tensor shapes, and execution dependencies, making it difficult for customized accelerators to sustain high hardware efficiency across models. We propose DORA, an instruction-based overlay architecture as well as a compilation framework that explicitly describes dataflow via a proposed ISA, enabling fine-grained control of data movement, computation, and synchronization at the layer level.

As deep neural networks develop significantly more diverse and complex, achieving high performance and efficiency on complicated DNN models faces pressing challenges. Modern DNN workloads are increasingly diverse in operation types, tensor shapes, and execution dependencies, making it difficult to sustain high hardware efficiency across models. In addition, a generic accelerator often incurs substantial overhead when executing diverse workloads.

Heterogeneous reconfigurable platforms with tensor cores, such as AMD ACAP, are increasingly adopted for deep neural network (DNN) inference due to their high throughput and flexibility. However, their suitability for microsecond-scale inference on small problem sizes remains underexplored. In jet-tagging applications in high-energy physics, inefficient on-chip communication and large inter-layer latency prevent existing frameworks from meeting the 1-μ s latency budget. Moreover, hardware overheads such as synchronization and VLIW processor prologue are often overlooked, making it infeasible to optimize accelerators correctly. To address these problems, we propose µ-ORCA, a customized heterogeneous accelerator framework for ultra-low-latency model inference. µ-ORCA enables direct inter-layer communication between DNN layers on the AIE array, instead of using shared memory tiles or FPGA fabric. Moreover, a 512-bit/cycle cascade connection is applied instead of a 32-bit/cycle DMA connection. µ-ORCA also provides an overhead-aware performance model that adapts to different NN layer sizes, and conducts design space exploration to optimize end-to-end latency. µ-ORCA supports MLP and DeepSets models with non-MM kernels, including bias, ReLU, and global aggregation on AIE. We evaluate µ-ORCA on the AMD ACAP VEK280 platform. Experimental results show that µ-ORCA achieves average latency reduction of > 1.70 × and > 1.83 × compared with different state-of-the-art ACAP frameworks, and achieves 0.93 μ s latency for a 6-layer real-world DeepSets model, satisfying the latency budget. We open source µ-ORCA at https://github.com/arc-research-lab/u-ORCA.

Deep neural network (DNN) models are increasingly deployed in real-time, safety-critical systems such as autonomous vehicles, driving the need for specialized AI accelerators. However, most existing accelerators support only non-preemptive execution or limited preemptive scheduling at the coarse granularity of DNN layers. This restriction leads to frequent priority inversion due to the scarcity of preemption points, resulting in unpredictable execution behavior and, ultimately, system failure. To address these limitations and improve the real-time performance of AI accelerators, we propose DERCA, a novel accelerator architecture that supports fine-grained, intra-layer flexible preemptive scheduling with cycle-level determinism. DERCA incorporates an on-chip Earliest Deadline First (EDF) scheduler to reduce both scheduling latency and variance, along with a customized dataflow design that enables intralayer preemption points (PPs) while minimizing the overhead associated with preemption. Leveraging the limited preemptive task model, we perform a comprehensive predictability analysis of DERCA, enabling formal schedulability analysis and optimized placement of preemption points within the constraints of limited preemptive scheduling. We implement DERCA on the AMD ACAP VCK190 reconfigurable platform. Experimental results show that DERCA outperforms state-of-the-art designs using non-preemptive and layer-wise preemptive dataflows, with less than 5 % overhead in worst-case execution time (WCET) and only 6% additional resource utilization. DERCA is open-sourced on GitHub: https://github.com/arc-research-lab/DERCA

Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today’s data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings many opportunities when scaling up and scaling out the computing system. In particular, heterogeneous chiplet architecture is favored to keep scaling up and scaling out the system as well as to reduce the design complexity and the cost stemming from the traditional monolithic chip design. However, how to interconnect computing resources and orchestrate heterogeneous chiplets is the key to success. In this paper, we first discuss the diversity and evolving demands of different AI workloads. We discuss how chiplet brings better cost efficiency and shorter time to market. Then we discuss the challenges in establishing chiplet interface standards, packaging, and security issues. We further discuss the software programming challenges in chiplet systems.

Smart phones have revolutionized the availability of computing to the consumer. Recently, smart phones have been aggressively integrating artificial intelligence (AI) capabilities into their devices. The custom designed processors for the latest phones integrate incredibly capable and energy efficient graphics processors (GPUs) and tensor processors (TPUs) to accommodate this emerging AI workload and on-device inference. Unfortunately, smart phones are far from sustainable and have a substantial carbon footprint that continues to be dominated by environmental impacts from their manufacture and far less so by the energy required to power their operation. In this paper we explore the possibility of reversing the trend to increase the dedicated silicon dedicated to emerging application workloads in the phone. Instead we consider how in-memory processing using the DRAM already present in the phone could be used in place of dedicated GPU/TPU devices for AI inference. We explore the potential savings in embodied carbon that could be possible with this tradeoff and provide some analysis of the potential of in-memory computing to compete with these accelerators. While it may not be possible to achieve the same throughput, we suggest that the responsiveness to the user may be sufficient using in-memory computing, while both the embodied and operational carbon footprints could be improved. Our approach can save circa $10-15 \mathrm{~kg} \mathrm{CO}_{2}$.

With the increase in the computation intensity of the chip, the mismatch between computation layer shapes and the available computation resource significantly limits the utilization of the chip. Driven by this observation, prior works discuss spatial accelerators or dataflow architecture to maximize the throughput. However, using spatial accelerators could potentially increase the execution latency. In this work, we first systematically investigate two execution models: (1) sequentially (temporally) launch one monolithic accelerator, and (2) spatially launch multiple accelerators. From the observations, we find that there is a latency throughput tradeoff between these two execution models, and combining these two strategies together can give us a more efficient latency throughput Pareto front. To achieve this, we propose spatial sequential architecture (SSR) and SSR design automation framework to explore both strategies together when deploying deep learning inference. We use the 7nm AMD Versal ACAP VCK190 board to implement SSR accelerators for four end-to-end transformer-based deep learning models. SSR achieves average throughput gains of 2.53x, 35.71x, and 14.20x under different batch sizes compared to the 8nm Nvidia GPU A10G, 16nm AMD FPGAs ZCU102, and U250. The average energy efficiency gains are 8.51x, 6.75x, and 21.22x, respectively. Compared with the sequential-only solution and spatial-only solution on VCK190, our spatial-sequential-hybrid solutions achieve higher throughput under the same latency requirement and lower latency under the same throughput requirement. We also use SSR analytical models to demonstrate how to use SSR to optimize solutions on other computing platforms, e.g., 14nm Intel Stratix 10 NX.

While Vision Transformers (ViTs) have shown consistent progress in computer vision, deploying them for real-time decision-making scenarios (< 1 ms) is challenging. Current computing platforms like CPUs, GPUs, or FPGA-based solutions struggle to meet this deterministic low-latency real-time requirement, even with quantized ViT models. Some approaches use pruning or sparsity to reduce model size and latency, but this often results in accuracy loss. To address the aforementioned constraints, in this work, we propose EQ-ViT, an end-to-end acceleration framework with novel algorithm and architecture co-design features to enable real-time ViT acceleration on AMD Versal Adaptive Compute Acceleration Platform (ACAP). The contributions are four-fold. First, we perform in-depth kernel-level performance profiling & analysis and explain the bottlenecks for existing acceleration solutions on GPU, FPGA, and ACAP. Second, on the hardware level, we introduce a new spatial and heterogeneous accelerator architecture, EQ-ViT architecture. This architecture leverages the heterogeneous features of ACAP, where both FPGA and artificial intelligence engines (AIEs) coexist on the same system-on-chip (SoC). Third, On the algorithm level, we create a comprehensive quantization-aware training strategy, EQ-ViT algorithm. This strategy concurrently quantizes both weights and activations into 8-bit integers, aiming to improve accuracy rather than compromise it during quantization. Notably, the method also quantizes nonlinear functions for efficient hardware implementation. Fourth, we design EQ-ViT automation framework to implement the EQ-ViT architecture for four different ViT applications on the AMD Versal ACAP VCK190 board, achieving accuracy improvement with 2.4%, and average speedups of 315.0x, 3.39x, 3.38x, 14.92x, 59.5x, 13.1x over computing solutions of Intel Xeon 8375C vCPU, Nvidia A10G, A100, Jetson AGX Orin GPUs, and AMD ZCU102, U250 FPGAs. The energy efficiency gains are 62.2x, 15.33x, 12.82x, 13.31x, 13.5x, 21.9x.

Dense matrix multiply (MM) serves as one of the most heavily used kernels in deep learning applications. To cope with the high computation demands of these applications, heterogeneous architectures featuring both FPGA and dedicated ASIC accelerators have emerged as promising platforms. For example, the AMD/Xilinx Versal ACAP architecture combines general-purpose CPU cores and programmable logic with AI Engine processors optimized for AI/ML. An array of 400 AI Engine processors executing at 1 GHz can provide up to 6.4 TFLOPS performance for 32-bit floating-point (FP32) data. However, machine learning models often contain both large and small MM operations. While large MM operations can be parallelized efficiently across many cores, small MM operations typically cannot. We observe that executing some small MM layers from the BERT natural language processing model on a large, monolithic MM accelerator in Versal ACAP achieved less than 5% of the theoretical peak performance. Therefore, one key question arises: How can we design accelerators to fully use the abundant computation resources under limited communication bandwidth for end-to-end applications with multiple MM layers of diverse sizes? We identify the biggest system throughput bottleneck resulting from the mismatch between the massive computation resources of one monolithic accelerator and the various MM layers of small sizes in the application. To resolve this problem, we propose the CHARM framework to compose multiple diverse MM accelerator architectures working concurrently on different layers within one application. CHARM includes analytical models that guide design space exploration to determine accelerator partitions and layer scheduling. To facilitate system designs, CHARM automatically generates code, enabling thorough onboard design verification. We deploy the CHARM framework on four different deep learning applications in FP32, INT16, and INT8 data types, including BERT, ViT, NCF, and MLP, on the AMD/Xilinx Versal ACAP VCK190 evaluation board. Our experiments show that we achieve 1.46 TFLOPS, 1.61 TFLOPS, 1.74 TFLOPS, and 2.94 TFLOPS inference throughput for BERT, ViT, NCF, and MLP in FP32 data type, respectively, which obtain 5.29 \(\times\) , 32.51 \(\times\) , 1.00 \(\times\) , and 1.00 \(\times\) throughput gains compared to one monolithic accelerator. CHARM achieves the maximum throughput of 1.91 TOPS, 1.18 TOPS, 4.06 TOPS, and 5.81 TOPS in the INT16 data type for the four applications. The maximum throughput achieved by CHARM in the INT8 data type is 3.65 TOPS, 1.28 TOPS, 10.19 TOPS, and 21.58 TOPS, respectively. We have open-sourced our tools, including detailed step-by-step guides to reproduce all the results presented in this article and to enable other users to learn and leverage CHARM framework and tools in their end-to-end systems: https://github.com/arc-research-lab/CHARM .