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Bill Grundmann

dblp:29/3190 · DBLP profile ↗
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6ranked-venue papers
2as first author
0since 2021 · last 2006
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 6 · 2 first-authorSoftware engineering, systems software and programming languages · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 50% Electronic design automation · 50%

Topics — the 2 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
asynchronous circuit design
0.112006
Synthesis of synchronous elastic architectures · DAC 2006
Electronic design automation › design methodology
latency-insensitive design
0.112006
Synthesis of synchronous elastic architectures · DAC 2006
YearPublicationVenuePosition
2006 Synthesis of synchronous elastic architectures
abstract
A simple protocol for latency-insensitive design is presented. The main features of the protocol are the efficient implementation of elastic communication channels and the automatable design methodology. With this approach, fine-granularity elasticity can be introduced at the level of functional units (e.g. ALUs, memories). A formal specification of the protocol is defined and an efficient scheme for the implementation of elasticity that involves no datapath overhead is presented. The opportunities this protocol opens for microarchitectural design are discussed.
Jordi Cortadella, Michael Kishinevsky, Bill Grundmann
DAC3
2006 From single core to multi-core: preparing for a new exponential
abstract
In the past, processor design trends were dominated by increasingly complex feature sets, higher clock speeds, growing thermal envelopes and increasing power dissipation. Recently, clock speeds have tapered and thermal and power dissipation envelopes have remained flat. However, the demand for increasing performance continues which has fueled the move to integrated multiple processor (multi-core) designs. This paper discusses this trend towards multi-core processor designs, the design challenges that accompany it and a view of the research required to support it.
Jeff Parkhurst, John A. Darringer, Bill Grundmann
ICCAD3
2005 Challenges to covering the high-level to silicon gap
abstract
Silicon architects have a difficult task. They have to translate a high-level product desire into a lower-level description for silicon implementation. They are required to balance their own creativity, project schedule, solution cost, and the degree of difficultly of implementation. Now they also have to worry about power dissipation and physical space realities.
Bill Grundmann
ASP-DAC1
2003 Circuit and Platform Design Challenges in Technologies beyond 90nm
Bill Grundmann, Rajesh Galivanche, Sandip Kundu
DATE1
1995 A delay model for logic synthesis of continuously-sized networks
abstract
We present a new delay model for use in logic synthesis. A traditional model treats the area of a library cell as constant and makes the cell's delay a linear function of load. Out model is based on a different, but equally fundamental linearity in the equation relating area, delay, and load: namely, we may keep a cell's delay constantly making its area a linear function of load. This allows us to technology map using a library with continuous device sizing, satisfies certain electrical noise and power constraints, and in certain cases is computationally simpler than a traditional model. We give results to support these claims. A companion paper uses the computational simplicity to explore a wide search space of algebraic factorings in a mapped network.
Joel Grodstein, Eric Lehman, Heather Harkness, Bill Grundmann, Yosinori Watanabe
ICCAD4
1994 Optimal latch mapping and retiming within a tree
Joel Grodstein, Eric Lehman, Heather Harkness, Hervé J. Touati, Bill Grundmann
ICCAD5