Jiuren Zhou

dblp:301/0116 · DBLP profile ↗
← Back
13ranked-venue papers
0as first author
13since 2021 · last 2026
0000-0002-0915-5354ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 8 · 8 since 2021Applied, interdisciplinary, general and emerging computing · 4 · 4 since 2021Artificial intelligence and machine learning · 1 · 1 since 2021Graphics, computer vision, multimedia, augmented reality and games · 1 · 1 since 2021
YearPublicationVenuePosition
2026 Multimodal Feature Fusion with Illumination Adaptation for Robust Household Waste Detection
Ziliang Hu, Xiguang Wu, Jiuren Zhou, Genquan Han
ICPR (4)3
2026 MPE: A Power-Efficient Edge-Device Mamba Processor with Multi-Dimensional Calculation-Compression Scheme
Zhou Wang 0005, Haochen Du, Jiuren Zhou, Xiguang Wu, Qiankun Li 0004, Yanqing Xu 0003, Hanqi Feng, Xiaonan Tang, Shushan Qiao, Yongke Wang, Anil A. Bharath, Emm Mic Drakakis
ISCAS4
2026 GTPE: A 28nm 33.12 TFLOPS/W GNN Training Processor with Unstructured Multi Threshold Pruning, Hybrid Multi-mode Approximate Computing and QUIRE Number System Support
Zhou Wang 0005, Haochen Du, Jiuren Zhou, Xiguang Wu, Qiankun Li 0004, Yanqing Xu 0003, Hanqi Feng, Xiaonan Tang, Shushan Qiao, Tian-Chun Ye 0001, Anil A. Bharath, Emm Mic Drakakis
ISCAS4
2026 GATPE: A High-Performance Edge-Device GAT Processor with Multi-Layer Data-Variation Mechanism
Zhou Wang 0005, Haochen Du, Jiuren Zhou, Xiguang Wu, Qiankun Li 0004, Yanqing Xu 0003, Hanqi Feng, Xiaonan Tang, Shushan Qiao, Anil A. Bharath, Emm Mic Drakakis
ISCAS5
2026 FeRAM-Based Reconfigurable Strong PUF with Ultra-Low Power and Enhanced Attack Resilience
Xiguang Wu, Bo Li 0155, Jiuren Zhou, Wei Mao 0002, Yan Liu 0016, Genquan Han
ISCAS5
2026 SPICA: Energy-Efficient SRAM-Based Multi-Precision Multi-Mode Compute-in-Memory Accelerator for AI Inference
Xiguang Wu, Zhou Wang 0005, Jiuren Zhou, Genquan Han
ISCAS7
2026 Collaborative Design of FeRAM via a Joint Ferroelectric Device and Circuit Analysis
abstract
Ferroelectric random access memory (FeRAM) is a promising candidate to further dynamic random access memory (DRAM) scaling. However, the design of the FeRAM bit cell is nontrivial as the ferroelectric device model is not well supported by EDA tools. Modern integrated circuit design heavily depends on circuit-level SPICE simulators that integrate compact device models through modified nodal analysis (MNA) representation. This paper presents a novel MNA-based SPICE simulation method for ferroelectric device models, targeted at the design space exploration of FeRAM bitcells. Furthermore, this paper provides a co-design procedure for FeRAM bitcells and sense amplifiers via a comprehensive case study.
Bo Li 0056, Junfeng Tan, Tingjie Yang, Huanning Zhang, Xueyang Bai, Wei Mao 0002, Jiuren Zhou, Guoyong Shi, Yan Liu 0016, Genquan Han
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.9
2025 STPE: An Energy-Efficient Edge-Device Transformer Inference Processor with Multi-Mode Data-Compression Scheme
abstract
Transformer-Based models have turned out to be very successful in many artificial intelligence (AI) tasks, outperforming traditional convolutional neural networks (CNNs), especially in the field of Natural Language Processing (NLP). Their success relies upon a self-attention mechanism which, when compared to CNNs, has a global rather than a local receptive domain. This article proposes an energy-efficient edge-device Transformer inference processor termed Smart Transformer Processing Element (STPE). Firstly, STPE sets up a Multi-Mode Indexing and Sparsity Scheme (MISS) for token association, and further reduces the computational load through in-situ computation; secondly, STPE exploits the Local Properties of Attention Mechanism (LPAM) to further reduce redundant and repetitive calculations in Transformer operations by means of a search band calculation and error correction mechanism; thirdly, STPE has designed a Quantization and Compression Parallel Method (QCPM) to improve the computing speed and hardware utilization under weak related (WR) token. Employing 28nm CMOS synthesis tools, the area of the proposed STPE processor is 7.33 mm2. Its peak energy efficiency is 84.15TOPS/W, which is 14.7 times higher than that of the H100 graphics processing unit (GPU) and 3.06 times higher than that of the most advanced Transformer processor.
Zhou Wang 0005, Haochen Du, Vivek Mohan, Jiuren Zhou, Yanqing Xu 0003, Baoyi Han, Xiaonan Tang, Shushan Qiao, Shouyi Yin, Anil A. Bharath, Emmanuel M. Drakakis
ISCAS4
2025 GPE: A High-Performance Edge GNN Inference Processor with Multi-Parallelism Format-Variation Mechanism
abstract
Recently, Graph Neural Networks (GNNs) have shown great potential in terms of accuracy for problems that are well-described by graph representations, such as problems of path planning. However, implementing GNNs on mobile platforms is challenging as it requires a significant amount of computation and large memory. This article proposes a High-Performance Edge GNN Inference Processor termed GPE (GNN Processing Element). Firstly, GPE sets up Multi-Dimensional Indexing and Dynamic Pruning Schemes (MIDPS) for GNN networks, and achieves cross layer interconnection of multiple neighboring nodes via NOC (Network on Chip); secondly, GPE utilizes Graph Structure Adjacency Table Information (GSATI) of a GNN to further reduce redundant and repetitive calculations by means of repeated matching and difference transfer mechanisms; thirdly, GPE has a graph-based Multi Parallelism Simplification and Operation Method (MPSOM) to improve computing speed and hardware utilization under small data volumes. Using 28nm CMOS synthesis tools, the area of the proposed GPE processor is 5.37 square millimeters. Its peak energy efficiency is 21.5TOPS/W, which is 3.76 times higher than that of the H100 GPU (Graphics Processing Unit), while the energy consumption of GNN is 80.9% lower than the previous SOTA (State of Art) work.
Zhou Wang 0005, Haochen Du, Jiuren Zhou, Yanqing Xu 0003, Vivek Mohan, Baoyi Han, Xiaonan Tang, Shushan Qiao, Shouyi Yin, Anil A. Bharath, Emmanuel M. Drakakis
ISCAS3
2025 A parallel computing-in-memory accelerator utilizing FeRAM array with retention loss correction
Wei Mao 0002, Bo Li 0155, Xiaomeng Lv, Fuyi Li, Haiqiao Hong, Shirui Zhao, Siying Zheng, Jiuren Zhou, Yan Liu 0016, Genquan Han
Sci. China Inf. Sci.13
2025 Ferroelectric materials, devices, and chips technologies for advanced computing and memory applications: development and challenges
abstract
Abstract Hafnium (Hf) oxide-based ferroelectric materials have emerged as a transformative platform for next-generation non-volatile memory and advanced computing technologies. This review comprehensively examines the development, challenges, and applications of HfO 2 ferroelectrics, emphasizing their CMOS compatibility, scalability, and robust polarization at nanoscale dimensions. Breakthroughs in doping strategies, stress engineering, and VO control have stabilized the metastable orthorhombic phase, enabling high-performance devices such as ferroelectric RAM (FeRAM), ferroelectric field-effect transistors (FeFETs), and ferroelectric tunnel junctions (FTJs). These devices offer ultrafast switching, low power consumption, and multi-level storage, driving innovations in neuromorphic computing, in-memory processing, and cryogenic systems; nonetheless, they face ongoing challenges in reliability, such as fatigue and imprint effects, and scalability at sub-5 nm technology nodes. Emerging frontiers, such as wurtzite-structured nitrides (e.g., AlScN) and antiferroelectric ZrO 2 -based systems, have garnered significant attention due to their exceptionally high remanent polarization and promising potential for enhanced endurance, respectively. Further addressing the reliability issues of these emerging ferroelectric materials and the challenges associated with large-scale integration processes through interdisciplinary efforts will unlock the full potential of ferroelectric technologies, positioning them as pivotal enablers of post-Moore computing architectures and sustainable AI-driven applications.
Ni Zhong, Tianjiao Xin, Tiancheng Gong, Jiezhi Chen, Zhiyuan Fu, Kechao Tang, Xiuyan Li, Xinqiang Wang, Anquan Jiang, Peiyuan Du, Chengji Jin, Haoji Qian, Siying Zheng, Haiwen Xu, Bochang Li, Zheng-Dong Luo, Jiuren Zhou, Genquan Han
Sci. China Inf. Sci.37
2024 Enhanced fatigue resistance of ferroelectric Al0.65Sc0.35N deposited by physical vapor deposition
Danyang Yao, Ruiqing Wang, Xu Ran, Jiuren Zhou, Qikun Wang, Guoqiang Wu, Genquan Han
Sci. China Inf. Sci.7
2021 High mobility germanium-on-insulator p-channel FinFETs
Genquan Han, Jiuren Zhou, Yue Hao 0001
Sci. China Inf. Sci.3