The design freedom enabled by additive manufacturing, combined with the unique properties of generative lattice structures, has gained increasing attention in thermal system technologies, especially for the development and fabrication of heat exchangers. In this study, a hybrid heat exchanger was developed by integrating a Diamond unit cell, known for its high thermal performance, with an IWP unit cell, which offers low flow resistance. The goal is to reduce flow resistance while maintaining heat transfer efficiency. A physical model was simulated using ANSYS software to evaluate the heat exchanger’s performance. The results indicate that integrating IWP cells into a Diamond unit cell structure effectively reduces flow resistance, though with a slight compromise in heat transfer performance. This balance provides a viable design strategy for heat exchangers in applications requiring precise flow resistance control.

Additive manufacturing processes and generative lattice structure are two increasingly popular methods in thermal management applications, particularly in the design and production of heat sinks for electronic devices. In this paper additive manufacturing was used to create heat sinks with lattice structures, specifically triple periodic minimum surfaces (TPMS). Where a conventional pin-fin heat conductor was compared with a heat sink using TPMS lattices, including Gyroid, IWP, and Neovius structures, by evaluating thermal performance. A model was physically simulated to study the thermal performance of the dispersants on the ANSYS software. The results show that the heat sink incorporating TPMS lattices exhibits superior thermal performance than the traditional pin heat sink. The research demonstrates the potential of additive manufacturing to create complex geometries that can improve the thermal dissipation of electronic devices.