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Xianglun Leng

dblp:307/9864 · DBLP profile ↗
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1ranked-venue papers
0as first author
1since 2021 · last 2024
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Hardware accelerators and domain-specific architectures · 61% Interconnection networks and networks-on-chip · 30% Memory systems · 9%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Hardware accelerators and domain-specific architectures › accelerator integration
chiplet-based accelerator
0.812024
INDM: Chiplet-Based Interconnect Network and Dataflow Mapping for DNN Accelerators · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2024
Hardware accelerators and domain-specific architectures › machine learning accelerator
DNN accelerator
0.812024
INDM: Chiplet-Based Interconnect Network and Dataflow Mapping for DNN Accelerators · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2024
Interconnection networks and networks-on-chip › network topology
hierarchical interconnection network
0.812024
INDM: Chiplet-Based Interconnect Network and Dataflow Mapping for DNN Accelerators · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2024
Memory systems
processing-in-memory
0.212024
INDM: Chiplet-Based Interconnect Network and Dataflow Mapping for DNN Accelerators · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2024

Methods — techniques the papers use, named apart from their topics

topology exploration · 0.8dataflow mapping · 0.8architectural partitioning · 0.8
YearPublicationVenuePosition
2024 INDM: Chiplet-Based Interconnect Network and Dataflow Mapping for DNN Accelerators
abstract
Chiplet-based deep neural network (DNN) accelerator is a promising solution to balance the performance and manufacturing cost. However, different from monolithic chips, interconnect network design and architectural partitioning for multiple chiplets would result in a huge design space and make it difficult to keep scalability and high hardware utilization. Moreover, how to efficiently map DNN workloads onto multiple DRAM dies and compute dies is another major challenge. To alleviate the above issues, in this work, we propose INDM, a chiplet-based interconnect network and dataflow mapping co-optimization for DNN accelerators. First, we propose an efficient hierarchical interconnect network composed of a multiring on-die network and a cluster-based interdie network, to facilitate the data reuse and traffic pattern in DNN workloads. Second, architectural partitioning and topology exploration for chiplet-based DNN accelerators are proposed to find the optimal architecture configurations. Third, an interdie communication-aware dataflow mapping is proposed to minimize traffic congestion during DNN layer switching. We implement the proposed chiplet-based interconnect network design and dataflow mapping algorithm for a set of popular DNN models, including VGG-16, ResNet-18, DarkNet-19, ResNet-50, and ResNet-101. Experimental results show that as compared with the state-of-the-art related work, such as NN-Baton and SIMBA, our work achieves 26.00%–73.81% energy-delay-product (EDP) reduction and 26.93%–79.78% latency reduction.
Xi Fan, Yaoyao Ye, Xuyan Wang, Guojie Xiong, Xianglun Leng, Ningyi Xu, Yong Lian 0001, Guanghui He 0002
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.6