Stephen G. Bishop

dblp:324/9492 · DBLP profile ↗
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1ranked-venue papers
1as first author
0since 2021 · last 1993
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%
Computer networks
1 paper
Optical networks · 100%

Topics — the 2 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
optoelectronic integrated circuits
0.011993
The engineering research center for compound semiconductor microelectronics · Proc. IEEE 1993
Optical networks
optical interconnect
0.011993
The engineering research center for compound semiconductor microelectronics · Proc. IEEE 1993
YearPublicationVenuePosition
1993 The engineering research center for compound semiconductor microelectronics
abstract
The long-range vision of the Engineering Research Center for Compound Semiconductor Microelectronics (CCSM) is focused on a new generation of high-speed communications and data-processing technology which exploits the bandwidth, immunity to electromagnetic interference, and connectivity of optical interconnects. In order to realize this vision, it will be necessary to design, fabricate, and integrate high-performance electrical and optical devices in monolithic optoelectronic integrated circuits, OEIC's. The research programs of the CCSM are focused on the development of the engineering science and technology base for fabrication of OEIC's and their application in optical interconnect systems; the education of engineers in this field; and effective transfer of this technology to industry
Stephen G. Bishop, Ilesanmi Adesida, James J. Coleman, Thomas A. Detemple, Milton Feng, Karl Hess, Nick Holonyak, Gregory E. Stillman, Joseph T. Verdeyen
Proc. IEEE1