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Haoran Shang

dblp:359/0338 · DBLP profile ↗
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2ranked-venue papers
0as first author
2since 2021 · last 2026
0009-0004-6972-9235ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 2 since 2021Software engineering, systems software and programming languages · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Interconnection networks and networks-on-chip · 40% Hardware accelerators and domain-specific architectures · 23% Distributed systems · 18%

Topics — the 5 heaviest of 7, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Interconnection networks and networks-on-chip › interprocessor communication
all-to-all communication
1.012026
MoEntwine: Unleashing the Potential of Wafer-Scale Chips for Large-Scale Expert Parallel Inference · HPCA 2026
Distributed systems › distributed machine learning
expert parallelism
1.012026
MoEntwine: Unleashing the Potential of Wafer-Scale Chips for Large-Scale Expert Parallel Inference · HPCA 2026
Hardware accelerators and domain-specific architectures › machine learning accelerator › DNN inference
mixture-of-experts inference
1.012026
MoEntwine: Unleashing the Potential of Wafer-Scale Chips for Large-Scale Expert Parallel Inference · HPCA 2026
Parallel and multicore computing › parallel computing › parallel machine learning
parallel inference
1.012026
MoEntwine: Unleashing the Potential of Wafer-Scale Chips for Large-Scale Expert Parallel Inference · HPCA 2026
Interconnection networks and networks-on-chip › network topology › mesh network
mesh topology
0.312026
MoEntwine: Unleashing the Potential of Wafer-Scale Chips for Large-Scale Expert Parallel Inference · HPCA 2026

Methods — techniques the papers use, named apart from their topics

non-invasive balancer · 1.0entwined ring mapping · 1.0
YearPublicationVenuePosition
2026 MoEntwine: Unleashing the Potential of Wafer-Scale Chips for Large-Scale Expert Parallel Inference
abstract
As large language models (LLMs) continue to scale up, mixture-of-experts (MoE) has become a common technology in SOTA models. MoE models rely on expert parallelism (EP) to alleviate memory bottleneck, which introduces all-to-all communication to dispatch and combine tokens across devices. However, in widely-adopted GPU clusters, high-overhead crossnode communication makes all-to-all expensive, hindering the adoption of EP. Recently, wafer-scale chips (WSCs) have emerged as a platform integrating numerous devices on a wafer-sized interposer. WSCs provide a unified high-performance network connecting all devices, presenting a promising potential for hosting MoE models. Yet, their network is restricted to a mesh topology, causing imbalanced communication pressure and performance loss. Moreover, the lack of on-wafer disk leads to high-overhead expert migration on the critical path. To fully unleash this potential, we first propose Entwined Ring Mapping (ER-Mapping), which co-designs the mapping of attention and MoE layers to balance communication pressure and achieve better performance. We find that under ER-Mapping, the distribution of cold and hot links in the attention and MoE layers is complementary. Therefore, to hide the migration overhead, we propose the Non-invasive Balancer (NI-Balancer), which splits a complete expert migration into multiple steps and alternately utilizes the cold links of both layers. Evaluation shows ER-Mapping achieves communication reduction up to 62 %. NIBalancer further delivers 54 % and 22 % improvements in MoE computation and communication, respectively. Compared with the SOTA NVL72 supernode, the WSC platform delivers an average 39 % higher per-device MoE performance owing to its scalability to larger EP.
Xinru Tang, Jingxiang Hou, Dingcheng Jiang, Taiquan Wei, Jinyi Deng, Huizheng Wang, Qize Yang, Haoran Shang, Chao Li 0009, Yang Hu 0001, Shouyi Yin
HPCA9
2025 PD Constraint-aware Physical/Logical Topology Co-Design for Network on Wafer
abstract
As cluster scales for LLM training expand, waferscale chips, characterized by the high integration density and bandwidth, emerge as a promising approach to enhancing training performance.The role of Network on Wafer (NoW) is becoming increasingly significant, which puts an emphasis on two facts: physical and logical topology.However, existing networks fail to co-design both aspects.Additionally, physical topology typically focuses on optimizing communication or computation separately, neglecting opportunities to improve overall training performance.In this paper, we propose a physical design (PD) constraint-aware joint optimization strategy, developing mesh-switch physical topology and a dual-granularity logical topology.Mesh-switch leverages the high integration density of mesh and the efficient communication performance of fat tree, optimizing the allocation of on-chip
Qize Yang, Taiquan Wei, Sihan Guan, Chengran Li, Haoran Shang, Jinyi Deng, Huizheng Wang, Chao Li 0009, Yan Zhang 0163, Shouyi Yin, Yang Hu 0001
ISCA5