Flexible electronics (FE) based on indium gallium zinc oxide thin-film transistors (IGZO-TFTs) are emerging for ultra-low-power wearable applications. However, lack of packaging, limited pins, and high device variability make conventional Automatic Test Equipment (ATE) impractical for testing analog/mixed-signal circuits in FE. This work presents a dual-purpose ring oscillator (RO) and voltage-controlled oscillator (VCO) serving as functional timing blocks and core structures for a distributed delay-based BIST framework. The oscillators achieve 1100x area reduction and 5600x lower power than previous IGZO-TFT designs. Lightweight digital BIST embedded within each RO stage enables stage-wise delay monitoring for defect detection. The BIST achieves 93% defect coverage for individual defects and 88% for multiple simultaneous defects, with only 3% power overhead

Flexible Electronics (FE) offer distinct advantages, including mechanical flexibility and low process temperatures, enabling extremely low-cost production. To address the demands of applications such as smart sensors and wearables, flexible devices must be small and operate at low supply voltages. Additionally, target applications often require classifiers to operate directly on analog sensory input, necessitating the use of Analog to Digital Converters (ADCs) to process the sensory data. However, ADCs present serious challenges, particularly in terms of high area and power consumption, especially when considering stringent area and energy budget. In this work, we target common classifiers in this domain such as MLPs and SVMs and present a holistic approach to mitigate the elevated overhead of analog to digital interfacing in FE. First, we propose a novel design for Binary Search ADC that reduces area overhead 2× compared with the state-of-the-art Binary design and up to 5.4× compared with Flash ADC. Next, we present an in-training ADC optimization in which we keep the bare-minimum representations required and simplifying ADCs by removing unnecessary components. Our in-training optimization further reduces on average the area in terms of transistor count of the required ADCs by 5× for less than 1% accuracy loss.

Flexible Electronics (FE) offer a promising alternative to rigid silicon-based hardware for wearable healthcare devices, enabling lightweight, conformable, and low-cost systems. However, their limited integration density and large feature sizes impose strict area and power constraints, making ML-based healthcare systems–integrating analog frontend, feature extraction and classifier–particularly challenging. Existing FE solutions often neglect potential system-wide solutions and focus on the classifier, overlooking the substantial hardware cost of feature extraction and Analog-to-Digital Converters (ADCs)–both major contributors to area and power consumption. In this work, we present a holistic mixed-signal feature-to-classifier co-design framework for flexible smart wearable systems. To the best of our knowledge, we design the first analog feature extractors in FE, significantly reducing feature extraction cost. We further propose an hardware-aware NAS-inspired feature selection strategy within ML training, enabling efficient, application-specific designs. Our evaluation on healthcare benchmarks shows our approach delivers highly accurate, ultra-area-efficient flexible systems–ideal for disposable, low-power wearable monitoring.

Conventional stress monitoring relies on episodic, symptom-focused interventions, missing the need for continuous, accessible, and cost-efficient solutions. State-of-the-art approaches use rigid, silicon-based wearables, which, though capable of multitasking, are not optimized for lightweight, flexible wear, limiting their practicality for continuous monitoring. In contrast, flexible electronics (FE) offer flexibility and low manufacturing costs, enabling real-time stress monitoring circuits. However, implementing complex circuits like machine learning (ML) classifiers in FE is challenging due to integration and power constraints. Previous research has explored flexible biosensors and ADCs, but classifier design for stress detection remains underexplored. This work presents the first comprehensive design space exploration of low-power, flexible stress classifiers. We cover various ML classifiers, feature selection, and neural simplification algorithms, with over 1200 flexible classifiers. To optimize hardware efficiency, fully customized circuits with low-precision arithmetic are designed in each case. Our exploration provides insights into designing real-time stress classifiers that offer higher accuracy than current methods, while being low-cost, conformable, and ensuring low power and compact size.

Printed electronics (PE) technology provides cost-effective hardware with unmet customization, due to their low non-recurring engineering and fabrication costs. PE exhibit features such as flexibility, stretchability, porosity, and conformality, which make them a prominent candidate for enabling ubiquitous computing. Still, the large feature sizes in PE limit the realization of complex printed circuits, such as machine learning classifiers, especially when processing sensor inputs is necessary, mainly due to the costly analog-to-digital converters (ADCs). To this end, we propose the design of fully customized ADCs and present, for the first time, a co-design framework for generating bespoke Decision Tree classifiers. Our comprehensive evaluation shows that our co-design enables self-powered operation of on-sensor printed classifiers in all benchmark cases.