Flexible Electronics (FE) have emerged as a promising alternative to silicon-based technologies, offering on-demand low-cost fabrication, conformality, and sustainability. However, their large feature sizes severely limit integration density, imposing strict area and power constraints, thus prohibiting the realization of Machine Learning (ML) circuits, which can significantly enhance the capabilities of relevant near-sensor applications. Support Vector Machines (SVMs) offer high accuracy in such applications at relatively low computational complexity, satisfying FE technologies’ constraints. Existing SVM designs rely solely on linear or Radial Basis Function (RBF) kernels, forcing a trade-off between hardware costs and accuracy. Linear kernels, implemented digitally, minimize overhead but sacrifice performance, while the more accurate RBF kernels are prohibitively large in digital, and their analog realization contains inherent functional approximation. In this work, we propose the first mixed-kernel and mixed-signal SVM design in FE, which unifies the advantages of both implementations and balances the cost/accuracy trade-off. To that end, we introduce a co-optimization approach that trains our mixed-kernel SVMs and maps binary SVM classifiers to the appropriate kernel (linear/RBF) and domain (digital/analog), aiming to maximize accuracy whilst reducing the number of costly RBF classifiers. Our designs deliver 7.7% higher accuracy than state-of-the-art single-kernel linear SVMs, and reduce area and power by 108× and 17× on average compared to digital RBF implementations.

Flexible Electronics (FE) offer distinct advantages, including mechanical flexibility and low process temperatures, enabling extremely low-cost production. To address the demands of applications such as smart sensors and wearables, flexible devices must be small and operate at low supply voltages. Additionally, target applications often require classifiers to operate directly on analog sensory input, necessitating the use of Analog to Digital Converters (ADCs) to process the sensory data. However, ADCs present serious challenges, particularly in terms of high area and power consumption, especially when considering stringent area and energy budget. In this work, we target common classifiers in this domain such as MLPs and SVMs and present a holistic approach to mitigate the elevated overhead of analog to digital interfacing in FE. First, we propose a novel design for Binary Search ADC that reduces area overhead 2× compared with the state-of-the-art Binary design and up to 5.4× compared with Flash ADC. Next, we present an in-training ADC optimization in which we keep the bare-minimum representations required and simplifying ADCs by removing unnecessary components. Our in-training optimization further reduces on average the area in terms of transistor count of the required ADCs by 5× for less than 1% accuracy loss.

Super-TinyML aims to optimize machine learning models for deployment on ultra-low-power application domains such as wearable technologies and implants. Such domains also require conformality, flexibility, and non-toxicity which traditional silicon-based systems cannot fulfill. Printed Electronics (PE) offers not only these characteristics, but also cost-effective and on-demand fabrication. However, Neural Networks (NN) with hundreds of features ---often necessary for target applications--- have not been feasible in PE because of its restrictions such as limited device count due to its large feature sizes. In contrast to the state of the art using fully parallel architectures and limited to smaller classifiers, in this work we implement a super-TinyML architecture for bespoke (application-specific) NNs that surpasses the previous limits of state of the art and enables NNs with large number of parameters. With the introduction of super-TinyML into PE technology, we address the area and power limitations through resource sharing with multi-cycle operation and neuron approximation. This enables, for the first time, the implementation of NNs with up to 35.9× more features and 65.4× more coefficients than the state of the art solutions.

Printed Electronics (PE) provide a mechanically flexible and cost-effective solution for machine learning (ML) circuits, compared to silicon-based technologies. However, due to large feature sizes, printed classifiers are limited by high power, area, and energy overheads, which restricts the realization of battery-powered systems. In this work, we design sequential printed bespoke Support Vector Machine (SVM) circuits that adhere to the power constraints of existing printed batteries while minimizing energy consumption, thereby boosting battery life. Our results show 6.5x energy savings while maintaining higher accuracy compared to the state of the art.

Printed Electronics (PE) technology has emerged as a promising alternative to silicon-based computing. It offers attractive properties such as on-demand ultra-low-cost fabrication, mechanical flexibility, and conformality. However, PE are governed by large feature sizes, prohibiting the realization of complex printed Machine Learning (ML) classifiers. Leveraging PE’s ultra-low non-recurring engineering and fabrication costs, designers can fully customize hardware to a specific ML model and dataset, significantly reducing circuit complexity. Despite significant advancements, state-of-the-art solutions achieve area efficiency at the expense of considerable accuracy loss. Our work mitigates this by designing area- and power-efficient printed ML classifiers with little to no accuracy degradation. Specifically, we introduce the first sequential Support Vector Machine (SVM) classifiers, exploiting the hardware efficiency of bespoke control and storage units and a single Multiply-Accumulate compute engine. Our SVMs yield on average 6x lower area and 4.6% higher accuracy compared to the printed state of the art.

Conventional stress monitoring relies on episodic, symptom-focused interventions, missing the need for continuous, accessible, and cost-efficient solutions. State-of-the-art approaches use rigid, silicon-based wearables, which, though capable of multitasking, are not optimized for lightweight, flexible wear, limiting their practicality for continuous monitoring. In contrast, flexible electronics (FE) offer flexibility and low manufacturing costs, enabling real-time stress monitoring circuits. However, implementing complex circuits like machine learning (ML) classifiers in FE is challenging due to integration and power constraints. Previous research has explored flexible biosensors and ADCs, but classifier design for stress detection remains underexplored. This work presents the first comprehensive design space exploration of low-power, flexible stress classifiers. We cover various ML classifiers, feature selection, and neural simplification algorithms, with over 1200 flexible classifiers. To optimize hardware efficiency, fully customized circuits with low-precision arithmetic are designed in each case. Our exploration provides insights into designing real-time stress classifiers that offer higher accuracy than current methods, while being low-cost, conformable, and ensuring low power and compact size.

Printed Electronics (PE) stands out as a promising technology for widespread computing due to its distinct attributes, such as low costs and flexible manufacturing. Unlike traditional silicon-based technologies, PE enables stretchable, conformal, and non-toxic hardware. However, PE are constrained by larger feature sizes, making it challenging to implement complex circuits such as machine learning (ML) classifiers. Approximate computing has been proven to reduce the hardware cost of ML circuits such as Multilayer Perceptrons (MLPs). In this paper, we maximize the benefits of approximate computing by integrating hardware approximation into the MLP training process. Due to the discrete nature of hardware approximation, we propose and implement a genetic-based, approximate, hardware-aware training approach specifically designed for printed MLPs. For a 5% accuracy loss, our MLPs achieve over 5 × area and power reduction compared to the baseline while outperforming state-of-the-art approximate and stochastic printed MLPs.

Printed Electronics (PE) is an emerging technology with flexible substrates and ultra-low-cost manufacturing, providing an appealing alternative to traditional wafer-scale silicon fabrication. With the increasing integration of various printed neural network (NN) architectures in diverse applications, the reliability of printed circuits has become a critical concern. This work provides a comprehensive analysis of the fault sensitivity on a variety of classification tasks for various digital and analog realizations of printed multilayer perceptrons (MLPs). We further evaluate different digital architectures, i.e., generic, bespoke, and approximate, to provide a comprehensive fault analysis on different benchmark datasets.

Printed Electronics (PE) feature distinct and remarkable characteristics that make them a prominent technology for achieving true ubiquitous computing. This is particularly relevant in application domains that require conformal and ultra-low cost solutions, which have experienced limited penetration of computing until now. Unlike silicon-based technologies, PE offer unparalleled features such as non-recurring engineering costs, ultra-low manufacturing cost, and on-demand fabrication of conformal, flexible, non-toxic, and stretchable hardware. However, PE face certain limitations due to their large feature sizes, that impede the realization of complex circuits, such as machine learning classifiers. In this work, we address these limitations by leveraging the principles of Approximate Computing and Bespoke (fully-customized) design. We propose an automated framework for designing ultra-low power Multilayer Perceptron (MLP) classifiers which employs, for the first time, a holistic approach to approximate all functions of the MLP's neurons: multiplication, accumulation, and activation. Through comprehensive evaluation across various MLPs of varying size, our framework demonstrates the ability to enable battery-powered operation of even the most intricate MLP architecture examined, significantly surpassing the current state of the art.