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Galib Ibne Haidar

dblp:389/6931 · DBLP profile ↗
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3ranked-venue papers
3as first author
3since 2021 · last 2026
0009-0008-1349-3234ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 3 · 3 first-author · 3 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Network and information security
1 paper
Cryptographic primitives and cryptanalysis · 67% Hardware security and side channels · 33%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%

Topics — the 4 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Cryptographic primitives and cryptanalysis
authenticated encryption
0.812024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package · DAC 2024
Cryptographic primitives and cryptanalysis › encryption
partial encryption
0.812024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package · DAC 2024
Integrated circuit design › heterogeneous integration
chiplet integration
0.212024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package · DAC 2024
Integrated circuit design › packaging
system-in-package
0.212024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package · DAC 2024

Methods — techniques the papers use, named apart from their topics

authenticated encryption protocol · 1.5
YearPublicationVenuePosition
2026 CHSM-Guard: Secure Boot and In-Field Firmware Updates for Chiplet-Based SiPs
Galib Ibne Haidar, Jingbo Zhou 0002, Mark Tehranipoor, Farimah Farahmandi
ACM Great Lakes Symposium on VLSI1
2024 GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package
abstract
A heterogeneous integrated system in package (SIP) system integrates chiplets outsourced from different vendors into the same substrate for better performance. However, during post-integration testing, the sensitive testing data designated for a specific chiplet can be blocked, tampered or sniffed by other malicious chiplets. This paper proposes GATE-SiP which is an authenticated partial encryption protocol to enable secure testing. Within GATE-SiP, the sensitive testing pattern will only be sent to the authenticated chiplet. In addition, partial encryption of the sensitive data prevents data sniff threats without causing significant penalties on timing overhead. Extensive simulation results show the GATE-SiP protocol only brings 6.74% and 14.31% on area and timing overhead, respectively.
Galib Ibne Haidar, Kimia Zamiri Azar, Hadi Mardani Kamali, Mark Tehranipoor, Farimah Farahmandi
DAC1
2024 SECT-HI: Enabling Secure Testing for Heterogeneous Integration to Prevent SiP Counterfeits
abstract
Due to Moore’s law limitations, SiP became popular in recent years among industries to increase functionality density, by integrating multiple chiplets on a shared interposer substrate. To reduce the time-to-market, SiP designers need to outsource their SiPs to untrusted testing facilities, relinquishing control during testing. However, it leads to over-production and counterfeit threats. In this paper, we propose a novel framework SECT-HI aimed at establishing a secure testing environment for SiPs by granting control of the test procedure to the SiP designers. To mitigate the risks of overproduction and distribution of out-of-spec, faulty SiPs, the SiP’s functionality remains locked until the SiP designer provides the correct key. Additionally, the scan chain responses are also encrypted to prevent unauthorized access from test facilities creating a golden response database. Further, a watermark is added to deter counterfeits. Extensive simulation results demonstrate that the SECT-HI framework introduces an area and timing overhead of only 1.1-3.4% and 280ms respectively while adhering to the packaging criteria for 2.5D/3D SiPs.
Galib Ibne Haidar, Md Sami Ul Islam Sami, Jingbo Zhou 0002, Kimia Zamiri Azar, Mark Tehranipoor, Farimah Farahmandi
ITC1