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Fengyu Du

dblp:403/7478 · DBLP profile ↗
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1ranked-venue papers
0as first author
1since 2021 · last 2025
—ORCID · unresolved

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 77% Hardware reliability and fault tolerance · 23%

Topics — the 1 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
power semiconductor devices
0.912025
Analysis and fabrication of a SiC super-junction termination structure in a state of charge imbalance · Sci. China Inf. Sci. 2025
YearPublicationVenuePosition
2025 Analysis and fabrication of a SiC super-junction termination structure in a state of charge imbalance
Haobo Kang, Fengyu Du, Boyi Bai, Xiaoyan Tang, Qingwen Song
Sci. China Inf. Sci.2