Demo Data from VLDB 2026 / reviewers in the wild / expert
Jagannath Premkumar
dblp:57/1072
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2008
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Interconnection networks and networks-on-chip · 88% Processor architecture and microarchitecture · 12% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Interconnection networks and networks-on-chip › network-on-chip design
reconfigurable noc |
0.1 | 1 | 2008 | Power reduction of CMP communication networks via RF-interconnects · MICRO 2008 |
Interconnection networks and networks-on-chip › on-chip interconnect
RF-interconnect |
0.1 | 1 | 2008 | Power reduction of CMP communication networks via RF-interconnects · MICRO 2008 |
Processor architecture and microarchitecture
chip multiprocessor |
0.0 | 1 | 2008 | Power reduction of CMP communication networks via RF-interconnects · MICRO 2008 |
Interconnection networks and networks-on-chip
on-chip communication |
0.0 | 1 | 2008 | Power reduction of CMP communication networks via RF-interconnects · MICRO 2008 |
Methods — techniques the papers use, named apart from their topics
multicast · 0.1dynamic bandwidth allocation · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2008 | Power reduction of CMP communication networks via RF-interconnectsabstractAs chip multiprocessors scale to a greater number of processing cores, on-chip interconnection networks will experience dramatic increases in both bandwidth demand and power dissipation. Fortunately, promising gains can be realized via integration of radio frequency interconnect (RF-I) through on-chip transmission lines with traditional interconnects implemented with RC wires. While prior work has considered the latency advantage of RF-I, we demonstrate three further advantages of RF-I: (1) RF-I bandwidth can be flexibly allocated to provide an adaptive NoC, (2) RF-I can enable a dramatic power and area reduction by simplification of NoC topology, and (3) RF-I provides natural and efficient support for multicast. In this paper, we propose a novel interconnect design, exploiting dynamic RF-I bandwidth allocation to realize a reconfigurable network-on-chip architecture. We find that our adaptive RF-I architecture on top of a mesh with 4B links can even outperform the baseline with 16B mesh links by about 1%, and reduces NoC power by approximately 65% including the overhead incurred for supporting RF-I. Mau-Chung Frank Chang, Jason Cong, Adam Kaplan, Chunyue Liu, Mishali Naik, Jagannath Premkumar, Glenn Reinman, Eran Socher, Sai-Wang Tam |
MICRO | 6 |