Demo Data from VLDB 2026 / reviewers in the wild / expert
Weikai Sun
dblp:63/700
· DBLP profile ↗
2ranked-venue papers
1as first author
0since 2021 · last 1996
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 2 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 75% Integrated circuit design · 25% | |
| Interdisciplinary, comprehensive, and emerging computing
1 paper |
Computational science and engineering · 100% |
Topics — the 5 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
analog and mixed-signal circuits |
0.0 | 1 | 1996 | Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of Invariance · DAC 1996 |
Electronic design automation › physical design › parasitic extraction
capacitance extraction |
0.0 | 1 | 1996 | Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of Invariance · DAC 1996 |
Electronic design automation › physical design › parasitic extraction
interconnect parasitic extraction |
0.0 | 1 | 1996 | Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of Invariance · DAC 1996 |
Electronic design automation
physical design |
0.0 | 1 | 1996 | Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of Invariance · DAC 1996 |
Computational science and engineering › computational physics
computational electromagnetics |
0.0 | 1 | 1996 | Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of Invariance · DAC 1996 |
Methods — techniques the papers use, named apart from their topics
geometry independent MEI · 0.0finite difference · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1996 | Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of InvarianceabstractMeasured Equation of Invariance(MEI) is a new concept in computational electromagnetics.It has been demonstrated that the MEI technique can be used to terminate the meshes very close to the object boundary and still strictly preserves the sparsity of the FD equations.Therefore, the nal system matrix encountered by MEI is a sparse matrix with size similar to that of integral equation methods.However, complicated Green's function and disagreeable Sommerfeld integrals make the traditional MEI very dicult, if not impossible, to be applied to analyze multilayer and multiconductor interconnects.In this paper, we propose the Geometry Independent MEI(GIMEI) which substantially improved the original MEI method.We use GIMEI for capacitance extraction of general three-dimension VLSI interconnect.Numerical results are i n g o o d agreement with published data and those obtained by using FASTCAP [1], while GIMEI is generally an order of magnitude faster than FASTCAP and uses signi cant less memory than FAST-CAP. Weikai Sun, Wayne Wei-Ming Dai, Wei Hong II |
DAC | 1 |
| 1996 | A novel dimension reduction technique for the capacitance extraction of 3D VLSI interconnectsabstractIn this paper, we present a new capacitance extraction method named Dimension Reduction Technique (DRT) for 3D VLSI interconnects. The DRT converts a complex 3D problem into a series of cascading simple 2D problems. Each 3D problem is solved separately, so we can choose the most efficient method according to the arrangement of conductors. More importantly, it is very easy to obtain the analytical solutions of 2D problem in many layers such as the pure dielectric layers and the layers with parallel signal lines. Therefore, the domain that has to be analyzed numerically is minimized. This leads to the drastic reduction of the computing time and memory needs. We have used the DRT to extract the capacitances of multilayered and multiconductor cross-overs, bends, via with signal lines and open-end. The results are in good agreement with those of Ansoft's SPICELINK and MIT's FastCap, but the computing time and memory size used by the DRT are several even tens times less than those used by SPICELINK and FastCap. Wei Hong II, Weikai Sun, Zhenhai Zhu, Ben Song, Wayne Wei-Ming Dai |
ICCAD | 2 |