Leakage power is becoming significant in new generation IC chips. As leakage power is nonlinearly related to temperature, it is challenging to manage the thermal behavior of today's multicore systems, since thermal management becomes a nonlinear control problem. In this paper, a new predictive dynamic thermal management (DTM) method with neural network thermal model is proposed to naturally consider the inherent nonlinearity between leakage and temperature. We start with analyzing the problems of using recurrent neural network (RNN) to build the nonlinear thermal model, and point out that there is exploding gradient induced long-term dependencies problem, leading to large model prediction errors. Based on this analysis, we further propose to use echo state network (ESN), which is a special type of RNN, as the leakage-aware nonlinear thermal model. We theoretically and experimentally show that ESN achieves much higher accuracy by completely avoiding the long-term dependencies problem. On top of this nonlinear ESN thermal model, we propose a novel model predictive control (MPC) scheme called ESN MPC, which uses iterative steps to find the optimal future power recommendations for thermal management. Being able to consider the leakage-temperature nonlinear effects and equipped with advanced control technique, the new method achieves an overall high quality temperature management with smooth and accurate temperature tracking. The experimental results show the new method outperforms the state-of-the-art leakage-aware multicore DTM method in both temperature management quality and computing overhead.

Performing thermal management on new generation IC chips is challenging. This is because the leakage power, which is significant in today's chips, is nonlinearly related to temperature, resulting in a complex nonlinear control problem in thermal management. In this paper, a new dynamic thermal management (DTM) method with piecewise linear (PWL) thermal model based predictive control is proposed to solve the nonlinear control problem. First, a PWL thermal model is built by combining multiple local linear thermal models expanded at several Taylor expansion points. These Taylor expansion points are carefully selected by a systematic scheme which exploits the thermal behavior property of the IC chips. Based on the PWL thermal model, a new predictive control method is proposed to compute the future power recommendation for DTM. By approximating the nonlinearity accurately with the PWL thermal model and being equipped with predictive control technique, the new DTM can achieve an overall high quality temperature management with smooth and accurate temperature tracking. Experimental results show the new method outperforms the linear model predictive control based method in temperature management quality with negligible computing overhead.

Dark silicon phenomenon is significant in today's multi/many-core systems manufactured using new generation technology. In order to enhance performance of dark silicon systems, power budget constrained dynamic optimizations are performed in various ways including dynamic voltage and frequency scaling (DVFS) and task scheduling. However, power budgets given by existing methods are generally over pessimistic, which greatly limit the capability of dynamic performance optimization methods. In order to resolve this problem, we propose a dynamic power budgeting method, called Greedy based Dynamic Power (GDP). Different from existing methods, which are steady state based and ignore active core distributions, GDP formulates the power budgeting problem as a thermal-constrained combinational power optimization problem. To efficiently solve this problem, we propose two new ideas: first, we transform the original power-optimization problem to an easier solving temperature-optimization problem; second, we employ a more efficient greedy based algorithm that finds a sub-optimal active core distribution which maximizes power budget. The new method can consider current temperature states and transient thermal effects, which were ignored by existing methods. Both theoretical studies and experimental results show that GDP outperforms existing methods by providing a higher and less pessimistic power budget with low computing cost and guaranteed thermal safety.

Accurate and fast reliability management is important for 3-D integrated circuits (3-D ICs) because of the severe on-chip thermal and reliability problems. However, due to the lack of stress information and difficulties in implementing management method for reliability, existing full-chip reliability management methods suffer from low management accuracy and high system performance degradation. In this paper, we propose a new stress and thermal aware reliability management method for 3-D ICs called STREAM. Unlike traditional methods which do not perform explicit stress analysis due to the large computing cost, STREAM employs an artificial neural network-based stress model to estimate stress accurately at runtime. In order to further improve the reliability management accuracy and improve the system performance, a lifetime estimator with lifetime banking technology and a specially designed lifetime model predictive control are integrated into the reliability management framework. Our numerical results show that STREAM performs the stress and thermal aware full-chip reliability management with both high accuracy and speed. It is able to boost the performance of 3-D ICs and outperforms the state-of-the-art 3-D IC reliability management method.

Heat dissipation and the related thermal-mechanical stress problems are the major obstacles in the development of the three-dimensional integrated circuit (3D IC). Reliability management techniques can be used to alleviate such problems and enhance the reliability of 3D IC. However, it is difficult to obtain the time-varying stress information at runtime, which limits the effectiveness of the reliability management. In this article, we propose a fast stress estimation method for runtime reliability management using artificial neural network (ANN). The new method builds ANN-based stress model by training offline using temperature and stress data. The ANN stress model is then used to estimate the important stress information, such as the maximum stress around each TSV, for reliability management at runtime. Since there are a variety of potential ANN structures to choose from for the ANN stress model, we analyze and test three ANN-based stress models with three major types of ANNs in this work: the normal ANN-based stress model, the ANN stress model with hand-crafted feature extraction, and the convolutional neural network–(CNN) based stress model. The structures of each ANN stress model and the functions of these structures in 3D IC stress estimation are demonstrated and explained. The new runtime stress estimation method is tested using the three ANN stress models with different layer configurations. Experiments show that the new method is able to estimate important stress information at extremely fast speed with good accuracy for runtime 3D IC reliability enhancement. Although all three ANN stress models show acceptable capabilities in runtime stress estimation, the CNN-based stress model achieves the best performance considering both stress estimation accuracy and computing overhead. Comparison with traditional method reveals that the new ANN-based stress estimation method is much more accurate with a slightly larger but still very small computing overhead.

Accurate and fast thermal estimation is important for the runtime thermal regulation of modern microprocessors due to excessive on-chip temperatures. However, due to the nonlinear relationship between the leakage power and temperature, full-chip thermal estimation methods suffer slow speed and scalability issue when the increasing static leakage power is considered. In this work, we propose a new fast leakage-aware full-chip thermal estimation method. Unlike traditional methods, which use iteration to handle the leakage-temperature nonlinearity dependency issue, the new method applies a dynamic linearization algorithm, which adaptively transforms the original nonlinear thermal model into a number of local linear thermal models. In order to further improve the thermal estimation efficiency, a specially-designed adaptive model order reduction method is integrated into the thermal estimation framework to generate local compact thermal models. Our numerical results show that the new method is able to accurately estimate full-chip transient temperature distribution by fully considering the nonlinear leakage-temperature dependency with fast speed. On different chips with core number ranging from 9 to 36, it achieved 85x to 589x speedup in average against traditional iteration based method, with average thermal estimation error to be around 0.2°C.

Efficient temperature estimation is vital for designing thermally efficient, lower power and robust integrated circuits in nanometer regime. Thermal simulation based on the detailed thermal structures no longer meets the demanding tasks for efficient design space exploration. The compact and composable model-based simulation provides a viable solution to this difficult problem. However, building such thermal models from detailed thermal structures was not well addressed in the past. In this article, we propose a new compact thermal modeling technique, called ThermComp , standing for thermal modeling with composable modules. ThermComp can be used for fast thermal design space exploration for multicore microprocessors. The new approach builds the composable model from detailed structures for each basic module using the finite difference method and reduces the model complexity by the sampling-based model order reduction technique. These composable models are then used to assemble different multicore architecture thermal models and realized into SPICE-like netlists. The resulting thermal models can be simulated by the general circuit simulator SPICE. ThermComp tries to preserve the accuracy of fine-grained models with the speed of coarse-grained models. Experimental results on a number of multicore microprocessor architectures show the new approach can easily build accurate thermal systems from compact composable models for fast architecture thermal analysis and optimization and is much faster than the existing HotSpot method with similar accuracy.