VLDB 2026 Research / reviewers in the wild / expert
Ziyue Zhao 0003
dblp:80/10894-3 · also Zi-Yue Zhao 0003
· DBLP profile ↗
4ranked-venue papers
1as first author
4since 2021 · last 2026
0000-0001-6929-5212ORCID · verified
Domains — the database's venue-derived domains; a paper can count in several
Computer networks · 2 · 2 since 2021Applied, interdisciplinary, general and emerging computing · 2 · 1 first-author · 2 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Integrated circuit design · 85% Hardware reliability and fault tolerance · 15% | |
| Computer networks
1 paper |
Physical-layer communications · 77% Cellular and mobile networks · 23% |
Topics — the 11 heaviest of 12, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
analog and mixed-signal circuits |
1.0 | 1 | 2026 | Physical structure-based small signal modeling for GaN Fin-HEMTs · Sci. China Inf. Sci. 2026 |
Integrated circuit design › analog and mixed-signal circuits
device modeling |
1.0 | 1 | 2026 | Physical structure-based small signal modeling for GaN Fin-HEMTs · Sci. China Inf. Sci. 2026 |
Integrated circuit design › analog and mixed-signal circuits › device modeling
small-signal model |
1.0 | 1 | 2026 | Physical structure-based small signal modeling for GaN Fin-HEMTs · Sci. China Inf. Sci. 2026 |
Physical-layer communications
digital predistortion |
0.9 | 1 | 2025 | Linearization of Fully-Connected Hybrid Beamforming Transmitters Using Analytical Multi-Input Models for Millimeter-Wave Communications · IEEE Trans. Commun. 2025 |
Physical-layer communications › beamforming
hybrid beamforming |
0.9 | 1 | 2025 | Linearization of Fully-Connected Hybrid Beamforming Transmitters Using Analytical Multi-Input Models for Millimeter-Wave Communications · IEEE Trans. Commun. 2025 |
Cellular and mobile networks
millimeter-wave communication |
0.9 | 1 | 2025 | Linearization of Fully-Connected Hybrid Beamforming Transmitters Using Analytical Multi-Input Models for Millimeter-Wave Communications · IEEE Trans. Commun. 2025 |
Physical-layer communications › receiver design › RF impairment compensation
power amplifier linearization |
0.9 | 1 | 2025 | Linearization of Fully-Connected Hybrid Beamforming Transmitters Using Analytical Multi-Input Models for Millimeter-Wave Communications · IEEE Trans. Commun. 2025 |
Hardware reliability and fault tolerance › aging
transistor aging |
0.7 | 1 | 2023 | Degradation induced by holes in Si3N4/AlGaN/GaN MIS HEMTs under off-state stress with UV light · Sci. China Inf. Sci. 2023 |
Integrated circuit design
digital circuit design |
0.3 | 1 | 2026 | Physical structure-based small signal modeling for GaN Fin-HEMTs · Sci. China Inf. Sci. 2026 |
Integrated circuit design › digital circuit design
gan transistor |
0.3 | 1 | 2026 | Physical structure-based small signal modeling for GaN Fin-HEMTs · Sci. China Inf. Sci. 2026 |
Physical-layer communications › MIMO
massive MIMO |
0.3 | 1 | 2025 | Linearization of Fully-Connected Hybrid Beamforming Transmitters Using Analytical Multi-Input Models for Millimeter-Wave Communications · IEEE Trans. Commun. 2025 |
Methods — techniques the papers use, named apart from their topics
physical structure-based modeling · 1.0digital pre-distortion · 0.9analytical multi-input behavioral model · 0.9off-state stress · 0.7UV light stress · 0.7
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | Physical structure-based small signal modeling for GaN Fin-HEMTs
Ziyue Zhao 0003, Chupeng Yi, Ting Feng 0002, Xin Liu 0063, Guanghai Yao, Xiaohua Ma 0001, Yue Hao 0001 |
Sci. China Inf. Sci. | 1 |
| 2025 | Class-F-1 GaN Power Amplifier Integrated Active Antenna With Increased Efficiency for Wireless Power Transmission ApplicationsabstractThis article introduces a novel power amplifier integrated active antenna (PAIAA) with increased efficiency that integrates a Class-$F {^{-}1 }$Gallium Nitride (GaN) power amplifier (PA) and a stub-loaded wide slot antenna (SLSA) for wireless power transmission (WPT) applications. Unlike conventional PA integrated active antennas in which antennas and PAs are separately matched to 50 ohms, the input impedance of the SLSA is meticulously engineered to match the fundamental impedance and modulate harmonic impedances of the GaN transistor by optimizing the dimensions of the SLSA's stubs. This approach eliminates the output matching network (OMN), the PA's harmonic modulation network (HMN), and the antenna's input matching network (IMN), which typically incur unavoidable insertion loss but are essential for conventional Class-$F {^{-}1 }$PAs and antennas. Consequently, it enhances the power-added efficiency (PAE) within the 3.3–3.8-GHz range and reduces the overall size of the PA integrated active antenna. Thanks to the extended design freedom offered by SLSA, precise impedance values can be achieved across a broader frequency range, resulting in increased efficiency across a larger spectrum. In addition, an innovative insertion loss measurement method for impedance matching network with a non-50-$\Omega $port is introduced to accurately measure the Class-$F {^{-}1 }$PA's PAE incorporated in the proposed PAIAA. The measured PAIAA demonstrates a peak PAE of 70.1%, surpassing the performances of reported integrated active antennas. The measured effective isotropic radiated power (EIRP) of the proposed PAIAA is 44.52 dBm. A conventional PA-antenna design, where an antenna and a Class-$F {^{-}1 }$PA are separately matched to$50~\Omega $and simply cascaded, is also designed and measured as a contrast, whose measured peak PAE and EIRP of the conventional design are only 61.5% and 43.9 dBm, respectively. The proposed PAIAA, with its increased efficiency, can be practically utilized for WPT applications in the Internet of Things (IoT), where efficiency performance is critical. Wenliang Liu 0003, Jing-Ya Deng, Chupeng Yi, Ziyue Zhao 0003, Ting Feng 0002, Xin Liu 0063, Xiaohua Ma 0001, Yue Hao 0001 |
IEEE Internet Things J. | 4 |
| 2025 | Linearization of Fully-Connected Hybrid Beamforming Transmitters Using Analytical Multi-Input Models for Millimeter-Wave CommunicationsabstractIn recent years, fully-connected hybrid beamforming (FC-HBF) architecture has aroused widespread interest for millimeter wave (mmWave) massive multi-input multi-output (MIMO) communication systems. However, the FC-HBF structure suffers from significant linearity deterioration, limiting its applications in actual mmWave transmitters. To resolve this issue, an effective digital predistortion (DPD) method utilizing analytical multi-input behavioral models is proposed in this paper for linearizing the FC-HBF system. Based on the nonlinearity analysis and behavioral modeling of the array response, three analytical multi-input models are derived by embedding the priori beamforming information in the predistorter. The complexity of the proposed analytical models is significantly reduced compared to the state-of-the-art. Numerical simulations and experimental measurement are carried out on a$4\times 64$mmWave FC-HBF array and$2\times 16$quasi-test platform respectively to validate the performance of the proposed DPDs against the state-of-the-art DPDs, which show significant linearization abilities to compensate for the nonlinear distortions of beam signals. The proof-of-the-concept validations in this paper indicate that the proposed scheme is fully capable of linearizing an mmWave FC-HBF array. Xin Liu 0063, Huanhuan Jia, Ziyue Zhao 0003, Chupeng Yi, Ting Feng 0002, Xiaohua Ma 0001, Wenhua Chen 0002, Zhenghe Feng, Fadhel M. Ghannouchi |
IEEE Trans. Commun. | 4 |
| 2023 | Degradation induced by holes in Si3N4/AlGaN/GaN MIS HEMTs under off-state stress with UV light
Qing Zhu 0013, Jiejie Zhu, Minhan Mi, Yuwei Zhou, Ziyue Zhao 0003, Xiaohua Ma 0001, Yue Hao 0001 |
Sci. China Inf. Sci. | 7 |