Process technology and environment-induced variability of gates and wires in VLSI circuits make timing analyses of such circuits a challenging task. Process variation can have a significant impact on both device (front-end of the line) and interconnect (back-end of the line) performance. Statistical static timing analysis techniques are being developed to tackle this important problem. Existing timing analysis tools divide the analysis into interconnect (wire) timing analysis and gate timing analysis. In this paper, we focus on statistical static timing analysis of coupled interconnects where crosstalk noise analysis is unavoidable. We propose a new framework for handling the effect of Gaussian and Non-Gaussian process variations on coupled interconnects. The technique allows for closed-form computation of interconnect delay probability density functions (PDFs) given variations in relevant process parameters such as the line width, metal thickness, and dielectric thickness in the presence of crosstalk noise. To achieve this goal, we express the electrical parameters of the coupled interconnects in a first order (linear) form as function of changes in physical parameters and subsequently use these forms to perform accurate timing and noise analysis to produce the propagation delay and slew in the first-order forms. This work can be easily extended to consider the effect of higher order terms of the sources of variation. Experimental results show that the proposed method is capable of accurately predicting delay variation in a coupled interconnect line.

Static timing analysis is a key step in the physical design optimization of VLSI designs. The lumped capacitance model for gate delay and the Elmore model for wire delay have been shown to be inadequate for wire-dominated designs. Using the effective capacitance model for the gate delay calculation and model-order reduction techniques for wire delay calculation is prohibitively expensive. In this paper, we present sufficiently accurate and highly efficient filtering algorithms for interconnect timing as well as gate timing analysis. The key idea is to partition the circuit into low and high complexity circuits, whereby low complexity circuits are handled with efficient algorithms such as total capacitance algorithm for gate delay and the Elmore metric for wire delay and high complexity circuits are handled with sign-off algorithms. Experimental results on microprocessor designs show accuracies that are quite comparable with sign-off delay calculators with more than of 65% reduction in the computation times

A technique based on the sensitivity of the output to input waveform is presented for accurate propagation of delay information through a gate for the purpose of static timing analysis (STA) in the presence of noise. Conventional STA tools represent a waveform by its arrival time and slope. However, this is not an accurate way of modeling the waveform for the purpose of noise analysis. The key contribution of our work is the development of a method that allows efficient propagation of equivalent waveforms throughout the circuit. Experimental results demonstrate higher accuracy of the proposed sensitivity-based gate delay propagation technique, SGDP, compared to the best of existing approaches. SGDP is compatible with the current level of gate characterization in conventional ASIC cell libraries, and as a result, it can be easily incorporated into commercial STA tools to improve their accuracy.

Nonuniform thermal profiles on the substrate in high-performance ICs can significantly impact the performance of global on-chip interconnects. This paper presents a detailed modeling and analysis of the interconnect performance degradation due to the nonuniform temperature profiles that are encountered along long metal interconnects as a result of existing thermal gradients in the underlying Silicon substrate. A nonuniform temperature-dependent distributed RC interconnect delay model is proposed. The model is applied to a wide variety of interconnect layouts and substrate temperature distributions to quantify the impact of such thermal nonuniformities on signal integrity issues including speed degradation in global interconnect lines and skew fluctuations in clock signal distribution networks. Subsequently, a new thermally dependent zero-skew clock-routing methodology is presented. This study suggests that thermally aware analysis should become an integrated part of the various optimization steps in physical-synthesis flow to improve the performance and integrity of signals in global ultra large scale integration interconnects.

This paper describes an efficient threshold-based filtering algorithm (TFA) for calculating the interconnect delay and slew (transition time) in high-speed VLSI circuits. The key idea is to divide the circuit nets into three groups of low, medium and high complexity nets, whereby for low and medium complexity nets either the first moment of the impulse response or the first and second moments are used. For the high-complexity nets, which are encountered infrequently, TFA resorts to the AWE method. The key contribution of the paper is to come up with very effective and efficient way of classifying the nets into these three groups. Experimental results show that on a large industrial circuit using a state-of-the-art commercial timing analysis that incorporates TFA, we were able to achieve delay and slew estimation accuracies that are quite comparable with the full-blown AWE-based calculators at runtimes that were only 14% higher than those of a simple Elmore-delay calculator.

This paper presents a new algorithm for timing-driven cell placement using the notion of movable Steiner points that capture the net topology. The proposed algorithm improves the timing closure at the backend of the EDA design flow. Unlike conventional flows that perform placement and routing in two separate steps and use rough estimates of the net lengths during placement, our algorithm uses accurate net lengths by considering the net topologies during the Elmore delay calculation step and dynamically updates the routing during the concurrent placement of Steiner points and cells. The simultaneous placement and routing problem is formulated as a mathematical program with a small number of variables and solved by the Han-Powell method. Experimental results demonstrate the effectiveness of the new approach compared to the conventional flows.

Non-uniform temperature profiles along global interconnect lines in high-performance ICs can significantly impact the performance of these lines. This paper presents a detailed analysis and modeling of the interconnect performance degradation due to non-uniform temperature profiles that exist along their lengths, which in turn arise due to the thermal gradients in the underlying substrate. A non-uniform temperature-dependent distributed RC interconnect delay model is proposed for the first time. The model has been applied to a wide variety of interconnect layouts and temperature distributions to quantify the impact on signal integrity issues including clock skew fluctuations.

Studies the effects of the substrate thermal gradients on the buffer insertion techniques. Using a non-uniform temperature-dependent distributed RC interconnect delay model, the buffer insertion problem is analyzed and design guidelines are provided to ensure the near-optimality of the signal performance in the presence of the thermal gradients. In addition, the effect of temperature-dependent driver resistance on the buffer insertion is studied. Experimental results show that neglecting thermal gradients in the substrate and the interconnect lines can result in non-optimal solutions when using standard buffer insertion techniques and that these effects intensify with technology scaling.

This paper provides an overview of various thermal issues in high-performance VLSI with especial attention to their implications for performance and reliability. More specifically, it examines the impact of thermal effects on both interconnect design and electromigration reliability and discusses their impact on the allowable current density limits. Furthermore, it also discusses how thermal and reliability constrained current density limits may conflict with those obtained through purely performance based criterion. Additionally, it is shown that chip level thermal effects can have a significant impact on large-scale circuit optimization techniques, including the clock-skew minimization scheme, and can influence other physical design problem formulations. Finally, high-current interconnect design rules for ESD and I/O circuits are also examined.

We present LEOPARD, a fanout optimization algorithm based on the effort delay model for near-continuous size buffer libraries. Our algorithm minimizes area under required timing and input capacitance constraints by finding the tree topology and assigning different gains to each buffer to minimize the total buffer area. Experimental results show that the new algorithm achieves significant buffer area improvement compared to previous approaches.