Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

Hansruedi Heeb

dblp:92/4595 · DBLP profile ↗
← Back
7ranked-venue papers
5as first author
0since 2021 · last 1993
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 7 · 5 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 59% High-performance computing · 32% Integrated circuit design · 10%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
circuit simulation
0.011993
Frequency Domain Microwave Modeling Using Retarded Partial Element Equivalent Circuits · DAC 1993
High-performance computing › scientific computing › computational electromagnetics
partial element equivalent circuit method
0.011993
Frequency Domain Microwave Modeling Using Retarded Partial Element Equivalent Circuits · DAC 1993
Electronic design automation
interconnect modeling
0.011992
Challenges and Advances in Electrical Interconnect Analysis · DAC 1992
Integrated circuit design
analog and mixed-signal circuits
0.011993
Frequency Domain Microwave Modeling Using Retarded Partial Element Equivalent Circuits · DAC 1993

Methods — techniques the papers use, named apart from their topics

retarded partial element equivalent circuit · 0.0frequency-domain modeling · 0.0
YearPublicationVenuePosition
1993 Frequency Domain Microwave Modeling Using Retarded Partial Element Equivalent Circuits
abstract
Article Frequency domain microwave modeling using retarded partial element equivalent circuits Share on Authors: Hansruedi Heeb View Profile , Saila Ponnapalli View Profile , Albert E. Ruehli View Profile Authors Info & Claims DAC '93: Proceedings of the 30th international Design Automation ConferenceJuly 1993 Pages 702–706https://doi.org/10.1145/157485.165097Published:01 July 1993 3citation234DownloadsMetricsTotal Citations3Total Downloads234Last 12 Months0Last 6 weeks0 Get Citation AlertsNew Citation Alert added!This alert has been successfully added and will be sent to:You will be notified whenever a record that you have chosen has been cited.To manage your alert preferences, click on the button below.Manage my AlertsNew Citation Alert!Please log in to your account Save to BinderSave to BinderCreate a New BinderNameCancelCreateExport CitationPublisher SiteGet Access
Hansruedi Heeb, Saila Ponnapalli, Albert E. Ruehli
DAC1
1993 Simulating 3-D retarded interconnect models using complex frequency hopping (CFH)
abstract
With ever increasing clock frequencies, accurate 3-D interconnect analysis in chips and packages is becoming a necessity. The retarded partial element equivalent circuit (rPEEC) method has been successfully applied to 3-D analysis but for large problems it becomes expensive in CPU and memory usage, and in time domain it sometimes has numerical problems. Complex frequency hopping (CFH), a new multi-point moment-matching technique, is expanded to handle retarded networks. CFH speeds up rPEEC frequency domain analysis of large frequency bands significantly. It also allows the efficient calculation of resonances and - most importantly - enables time domain modeling of rPEEC networks that have so far resisted analysis by any other method.
Eli Chiprout, Hansruedi Heeb, Michel S. Nakhla, Albert E. Ruehli
ICCAD2
1992 Challenges and Advances in Electrical Interconnect Analysis
Albert E. Ruehli, Hansruedi Heeb
DAC2
1992 Three Dimensional Circuit Oriented Electromagnetic Modeling for VLSI Interconnects
abstract
A general approach for modeling 3-D layout geometries is presented. In particular, the partial-element equivalent circuit (PEEC) technique has been used successfully to model interconnect structures for chips and packages. The technique, which is circuit based, permits the electrical modeling of arbitrary 3-D geometries and allows 3-D transmission line properties to be analyzed. Recently, the technique has been extended to include retardation and dielectric layers. The authors have experimented with the use of the asymptotic waveform evaluation (AWE) approach to speed up the solution of the resulting circuit equations.>
Hansruedi Heeb, Albert E. Ruehli, J. Eric Bracken, Ronald A. Rohrer
ICCD1
1991 Retarded Models for PC Board Interconnects - Or How the Speed of Light Affects your SPICE Circuit Simulation
abstract
It is shown that retardation effects, due to the finite speed of electromagnetic interactions, play a significant role for PC-board interconnects. It is demonstrated that in some cases errors of more than an order of magnitude result in some frequency components when retardation is neglected. Extensions to a circuit simulator are introduced that make it possible to do retarded circuit simulation. Specifically, an algorithm to extend SPICE-level simulators to include retardation is presented. Comparisons with analytical equations, the method of moments, and with measurements show good agreement.>
Hansruedi Heeb, Albert E. Ruehli
ICCAD1
1990 Simulating Electromagnetic Radiation of Printed Circuit Boards
abstract
A realistic approach is introduced for the computation of the electromagnetic radiation interference (EMI) from printed circuit boards. The approach is suitable for large problems and real circuit boards can be investigated. Each trace and its source and loads are represented as electrical circuits and a conventional time-domain circuit simulation is used to find the currents. The field is then calculated by applying the free-space Green's function to all currents including the polarization currents. This is, to the authors' knowledge, the first CAD tool which can predict EMI from basic principles.>
Hansruedi Heeb, Albert E. Ruehli, J. Janak, Shahrokh Daijavad
ICCAD1
1990 Approximate time-domain models of three-dimensional interconnects
abstract
The time-domain modeling of the connections in a high-speed computer is such of a complexity that practical problems can only be solved using suitable approximations. Presented are the results of a time-domain modeling work where a novel and faster representation of the capacitances has been developed. Instead of a circuit with O(n/sup 2/) capacitances (where n is the number of conductors), an equivalent circuit of n pseudo-capacitances and n dependent voltage sources is used. Due to the increased sparsity of the simulation matrix, the method considerably speeds up the SPICE or ASTAP compute time. In addition, pseudo-capacitances and voltage sources can be calculated from the coefficient of potential matrix, thus making the calculation of the capacitance matrix unnecessary. This reduces the computational complexity of the capacitance extraction O(n/sup 3/) to O(n/sup 2/) resulting in another major speed-up.>
Hansruedi Heeb, Albert E. Ruehli
ICCD1