Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

William J. Starke

dblp:99/6366 · DBLP profile ↗
← Back
5ranked-venue papers
2as first author
1since 2021 · last 2021
0000-0002-5668-585XORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 5 · 2 first-author · 1 since 2021Software engineering, systems software and programming languages · 2 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Hardware accelerators and domain-specific architectures · 36% Storage systems · 34% Processor architecture and microarchitecture · 19%

Topics — the 5 heaviest of 8, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Hardware accelerators and domain-specific architectures
machine learning accelerator
0.512021
Energy Efficiency Boost in the AI-Infused POWER10 Processor · ISCA 2021
Processor architecture and microarchitecture › microprocessor design
processor core design
0.512021
Energy Efficiency Boost in the AI-Infused POWER10 Processor · ISCA 2021
Hardware accelerators and domain-specific architectures › domain-specific accelerator
compression accelerator
0.412020
Data Compression Accelerator on IBM POWER9 and z15 Processors : Industrial Product · ISCA 2020
Storage systems
data compression
0.412020
Data Compression Accelerator on IBM POWER9 and z15 Processors : Industrial Product · ISCA 2020
Storage systems › data compression
lossless compression
0.412020
Data Compression Accelerator on IBM POWER9 and z15 Processors : Industrial Product · ISCA 2020

Methods — techniques the papers use, named apart from their topics

pre-silicon methodology · 0.5on-chip integration · 0.4
YearPublicationVenuePosition
2021 Energy Efficiency Boost in the AI-Infused POWER10 Processor
abstract
We present the novel micro-architectural features, supported by an innovative and novel pre-silicon methodology in the design of POWER10. The resulting projected energy efficiency boost over POWER9 is 2.6x at core level (for SPECint) and up to 3x at socket level. In addition, a new feature supporting inline AI acceleration was added to the POWER ISA and incorporated into the POWER10 processor core design. The resulting boost in SIMD/AI socket performance is projected to be up to 10x for FP32 and 21x for INT8 models of ResNet-50 and BERT-Large. In this paper, we describe the novel methodology deployed and used not only to obtain these efficiency boosts for traditional workloads, but also to infuse AI/ML/HPC capability directly into the POWER10 core.
Brian W. Thompto, Dung Q. Nguyen, José E. Moreira, Ramon Bertran Monfort, Hans M. Jacobson, Richard J. Eickemeyer, Rahul M. Rao, Michael Goulet, Marcy Byers, Christopher J. Gonzalez, Karthik Swaminathan, Nagu R. Dhanwada, Silvia M. Müller, Satish Kumar Sadasivam, Robert K. Montoye, William J. Starke, Christian G. Zoellin, Michael S. Floyd, Jeffrey Stuecheli, Nandhini Chandramoorthy, John-David Wellman, Alper Buyuktosunoglu, Matthias Pflanz, Balaram Sinharoy, Pradip Bose
ISCA17
2020 IBM's POWER10 Processor
abstract
This article consists only of a collection of slides from the author's conference presentation.
William J. Starke, Brian W. Thompto
Hot Chips Symposium1
2020 Data Compression Accelerator on IBM POWER9 and z15 Processors : Industrial Product
abstract
Lossless data compression is highly desirable in enterprise and cloud environments for storage and memory cost savings and improved utilization I/O and network. While the value provided by compression is recognized, its application in practice is often limited because it's a processor intensive operation resulting low throughput and high elapsed time for compression intense workloads.The IBM POWER9 and IBM z15 systems overcome the shortcomings of existing approaches by including a novel on-chip integrated data compression accelerator. The accelerator reduces processor cycles, I/O traffic, memory and storage footprint of many applications practically with zero hardware cost. The accelerator also eliminates the cost and I/O slots that would have been necessary with FPGA/ASIC based compression adapters. On the POWER9 chip, a single accelerator uses less than 0.5% of the processor chip area, but provides a 388x speedup factor over the zlib compression software running on a general-purpose core and provides a 13x speedup factor over the entire chip of cores. On a POWER9 system, the accelerators provide an end-to-end 23% speedup to Apache Spark TPC-DS workload compared to the software baseline. The z15 chip doubles the compression rate of POWER9 resulting in even much higher speedup factors over the compression software running on general-purpose cores. On a maximally configured z15 system topology, on-chip compression accelerators provide up to 280 GB/s data compression rate, the highest in the industry. Overall, the on-chip accelerators significantly advance the state of the art in terms of area, throughput, latency, compression ratio, reduced processor utilization, power/energy efficiency, and integration into the system stack.This paper describes the architecture, and novel elements of the POWER9 and z15 compression/decompression accelerators with emphasis on trade-offs that made the on-chip implementation possible.
Bülent Abali, Bart Blaner, John J. Reilly, Matthias Klein, Craig B. Agricola, Bedri Sendir, Alper Buyuktosunoglu, Christian Jacobi 0002, William J. Starke, Haren Myneni
ISCA10
2019 IBM's Next Generation POWER Processor
abstract
This article consists of a collection of slides from the author's conference presentation.
Jeffrey Stuecheli, Scott Willenborg, William J. Starke
Hot Chips Symposium3
2009 POWER7: IBM's next generation, balanced POWER server chip
William J. Starke
Hot Chips Symposium1