Hengzhou Edward Yan

dblp:371/9396 · DBLP profile ↗
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3ranked-venue papers in the field
1as first author
3since 2021 · last 2026
0009-0004-5265-8995ORCID · reported

Domains — venue-derived; a paper can count in several

Other / Interdisciplinary · 3 (1 first)
YearPublicationVenuePosition
2026 Comprehensive investigation of lubrication for sustainable grinding by principal component analysis (PCA) and an improved unsupervised algorithm
abstract
In the background of Industry 4.0, sustainable advanced manufacturing has become a pivotal challenge, necessitating the development of technologies that minimize resource consumption and environmental impact while maintaining high-quality production. Grinding technology plays a crucial role in this domain, providing solutions for processing hard and brittle materials with microscale accuracy, particularly when the grinding process is classified as precision machining. This study addresses the gaps in sustainable grinding by presenting a comprehensive review of lubrication strategies using an improved latent Dirichlet allocation (LDA) model integrated with Principal component analysis (PCA). The proposed model systematically identifies keyword distributions and topic clusters related to lubricant selection, providing insights into the evolving trends and practices in sustainable grinding. The findings enhance understanding of the main themes and future perspectives of sustainable grinding, bridging the gap between theoretical research and practical implementation in sustainable manufacturing.
Hengzhou Edward Yan, Hongting Zhou, Wai Sze Yip, Suet To
Adv. Eng. Informatics1
2025 Deep-learning-driven intelligent tool wear identification of high-precision machining with multi-scale CNN-BiLSTM-GCN
Baolong Zhang, Louis Luo Fan, Hengzhou Edward Yan, Dongfang Li 0001, Zejia Zhao, Wai Sze Yip, Suet To
Adv. Eng. Informatics4
2024 Technological life-cycle analysis of ultra-precision machining technology: Forecasting perspective directions and tracking the critical transitions with evolution
Hengzhou Edward Yan, Hongting Zhou, Suet To, Wai Sze Yip
Adv. Eng. Informatics2