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Zhe Chen 0021

dblp:06/4240-21 · DBLP profile ↗
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7ranked-venue papers
1as first author
5since 2021 · last 2025
0000-0003-1214-0564ORCID · conflict

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 4 · 3 since 2021Systems, architecture and hardware · 3 · 1 first-author · 2 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 100%
Computer networks
2 papers
Cellular and mobile networks · 71% Physical-layer communications · 18% Edge and fog computing · 11%

Topics — the 7 heaviest of 8, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design › radio-frequency circuit design
millimeter-wave transceiver
0.912025
A 285-310 GHz four-channel transceiver with 22.6 dBm EIRP supporting 64QAM modulation in 130-nm SiGe process · Sci. China Inf. Sci. 2025
Integrated circuit design › radio-frequency circuit design
radio frequency integrated circuits
0.912025
A 285-310 GHz four-channel transceiver with 22.6 dBm EIRP supporting 64QAM modulation in 130-nm SiGe process · Sci. China Inf. Sci. 2025
Cellular and mobile networks
6g
0.512021
Towards 6G wireless communication networks: vision, enabling technologies, and new paradigm shifts · Sci. China Inf. Sci. 2021
Cellular and mobile networks › 6g
non-terrestrial networks
0.512021
Towards 6G wireless communication networks: vision, enabling technologies, and new paradigm shifts · Sci. China Inf. Sci. 2021
Integrated circuit design
analog and mixed-signal circuits
0.412020
A 143.2-168.8-GHz signal source with 5.6 dBm peak output power in a 130-nm SiGe BiCMOS process · Sci. China Inf. Sci. 2020
Integrated circuit design › semiconductor technology › semiconductor process technology
SiGe BiCMOS
0.412020
A 143.2-168.8-GHz signal source with 5.6 dBm peak output power in a 130-nm SiGe BiCMOS process · Sci. China Inf. Sci. 2020
Physical-layer communications
modulation
0.312025
A 285-310 GHz four-channel transceiver with 22.6 dBm EIRP supporting 64QAM modulation in 130-nm SiGe process · Sci. China Inf. Sci. 2025

Methods — techniques the papers use, named apart from their topics

big data · 0.5artificial intelligence · 0.5
YearPublicationVenuePosition
2025 A 285-310 GHz four-channel transceiver with 22.6 dBm EIRP supporting 64QAM modulation in 130-nm SiGe process
Si-Yuan Tang, Zekun Li 0005, Sidou Zheng, Dawei Tang, Jiayang Yu, Rui Zhou 0016, Chen-Yu Ding, Peigen Zhou, Zhe Chen 0021, Pinpin Yan, Jixin Chen, Wei Hong 0002
Sci. China Inf. Sci.12
2025 380-GHz Third Harmonic Signal Generation Using Differentially Pumped Varactors in a CMOS Voltage Controlled Oscillator
abstract
An LC-VCO incorporating differentially pumped varactors for$3^{\mathrm {rd}}$order harmonic generation is demonstrated in a 65-nm bulk CMOS process with an$f_{max}$of ~250 GHz. The differentially pumped N-type Accumulation mode MOS varactor pair acting as a symmetric varactor serves as a frequency tuning element, as well as the non-linear reactive elements for harmonic generation. The measurements show that the circuit has a peak radiated power of -15.2 dBm with a frequency tuning range between 361.4 to 383.3 GHz or 5.9 %, and a peak DC-THz efficiency of 0.102 %. Among the CMOS oscillator signal generators with an on-chip antenna and output frequency greater than 300 GHz, the circuit exhibits the state-of-the-art DC-THz efficiency.
Zhe Chen 0021, Hongcheng Dong, Zhiyu Chen 0016, Wooyeol Choi 0001, Jixin Chen, Kenneth K. O, Wei Hong 0002
IEEE Trans. Circuits Syst. I Regul. Pap.1
2025 A 24-29.5-GHz Scalable 2 × 2 I-Q TX/RX Chipset With Streamlined IF Interfaces for DBF Systems
abstract
This paper proposes a 24-29.5 GHz$2\times 2$transmitter (TX) and receiver (RX) front-end chipset with streamlined intermediate frequency (IF) interfaces for digital beamforming (DBF) systems. An ultra-compact 90° coupler employing a three-dimensional (3-D) coupling structure achieves a 70% reduction in size compared to typical Lange couplers while maintaining excellent performance. This 3-D 90° coupler enables the synthesis/distribution of IF I-Q signals within the transceiver (TRX), enhancing the feasibility of mmWave DBF by reducing the demand for baseband channels and facilitating scalability for multi-beam arrays. To ensure a low-level error vector magnitude (EVM) in the TRX, the chipset employs joint package design for optimal power and noise performance. It utilizes an image-reject mixer to suppress RX image noise and introduces a DC-offset in the single-sideband up-converter for LO leakage regulation. Additionally, a frequency doubler chain is incorporated to enhance phase noise performance. Fabricated using 0.13-$\mu $m SiGe BiCMOS technology and packaged in WLCSP process, the TX achieves an average output 1-dB compression point ($OP_{1dB}$) of 20 dBm per channel. The RX chip features a minimum noise figure (NF) of 3.4 dB. Over-the-air (OTA) measurements conducted over a 1.1-m distance reveal a transmission data rate of up to 8 Gb/s using 16-QAM modulation at 25 GHz. Furthermore, when employing a 400-MHz 64-QAM 5G New Radio (NR) modulation, the system maintains EVM levels below -33 dB at 25 GHz and below -30 dB over 24-29.5 GHz.
Jixin Chen, Zhe Chen 0021, Xiaoyue Xia, Yun Hu 0005, Sidou Zheng, Zekun Li 0005, Rui Zhou 0016, Peigen Zhou, Wei Hong 0002
IEEE Trans. Circuits Syst. I Regul. Pap.3
2021 Towards 6G wireless communication networks: vision, enabling technologies, and new paradigm shifts
abstract
Abstract The fifth generation (5G) wireless communication networks are being deployed worldwide from 2020 and more capabilities are in the process of being standardized, such as mass connectivity, ultra-reliability, and guaranteed low latency. However, 5G will not meet all requirements of the future in 2030 and beyond, and sixth generation (6G) wireless communication networks are expected to provide global coverage, enhanced spectral/energy/cost efficiency, better intelligence level and security, etc. To meet these requirements, 6G networks will rely on new enabling technologies, i.e., air interface and transmission technologies and novel network architecture, such as waveform design, multiple access, channel coding schemes, multi-antenna technologies, network slicing, cell-free architecture, and cloud/fog/edge computing. Our vision on 6G is that it will have four new paradigm shifts. First, to satisfy the requirement of global coverage, 6G will not be limited to terrestrial communication networks, which will need to be complemented with non-terrestrial networks such as satellite and unmanned aerial vehicle (UAV) communication networks, thus achieving a space-air-ground-sea integrated communication network. Second, all spectra will be fully explored to further increase data rates and connection density, including the sub-6 GHz, millimeter wave (mmWave), terahertz (THz), and optical frequency bands. Third, facing the big datasets generated by the use of extremely heterogeneous networks, diverse communication scenarios, large numbers of antennas, wide bandwidths, and new service requirements, 6G networks will enable a new range of smart applications with the aid of artificial intelligence (AI) and big data technologies. Fourth, network security will have to be strengthened when developing 6G networks. This article provides a comprehensive survey of recent advances and future trends in these four aspects. Clearly, 6G with additional technical requirements beyond those of 5G will enable faster and further communications to the extent that the boundary between physical and cyber worlds disappears.
Xiaohu You 0001, Cheng-Xiang Wang 0001, Jie Huang 0004, Xiqi Gao 0001, Zaichen Zhang, Michael Mao Wang, Yongming Huang 0001, Chuan Zhang 0001, Yanxiang Jiang, Jiaheng Wang 0001, Bin Sheng 0003, Dongming Wang 0002, Zhiwen Pan, Pengcheng Zhu 0001, Yang Yang 0001, Zening Liu, Ping Zhang 0003, Xiaofeng Tao 0001, Shaoqian Li, Zhi Chen 0002, Xinying Ma, Chih-Lin I, Shuangfeng Han, Chengkang Pan, Zhiming Zheng 0001, Lajos Hanzo, Xuemin Shen, Y. Jay Guo, Zhiguo Ding 0001, Harald Haas, Wen Tong, Peiying Zhu, Ganghua Yang, Jue Wang 0006, Erik G. Larsson, Hien Quoc Ngo, Wei Hong 0002, Haiming Wang 0001, Debin Hou, Jixin Chen, Zhe Chen 0021, Zhangcheng Hao, Geoffrey Ye Li, Rahim Tafazolli, Yue Gao 0001, H. Vincent Poor, Gerhard P. Fettweis, Ying-Chang Liang
Sci. China Inf. Sci.43
2021 Millimeter-wave wireless communications for home network in fiber-to-the-room scenario
abstract
Millimeter-wave (mmWave) technology has been well studied for both outdoor long-distance transmission and indoor short-range communication. In the recently emerging fiber-to-the-room (FTTR) architecture in the home network of the fifth generation fixed networks (F5G), mmWave technology can be cascaded well to a new optical network terminal in the room to enable extremely high data rate communication (i.e., >10 Gb/s). In the FTTR+mmWave scenario, the rapid degradation of the mmWave signal in long-distance transmission and the significant loss against wall penetration are no longer the bottlenecks for real application. Moreover, the surrounding walls of every room provide excellent isolation to avoid interference and guarantee security. This paper provides insights and analysis for the new FTTR+mmWave architecture to improve the customer experience in future broadband services such as immersive audiovisual videos.
Chao He 0003, Zhixiong Ren, Debin Hou, Le Kuai, Shilin Yang, Zhe Chen 0021, Jixin Chen
Frontiers Inf. Technol. Electron. Eng.10
2020 A 143.2-168.8-GHz signal source with 5.6 dBm peak output power in a 130-nm SiGe BiCMOS process
Peigen Zhou, Jixin Chen, Pinpin Yan, Zhigang Peng, Debin Hou, Zhe Chen 0021, Wei Hong 0002
Sci. China Inf. Sci.6
2019 Fully Integrated Tunable Wideband True Time Delay for Wireless Sensor Networks
abstract
High Performance Wireless Sensor Networks (HP-WSN) for critical, low latency applications such as traffic control, industrial process control, smart structures and smart vehicles has been a fast-growing field. Nevertheless, efforts towards new systems and circuit architectures to enable real-time, predictable and reliable HP-WSN have been limited, specially for reliable, low latency wireless links. This paper presents for the first time, to authors' knowledge, a low power, wideband, large delay, tunable, compact, CMOS-scalable and frequency-independent true time delay cell that enables wideband beamforming on HP-WSN. This new architecture, inspired on bucket brigade devices and N-path structure, is especially well suitable for sub-3 GHz ISM bands, where most of WSN transceivers work. Post-layout simulations of a circuit demonstrator has shown a continuous time delay between 100 - 1000 ps with 0.5% delay variation over 0 - 3 GHz band. The layout area is only 0.025 mm2and it consumes 10 - 19 mW, including buffers. It has also established a record of delay-per-area density of 40000 ps/mm2.
Carlos A. M. Costa Júnior, Kuangyuan Ying, Zhe Chen 0021, Miguel Dhaens, Hao Gao 0001, Peter G. M. Baltus
ISCAS4