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Michael Fazio

dblp:120/3393 · DBLP profile ↗
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1ranked-venue papers
1as first author
0since 2021 · last 2004
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Energy-efficient computing · 62% Integrated circuit design · 38%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
power electronics
0.012004
Ultracompact pulsed power · Proc. IEEE 2004
Energy-efficient computing
pulsed power
0.012004
Ultracompact pulsed power · Proc. IEEE 2004
Energy-efficient computing › thermal management
heat removal
0.012004
Ultracompact pulsed power · Proc. IEEE 2004
Energy-efficient computing
thermal management
0.012004
Ultracompact pulsed power · Proc. IEEE 2004
YearPublicationVenuePosition
2004 Ultracompact pulsed power
abstract
Now more than ever, the pulsed power field is driven by size, weight, and volume constraints. In both the military and commercial arenas, there is an overwhelming need to provide more and more capability in ever smaller and lighter packages. The need for higher energy density, power density, reliability, and efficiency is driving progress in the field. This paper provides a review of the state of the art in various types of pulsed power components such as solid-state switches, capacitors, and power sources. In some cases, familiar components such as switch tubes are being replaced with whole new classes of devices. Batteries are being replaced by hydrocarbon or hydrogen-fueled mechanical systems that alter our paradigm for prime power sources. Trends over the past few years and future possibilities for ultracompact systems are discussed, including advanced techniques for heat removal and energy recovery. Finally, a few practical examples of ultracompact systems are given, emphasizing peak power and peak power density.
Michael Fazio, Hugh C. Kirbie
Proc. IEEE1