Demo Data from SIGIR 2026 / reviewers in the wild / expert
Chao-Chen Cheng
dblp:122/4134
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2010
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 77% Energy-efficient computing · 23% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › optoelectronic devices
light-emitting diodes |
0.1 | 1 | 2010 | High Brightness GaN Vertical Light-Emitting Diodes on Metal Alloy for General Lighting Application · Proc. IEEE 2010 |
Integrated circuit design
optoelectronic devices |
0.1 | 1 | 2010 | High Brightness GaN Vertical Light-Emitting Diodes on Metal Alloy for General Lighting Application · Proc. IEEE 2010 |
Energy-efficient computing › thermal management
heat removal |
0.0 | 1 | 2010 | High Brightness GaN Vertical Light-Emitting Diodes on Metal Alloy for General Lighting Application · Proc. IEEE 2010 |
Energy-efficient computing
thermal management |
0.0 | 1 | 2010 | High Brightness GaN Vertical Light-Emitting Diodes on Metal Alloy for General Lighting Application · Proc. IEEE 2010 |
Methods — techniques the papers use, named apart from their topics
surface engineering · 0.1reflector optimization · 0.1metal alloy substrate · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2010 | High Brightness GaN Vertical Light-Emitting Diodes on Metal Alloy for General Lighting ApplicationabstractIn this paper, we show the many advantages of the GaN-based vertical light-emitting diodes (VLEDs) on metal alloy over conventional LEDs in terms of: better current spreading, vertical current path for low operation voltage, better light extraction, flexible chip size scaling, higher driving current density, faster heat dissipation, and good reliability. The GaN VLED on metal alloy exhibits very good current–voltage behavior with low operated voltage and low serial dynamic resistance. The low operation junction temperature of GaN VLED on metal alloy demonstrates excellent heat dissipation capabilities. Chip size scaling without efficiency loss shows a unique property of GaN VLED on metal alloy. The GaN VLED on metal alloy also enables top surface engineering for efficient light extraction to further light output. A high-power white LED having efficiency of 120 lumen/W was achieved through a combination of reflector, surface engineering, and optimization of the n-GaN layer thickness. Coupled with good reliability and mass production ability, the GaN VLED on metal alloy is very suitable for general lighting application. Chen-Fu Chu, Chao-Chen Cheng, Wen-Huan Liu, Jiunn-Yi Chu, Feng-Hsu Fan, Hao-Chun Cheng, Trung Doan, Chuong Anh Tran |
Proc. IEEE | 2 |