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Olivier Ostinelli

dblp:201/1525 · DBLP profile ↗
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2ranked-venue papers
0as first author
1since 2021 · last 2023
0000-0002-7828-8310ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 48% Electronic design automation · 48% Hardware reliability and fault tolerance · 3%
Computer networks
1 paper
Optical networks · 100%

Topics — the 7 heaviest of 7, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
analog and mixed-signal circuits
0.922023
SPICE Modeling in Verilog-A for Photo-Response in UTC-Photodiodes Targeting Beyond-5G Circuit Design · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017
Electronic design automation
circuit simulation
0.712023
SPICE Modeling in Verilog-A for Photo-Response in UTC-Photodiodes Targeting Beyond-5G Circuit Design · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Electronic design automation › circuit modeling
SPICE modeling
0.712023
SPICE Modeling in Verilog-A for Photo-Response in UTC-Photodiodes Targeting Beyond-5G Circuit Design · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Integrated circuit design › semiconductor devices
heterojunction bipolar transistor
0.312017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017
Optical networks
optical receiver
0.212023
SPICE Modeling in Verilog-A for Photo-Response in UTC-Photodiodes Targeting Beyond-5G Circuit Design · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Hardware reliability and fault tolerance
device reliability
0.112017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017
Integrated circuit design
semiconductor device modeling
0.112017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017

Methods — techniques the papers use, named apart from their topics

verilog-a · 1.3equivalent circuit modeling · 1.3thermal modeling · 0.3HF measurement · 0.3
YearPublicationVenuePosition
2023 SPICE Modeling in Verilog-A for Photo-Response in UTC-Photodiodes Targeting Beyond-5G Circuit Design
abstract
This article reports the first accurate and physics-based Verilog-A implementation of the fully analytic form of photocurrent in SPICE compact models for uni-traveling carrier (UTC) photodiodes (PDs). To overcome the limitations of single-pole network implementations for modeling frequency dependence of the photo-response, especially at frequencies beyond 100 GHz, we explored different solutions for the complete analytic equation of the dynamic photocurrent. A new implementation has been proposed which requires three additional nodes in the UTC-PD electrical equivalent circuit and offers the best tradeoff between accuracy and computational efficiency. Model validation has been performed against on-wafer measurements from two UTC-PD technologies depicting very good accuracy over the entire frequency range.
C. Mukherjee 0001, Djeber Guendouz, Marina Deng, H. Bertin, Antoine Bobin, Nicolas Vaissiere, Christophe Caillaud, Akshay M. Arabhavi, Rimjhim Chaudhary, Olivier Ostinelli, Colombo R. Bolognesi, Patrick Mounaix, Cristell Maneux
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.10
2017 Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications
abstract
This paper presents Si/SiGe:C and InP/GaAsSb HBTs which feature specific assets to address submillimeter-wave and THz applications. Process and modeling status and challenges are reviewed. The specific topics of thermal and substrate effects, reliability, and HF measurements are also discussed.
Pascal Chevalier 0002, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Bock, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, Christoph Jungemann, Rickard Lovblom, Cristell Maneux, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer
Proc. IEEE13