This paper describes the procedure and the software process to verify the feasibility of a system in package. The process has been created to guarantee and ensure the main characteristics of such devices: a minimum time-to-market and great flexibility. A procedure is described for every step, starting from application definition to final electrical analysis. After a general introduction, all process design steps are technically analyzed; then each step of the final process check is described. Some comments and wishes are discussed in the conclusion.

With reference to technological, architectural, and market considerations, the specific areas of design methodology and automation in flash memory design are analyzed in this paper. For each of the activities identified as critical, we show the design process key constraints and specifications, which drive the change in methodology, tools, and flows. We go through a brief survey of the solutions adopted in the recent past as well as the new emerging areas of intervention. The analysis covers: 1) design methodology, floorplanning, full-custom layout design and Rtl2Layout automation integration; 2) analog-digital mixed full-chip simulation and architectural exploration; 3) statistical analog circuital simulation; 4) mixed-signal design to test approaches; and 5) IC and package design integration.