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Thomas Zimmer

dblp:22/169 · DBLP profile ↗
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4ranked-venue papers
0as first author
0since 2021 · last 2017
0000-0002-4311-0969ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 88% Hardware reliability and fault tolerance · 12%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
analog and mixed-signal circuits
0.312017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017
Integrated circuit design › semiconductor devices
heterojunction bipolar transistor
0.312017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017
Hardware reliability and fault tolerance
device reliability
0.112017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017
Integrated circuit design
semiconductor device modeling
0.112017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications · Proc. IEEE 2017

Methods — techniques the papers use, named apart from their topics

thermal modeling · 0.3HF measurement · 0.3
YearPublicationVenuePosition
2017 Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications
abstract
This paper presents Si/SiGe:C and InP/GaAsSb HBTs which feature specific assets to address submillimeter-wave and THz applications. Process and modeling status and challenges are reviewed. The specific topics of thermal and substrate effects, reliability, and HF measurements are also discussed.
Pascal Chevalier 0002, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Bock, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, Christoph Jungemann, Rickard Lovblom, Cristell Maneux, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer
Proc. IEEE18
2015 Graphene FET evaluation for RF and mmWave circuit applications
abstract
This letter presents the characterisation of a GFET transistor with a source-pull/load-pull test bench. The characterisation shows that despite the good fTand fMAX, it is hard to achieve reasonable power gain using the GFET device in a circuit configuration. This is due to the very high impedance at the gate making impedance matching at the input extremely difficult. An electrical model is used to evaluate the optimum power gain of the transistor under matched conditions. In a second part, a benchmarking of the technology is realized through accurate simulation of an optimised GFET device. Based on this input data, a compact model permits the evaluation of the GFET for high frequency amplifications.
Sébastien Fregonese, Jorgue Daniel Aguirre Morales, Magali De Matos, Cristell Maneux, Thomas Zimmer
ISCAS5
2010 High Level Power and Energy Exploration Using ArchC
abstract
With the increase in the design complexity of MPSoC architectures, estimating power consumption is very complex and time consuming at lower level of abstraction. We propose a methodology using ArchC named Power-ArchC for a fast high-level estimation of processor power consumption. Power values are obtained by an instruction level power characterization at gate level. The requirements for power evaluation infrastructure are compatible processor models written in ArchC and RTL, and the Technology library. We show power results for a 32-bit MIPS processor with different benchmarks, based on 45nm technology.
Clement Bertolini, Olivier Héron, Nicolas Ventroux, Thomas Zimmer, François Marc
SBAC-PAD5
2005 An Analog Circuit Fault Characterization Methodology
Yvan Maidon, Thomas Zimmer, André Ivanov
J. Electron. Test.2