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Scott Denton

dblp:231/3554 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 2018
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%
Computer networks
1 paper
Optical networks · 100%

Topics — the 2 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design › photonic integrated circuits
silicon photonics		 0.312018
High-Volume Manufacturing Platform for Silicon Photonics · Proc. IEEE 2018
Optical networks › optical communication components
optical transceivers		 0.112018
High-Volume Manufacturing Platform for Silicon Photonics · Proc. IEEE 2018

Methods — techniques the papers use, named apart from their topics

monolithic integration · 0.7hybrid integration · 0.7
YearPublicationVenuePosition
2018 High-Volume Manufacturing Platform for Silicon Photonics
abstract
Hybrid integration of advanced CMOS electronics and a high-performing silicon photonics platform, combined with wafer-scale testing and assembly processes have enabled delivery of low-cost, low-power, high-performance, high-volume optical transceivers. In this paper, we will discuss the aspects of each of these factors that have been critical in achieving this success. In particular, we will focus on the silicon photonics process, device library and design kit, the innovative solutions for wafer-level testing and assembly of the optical transceivers, and discuss the benefits and drawbacks of monolithic and hybrid electronics-photonics integration and the impact on the roadmap of future optical transceivers.
Thierry Pinguet, Scott Denton, Steffen Gloeckner, Michael Mack, Gianlorenzo Masini, Attila Mekis, Simon Pang, Mark Peterson, Subal Sahni, Peter De Dobbelaere
 Proc. IEEE2